JPH024263U - - Google Patents
Info
- Publication number
- JPH024263U JPH024263U JP1988081807U JP8180788U JPH024263U JP H024263 U JPH024263 U JP H024263U JP 1988081807 U JP1988081807 U JP 1988081807U JP 8180788 U JP8180788 U JP 8180788U JP H024263 U JPH024263 U JP H024263U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit elements
- leads
- lead frame
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの上面図、第
２図は本考案のリードフレームを用い、組立ての
行つた場合の透視図、第３図は実施例２の上面図
である。
１……アイランド１、２……アイランド２、３
……インナーリード、４……アウターリード、５
……タツプ専用リード、６……タイバー、７……
封入樹脂、８……集積回路素子１、９……集積回
路素子２、１０……金属細線。
FIG. 1 is a top view of the lead frame of the present invention, FIG. 2 is a perspective view of the lead frame of the present invention after assembly, and FIG. 3 is a top view of Embodiment 2. 1...Island 1, 2...Island 2, 3
...Inner lead, 4...Outer lead, 5
...Tap dedicated lead, 6...Tie bar, 7...
Encapsulating resin, 8... integrated circuit elements 1, 9... integrated circuit elements 2, 10... thin metal wires.
Claims (1)
搭載部を有し、さらに集積回路素子間のボンデイ
ングを行う為のリードを個別に有し、このリード
はタイバーに接続されるも外部に導出されていな
いことを特徴とするリードフレーム。 It has multiple mounting parts for mounting multiple integrated circuit elements, and also has individual leads for bonding between integrated circuit elements, and these leads are connected to tie bars but are not led out to the outside. A lead frame that is not characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081807U JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081807U JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024263U true JPH024263U (en) | 1990-01-11 |
Family
ID=31306577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988081807U Pending JPH024263U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024263U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010598U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS5010597U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS52105910U (en) * | 1976-02-09 | 1977-08-12 | ||
| JPS55112585U (en) * | 1979-02-02 | 1980-08-07 | ||
| JPS5627407U (en) * | 1979-08-08 | 1981-03-14 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010967A (en) * | 1973-05-28 | 1975-02-04 | ||
| JPS5029163A (en) * | 1973-07-17 | 1975-03-25 |
-
1988
- 1988-06-20 JP JP1988081807U patent/JPH024263U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010967A (en) * | 1973-05-28 | 1975-02-04 | ||
| JPS5029163A (en) * | 1973-07-17 | 1975-03-25 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010598U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS5010597U (en) * | 1973-05-23 | 1975-02-03 | ||
| JPS52105910U (en) * | 1976-02-09 | 1977-08-12 | ||
| JPS55112585U (en) * | 1979-02-02 | 1980-08-07 | ||
| JPS625197Y2 (en) * | 1979-02-02 | 1987-02-05 | ||
| JPS5627407U (en) * | 1979-08-08 | 1981-03-14 |