JPS63202947A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To remove resin burrs among each lead section, and to reduce the abrasion of an edge section by forming each connecting section where adjacent to the end surface of a resin sealing body, shaping notches along both side sides on the root sides of each lead section and the internal side of a frame section to these connecting sections and forming notched holes at the noses of these notches. CONSTITUTION:Respective connectors 14 are shaped where adjacent to the side ends 9b of a resin sealing body 9. Notches 14a along both side sides on the root sides of each lead section 3 and the internal side of a frame section 5 and notched holes 14b at the noses of the notches 14 are formed to respective connectors 14. Since each connecting section 14 is adjoined to the positions of the side ends 9b of the resin sealing body 9 molded on resin sealing molding, a resin does not leak to void sections 6, no resin burr is shaped, and the resin burrs need not be cut and removed. Respective connectors 14 may be gotten rid of by cutting sections ahead of the notched holes 14b, a punch for removal and a die are not brought into contact with the burrs of the resin, into which a substance having high abrasiveness is mixed, and the connectors 14 are easily cut and taken off without being abraded.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a lead frame for a semiconductor device in which a die pad on which a semiconductor chip is attached and a large number of lead parts are formed, and in particular, the present invention relates to a lead frame for a semiconductor device in which a die pad on which a semiconductor chip is mounted and a large number of lead parts are formed, and in particular, a lead frame between the lead parts by resin sealing. Involved in preventing resin burrs.

[Conventional technology]

As a conventional lead frame of this type, there is one shown in FIG. 1 is a lead frame; 2 is a die pad to which a semiconductor chip is bonded; 3 is a large number of lead parts formed radially at intervals around the die pad, extending parallel to the longitudinal direction and having a narrow width at the tip end; 4 is a connecting portion that connects the intermediate portions of each lead portion 3 in the width direction, and 5 is a die pad 2. This is a frame portion that connects the connecting portion 4 and the tips of each lead portion 3 together. A space 6 is formed between each lead part 3 on the root side and between it and the frame part 5.

In the lead frame 1, as shown in FIG. 9, a semiconductor chip 8 such as an IC is bonded onto a guide pad 2, and an electrode of this chip 8 is wire-bonded to the rear end of each lead. The lead frame 1 in this state is placed in a resin sealing mold, and the semiconductor chip 8 portion is sealed by molding a resin sealant 9 . This state is shown in a plan view in FIG.

In this way, in the lead frame 1, there are no obstacles in the empty space 6 between each lead part 3, the connecting part 4, and the frame part 5 during resin sealing molding, so when the lead frame 1 is placed in the molding die, there is no gap. As shown in FIGS. 8 and 9, these empty spaces 6
The resin is poured out and filled, and the resin is filled.

Next, as shown in FIG.
Remove 9a. Finally, the frame portion 5 is cut and removed at portions A and B, and a resin-sealed semiconductor device with a large number of lead portions taken out from the resin-sealed body 9 is completed.

[Problem that the invention seeks to solve]

In the conventional lead frame 1 as described above, since a highly abrasive substance is mixed in the resin, the resin plate 99a
When removing, there is a problem in that the receiving part of the removing die and the cutting part of the punch are greatly worn, and the die and punch need to be replaced in a short period of time, increasing manufacturing costs.

This invention was made to solve these problems. It prevents resin burrs from forming between each lead part, makes it easy to remove the connection part between lead parts, and makes it possible to easily remove the connecting part between the lead parts. The object of the present invention is to obtain a free frame for semiconductor devices that reduces wear, can be used for a long period of time, and reduces manufacturing costs.

Means for Solving Problem c] In the lead frame for a semiconductor device according to the present invention, each connecting portion is located close to the end surface of the resin sealing body, and the root side of each lead portion is attached to these connecting portions. Notches are made along both sides of the frame and the inside edge of the frame, and cutout holes are provided at the tips of these cuts.

[Effect]

In this invention, since the connecting portion is close to the end face of the resin sealing body, the generation of resin burrs in the spaces between the lead portions is eliminated, and there is no need to remove the resin burr, and the connecting portion can be cut by cutting. It is removed only from the tip of the notch, without coming into contact with the removal punch, die, or resin beam, eliminating any wear caused by this.

〔Example〕

FIG. 1 shows an embodiment of a lead frame for a semiconductor device according to the present invention. 11 is a lead frame, die pad 2. Multiple lead parts 3. It consists of a connecting part 14 and a frame part 5 that connect these lead parts 3 in the width direction. Each connecting part 14
is provided at a position close to the side end 9b of the resin sealing body 9, as shown in FIG.

Returning to FIG. 1, as shown in the enlarged view in FIG. 2, each connecting portion 4 has a notch 14a along both sides of the root side of each lead portion 3 and an inner side of the frame portion 5. A notch hole 14b is provided at the tip of the cutout hole 14b.
serves as a relief during machining of the notch 14a. The cut 14a is a cut without a gap.

In the lead frame 11 formed as described above, the semiconductor chip 8 is die-bonded onto the die pad and wire-bonded to the rear end of each lead portion 3, as shown in FIG. The lead frame 11 in this state is placed in a resin molding mold, and the semiconductor chip 8 portion is sealed by molding a resin molding body 9 . This state is shown in FIG.

In this way, during resin sealing molding, each connecting portion 14 is close to the side 4Hb position of the resin sealing body 9 to be molded, and the fourth
As shown in FIG. 5, there is almost no resin leakage into the empty Wrfae, and resin burrs are not formed, so there is no need to cut and remove them.

In addition, each connecting portion 14 can be removed by cutting the tip from the notch hole 14b, so that the removal punch or die does not come into contact with the resin burr mixed with highly abrasive substances, and the wear caused by it is avoided. The connecting portion 14 can be easily cut and removed without being hit.

FIG. 6 shows the lead frame from which the connecting portions 14 have been removed in this manner. The frame portion 6 is cut and removed at portions A and B, and a resin-sealed semiconductor device with a large number of leads extending from the resin-sealed body 9 is completed. cutout hole 1
Although 4b is circular, it may be triangular, square, or oval.

〔Effect of the invention〕

As described above, according to the present invention, each connecting portion is positioned close to the end face of the resin sealing body, and a wire is attached to each connecting portion along both sides of the root side of each lead and along the inner side of the frame portion. Since notches are made and notched holes are provided at the tips of these notches, a resin gap 9 is not formed in the space between the two parts, and the punch is used for removing the connecting part.

The die does not come into contact with the resin beam, the connecting portion can be easily cut and removed, the resin does not cause wear, and it can be used for a long time, reducing manufacturing costs.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a lead frame for a semiconductor device according to the present invention, FIG. 2 is an enlarged view of the connecting portion of FIG. 1, and FIG. 3 is a resin molding of the semiconductor chip portion of the lead frame of FIG. FIG. 4 is a sectional view of the lead frame in the state shown in FIG. 3, FIG. 5 is an enlarged sectional view of the connecting portion in FIG. 4, and FIG. FIG. 7 is a plan view of a conventional lead frame, and FIG. 8 is a plan view of the lead frame with the connecting portion removed, and FIG. 8 is a state in which the semiconductor chip portion of the lead frame shown in FIG. 9 is a cross-sectional view of the laminated frame in the state shown in FIG. 8,
FIG. 10 is a plan view showing the state of the lead frame shown in FIG. 8 with the connecting portion removed. 2... Die pad, 3... Lead part, 5... Frame part, 9... Resin sealing body, 9b... Side end, 11... Lead frame, 14... Connection part, 14a...notch, 14b...notch hole. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A die pad, a plurality of lead portions disposed at intervals on the die pad and extending in the longitudinal direction with each end side parallel to the die pad, a connecting portion connecting the intermediate portions of these lead portions in the width direction, and the die pad. In a lead frame consisting of a frame portion integrally connected to and held by the ends of the connecting portions on both sides and the tips of the respective lead portions, each of the connecting portions is connected to the side ends of the resin sealing body to be molded. placed in close proximity,
For a semiconductor device, wherein a notch is provided along both sides from the root side of each of the leads, and a notch is provided along the inner side of the frame portion, and a cutout hole is provided at the tip of each of the notches. Lead frame.