JPH03101523U - - Google Patents
Info
- Publication number
- JPH03101523U JPH03101523U JP1990009221U JP922190U JPH03101523U JP H03101523 U JPH03101523 U JP H03101523U JP 1990009221 U JP1990009221 U JP 1990009221U JP 922190 U JP922190 U JP 922190U JP H03101523 U JPH03101523 U JP H03101523U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- island portion
- semiconductor pellet
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体製造装置の平面図
である。第２図は半導体ペレツトをマウントした
リードフレームの斜視図、第３図は従来の半導体
装置の断面図である。
１……リードフレーム、２……フレーム、３…
…アイランド部、４……リード、４ａ……内端部
、５……タイバ、６……吊りピン、９……半導体
ペレツト、９ａ……電極、１０……ヒータブロツ
ク、１４……クランパ、１４ａ……窓部、１４ｂ
……突起。
FIG. 1 is a plan view of a semiconductor manufacturing apparatus according to the present invention. FIG. 2 is a perspective view of a lead frame on which a semiconductor pellet is mounted, and FIG. 3 is a sectional view of a conventional semiconductor device. 1...lead frame, 2...frame, 3...
... Island part, 4 ... Lead, 4a ... Inner end, 5 ... Tie bar, 6 ... Hanging pin, 9 ... Semiconductor pellet, 9a ... Electrode, 10 ... Heater block, 14 ... Clamper, 14a ...Window section, 14b
……protrusion.
Claims (1)
、アイランド部の周辺に多数本平行に配置したリ
ードを連結するフレーム及びタイバとを、吊りピ
ンによつて連結一体化したリードフレームを、ア
イランド部及びリードの内端部を露出させる窓部
を形成した枠状のクランパにより、ヒータブロツ
ク上に押圧固定し、半導体ペレツト上面の電極と
リードの内端部とを、ワイヤボンデイングする半
導体製造装置において、 上記クランパの吊りピン対応部位に窓部周縁よ
り内方へ突起を延設したことを特徴とする半導体
製造装置。[Scope of Claim for Utility Model Registration] A lead frame in which an island portion for mounting a semiconductor pellet, and a frame and tie bars for connecting a large number of leads arranged in parallel around the island portion are connected and integrated by a hanging pin. , a semiconductor pellet is pressed and fixed onto a heater block by a frame-shaped clamper having a window that exposes the island portion and the inner end of the lead, and wire bonding is performed between the electrode on the top surface of the semiconductor pellet and the inner end of the lead. A semiconductor manufacturing apparatus, characterized in that a protrusion extends inward from the periphery of the window at a portion of the clamper that corresponds to the hanging pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009221U JPH03101523U (en) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009221U JPH03101523U (en) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101523U true JPH03101523U (en) | 1991-10-23 |
Family
ID=31512825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009221U Pending JPH03101523U (en) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101523U (en) |
-
1990
- 1990-01-31 JP JP1990009221U patent/JPH03101523U/ja active Pending