JPH0173947U - - Google Patents
Info
- Publication number
- JPH0173947U JPH0173947U JP1987169558U JP16955887U JPH0173947U JP H0173947 U JPH0173947 U JP H0173947U JP 1987169558 U JP1987169558 U JP 1987169558U JP 16955887 U JP16955887 U JP 16955887U JP H0173947 U JPH0173947 U JP H0173947U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- semiconductor element
- adsorbing
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Description
第１図乃至第３図は本考案の一実施例を説明す
るための図である。
１…凸部、２…半導体素子用ダイ、３…半導体
素子、４…半田ペレツト、５…リードフレーム、
６…エミツタ電極用リード、７…ベース電極用リ
ード、８…吸着用パツド、９…ジヤンクシヨン・
コーテイング用樹脂、１０…タイバ、１１…半導
体装置。
1 to 3 are diagrams for explaining one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Convex part, 2... Die for semiconductor element, 3... Semiconductor element, 4... Solder pellet, 5... Lead frame,
6... Lead for emitter electrode, 7... Lead for base electrode, 8... Adsorption pad, 9... Junction pad.
Coating resin, 10... tie bar, 11... semiconductor device.
Claims (1)
てなる半導体装置において、 該半導体装置を吸着する吸着用パツドが上記リ
ードに形成されていることを特徴とする半導体装
置。[Claims for Utility Model Registration] A semiconductor device comprising a lead connected to a plurality of electrodes of a semiconductor element, characterized in that a suction pad for adsorbing the semiconductor device is formed on the lead. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169558U JPH0173947U (en) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169558U JPH0173947U (en) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173947U true JPH0173947U (en) | 1989-05-18 |
Family
ID=31459729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169558U Pending JPH0173947U (en) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173947U (en) |
-
1987
- 1987-11-05 JP JP1987169558U patent/JPH0173947U/ja active Pending