JPH0325241U - - Google Patents
Info
- Publication number
- JPH0325241U JPH0325241U JP8587289U JP8587289U JPH0325241U JP H0325241 U JPH0325241 U JP H0325241U JP 8587289 U JP8587289 U JP 8587289U JP 8587289 U JP8587289 U JP 8587289U JP H0325241 U JPH0325241 U JP H0325241U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- circuited
- cut
- short
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の半導体装置の斜視
図である。
１……半導体パツケージ、２……リード端子、
３……ハンダ・ブリツジ。
FIG. 1 is a perspective view of a semiconductor device according to an embodiment of the present invention. 1...Semiconductor package, 2...Lead terminal,
3... Handa Britsuji.
Claims (1)
端子間が、熱による切断可能な電気伝導材料によ
つて相互に短絡されていることを特徴とする半導
体装置。 A semiconductor device characterized in that a plurality of lead terminals led out to the outside of a package are short-circuited to each other by an electrically conductive material that can be cut by heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587289U JPH0325241U (en) | 1989-07-20 | 1989-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587289U JPH0325241U (en) | 1989-07-20 | 1989-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325241U true JPH0325241U (en) | 1991-03-15 |
Family
ID=31635222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8587289U Pending JPH0325241U (en) | 1989-07-20 | 1989-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325241U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009202397A (en) * | 2008-02-27 | 2009-09-10 | Japan Steel Works Ltd:The | Powder molding screw |
-
1989
- 1989-07-20 JP JP8587289U patent/JPH0325241U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009202397A (en) * | 2008-02-27 | 2009-09-10 | Japan Steel Works Ltd:The | Powder molding screw |