JPH0178058U - - Google Patents
Info
- Publication number
- JPH0178058U JPH0178058U JP1987172071U JP17207187U JPH0178058U JP H0178058 U JPH0178058 U JP H0178058U JP 1987172071 U JP1987172071 U JP 1987172071U JP 17207187 U JP17207187 U JP 17207187U JP H0178058 U JPH0178058 U JP H0178058U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- reflecting mirror
- pellet
- optical semiconductor
- die island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例を示す一部断面立
面図、第２図は従来の装置を示す図。
１……リードフレーム、３……光半導体ペレツ
ト、４……ボンデイングワイヤ、１１……第１の
リード、１２……第２のリード、１３……反射鏡
を持つダイアイランド。なお、図中同一符号は同
一または相当部分を示す。
FIG. 1 is a partially sectional elevational view showing an embodiment of this invention, and FIG. 2 is a diagram showing a conventional device. DESCRIPTION OF SYMBOLS 1... Lead frame, 3... Optical semiconductor pellet, 4... Bonding wire, 11... First lead, 12... Second lead, 13... Die island having a reflecting mirror. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
光半導体のペレツトが固定されるダイアイランド
と、このダイアイランドに連結する第１のリード
と、この第１のリードに隣接し上記ペレツトから
のボンデイングワイヤが接続される第２のリード
とを含む光半導体用リードフレームにおいて、 上記すり鉢状の反射鏡が上記第２のリードに対
向する側でその反射鏡に切り欠き部を構成するこ
とによつて、上記第２のリードを上記ペレツトに
近接させ、上記ボンデイングワイヤの長さを短く
したことを特徴とする光半導体用リードフレーム
。[Claims for Utility Model Registration] A die island in which a mortar-shaped reflecting mirror is formed and an optical semiconductor pellet is fixed in the reflecting mirror, a first lead connected to the die island, and a first lead connected to the die island. A lead frame for an optical semiconductor including a second lead adjacent to the lead and to which a bonding wire from the pellet is connected, wherein the mortar-shaped reflecting mirror is cut into the reflecting mirror on the side facing the second lead. A lead frame for an optical semiconductor, characterized in that the second lead is brought close to the pellet and the length of the bonding wire is shortened by forming a cutout.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172071U JPH0178058U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172071U JPH0178058U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178058U true JPH0178058U (en) | 1989-05-25 |
Family
ID=31464062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987172071U Pending JPH0178058U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178058U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04165673A (en) * | 1990-10-30 | 1992-06-11 | Nec Corp | Solid-state image pick-up device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5546573A (en) * | 1978-09-30 | 1980-04-01 | Toshiba Corp | Electrode member for light emission device, method of fabricating the same and punch therefor |
| JPS58220480A (en) * | 1982-06-16 | 1983-12-22 | Toshiba Corp | Photosemiconductor device |
| JPS59224185A (en) * | 1983-06-03 | 1984-12-17 | Nec Corp | Semiconductor light emitting device |
-
1987
- 1987-11-12 JP JP1987172071U patent/JPH0178058U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5546573A (en) * | 1978-09-30 | 1980-04-01 | Toshiba Corp | Electrode member for light emission device, method of fabricating the same and punch therefor |
| JPS58220480A (en) * | 1982-06-16 | 1983-12-22 | Toshiba Corp | Photosemiconductor device |
| JPS59224185A (en) * | 1983-06-03 | 1984-12-17 | Nec Corp | Semiconductor light emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04165673A (en) * | 1990-10-30 | 1992-06-11 | Nec Corp | Solid-state image pick-up device |