JPH01312866A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To increase the density of arrangement of leads and shorten bonding wire length by alternately arranging first and second leads, the former having a longer distance between an inner lead tip part and an island part than the later. CONSTITUTION:The tip end part of an inner lead 1 comprises a first inner lead tip end part located at a first distance near a pellet 3 and a second inner lead tip end part located at a second distance far from the pellet. Those first and second inner lead tip end parts are alternately arranged. Such an alternate arrangement of the leads each with shorter and longer distance from the pellet reduces bonding wire length and improve arrangement density of inner leads.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for a semiconductor device, and more particularly to a lead frame for a semiconductor device having a characteristic shape in the shape of an inner lead portion.

[Conventional technology]

Conventionally, in this type of lead frame for a semiconductor device, the inner leads are arranged in a line so that the lead tips are at a substantially constant distance from the periphery of the pellet 9, as shown in FIG. It was getting worse.

[Problem to be solved by the invention]

In the conventional lead frame for a semiconductor device described above, the lead tips are aligned in a line in the inner lead portion, so a certain length of bonding wire is required.

Another drawback is that the arrangement density of the inner leads is low.

[Means to solve the problem]

A lead frame for a semiconductor device according to the present invention has a first lead having a long distance between an inner lead tip of the lead frame and the island part, and a second lead having a short distance between the inner lead tip of the lead frame and the island part. It is characterized by that the leads are arranged alternately.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of one embodiment of the present invention. The tip of the inner lead 1 is a first inner lead tip that is closer to the pellet, and a second inner lead tip that is farther from the pellet.
The tip of the second inner lead is located at a distance of . The first inner lead tip portions and the second inner lead tip portions are arranged alternately.

FIG. 2 is a plan view of another embodiment of the invention.

In this example, the lead tips of every two inner leads are arranged long, which increases the arrangement density of the leads in a part of the corner of the island, and also allows the length of the bonding wire to be shortened at the protruding lead tips. There are advantages.

〔Effect of the invention〕

As explained above, the present invention reduces the length of the bonding wire by alternately arranging the distances between the lead tips of the inner lead portion of the lead frame and the pellets to be closer and farther apart. This has the effect of making it possible to improve the arrangement density.

[Brief explanation of the drawing]

FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is a plan view of another embodiment of the present invention, and FIG. 3 is a plan view of a conventional lead frame. 1.4.7・・・Inner lead, 2.5°8・
...Island, 3,6.9...Berrett. Agent Patent Attorney Uchihara Oto $ 1 Broom 3 Closed

Claims (1)

[Claims] In a lead frame for a semiconductor device having an island portion on which a semiconductor element is mounted, first leads having a long distance between the inner lead tip portion of the lead frame and the island portion and second leads having a short distance are alternately arranged. A lead frame for semiconductor devices characterized by: