JPS5764956A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5764956A
JPS5764956A JP14133980A JP14133980A JPS5764956A JP S5764956 A JPS5764956 A JP S5764956A JP 14133980 A JP14133980 A JP 14133980A JP 14133980 A JP14133980 A JP 14133980A JP S5764956 A JPS5764956 A JP S5764956A
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
parts
constitution
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14133980A
Other languages
Japanese (ja)
Inventor
Kihachiro Izeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14133980A priority Critical patent/JPS5764956A/en
Publication of JPS5764956A publication Critical patent/JPS5764956A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To save deflashing work of a semiconductor device by a method wherein a lead frame being provided with crushed parts at lead parts is used. CONSTITUTION:Flatly crushed parts 7 are provided at the neighborhood of boundary where leads 3 for leading outside are to be led out outside from the inside of a resin 5. By this constitution, the end edge of upper face of the lead is a rectangle and has no roundness, and no gap is generated between a metal mold for molding and the lead. Accordingly no resin is oozed out when sealing is to be performed, therefore flash is not generated therein.
JP14133980A 1980-10-09 1980-10-09 Semiconductor device Pending JPS5764956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14133980A JPS5764956A (en) 1980-10-09 1980-10-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14133980A JPS5764956A (en) 1980-10-09 1980-10-09 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5764956A true JPS5764956A (en) 1982-04-20

Family

ID=15289650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14133980A Pending JPS5764956A (en) 1980-10-09 1980-10-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5764956A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943560A (en) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp Lead frame for semiconductor device
JPH01220466A (en) * 1988-02-26 1989-09-04 Mitsui High Tec Inc Lead frame and manufacture of semiconductor device using the same lead frame
JPH02148815A (en) * 1988-11-30 1990-06-07 Hitachi Condenser Co Ltd Molded chip electronic component
JPH02202045A (en) * 1989-01-31 1990-08-10 Mitsui High Tec Inc Manufacture of lead frame
JP2010056372A (en) * 2008-08-29 2010-03-11 Sanyo Electric Co Ltd Resin sealed semiconductor device, and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943560A (en) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp Lead frame for semiconductor device
JPH01220466A (en) * 1988-02-26 1989-09-04 Mitsui High Tec Inc Lead frame and manufacture of semiconductor device using the same lead frame
JPH02148815A (en) * 1988-11-30 1990-06-07 Hitachi Condenser Co Ltd Molded chip electronic component
JPH02202045A (en) * 1989-01-31 1990-08-10 Mitsui High Tec Inc Manufacture of lead frame
JP2010056372A (en) * 2008-08-29 2010-03-11 Sanyo Electric Co Ltd Resin sealed semiconductor device, and method of manufacturing the same
US8648452B2 (en) 2008-08-29 2014-02-11 Sanyo Semiconductor Co., Ltd. Resin molded semiconductor device and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JPS5764956A (en) Semiconductor device
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS57117935A (en) Molding structure for synthetic resin molding
JPS5380969A (en) Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS53124075A (en) Manufacture of resin sealing type semiconductor device and metal mold used for said manufacture
JPS5522873A (en) Manufacturing method of resin sealing semiconductor device
JPS5558557A (en) Resin mold type electronic component and lead frame used therefor
JPS5664458A (en) Metallic body
JPS5228869A (en) Process for molding and the mold and heat-radiation header for the pro cess
JPS5298472A (en) Lead frame for resin molding
JPS562642A (en) Device for forming resin-sealed semiconductor device
JPS5720437A (en) Resin sealing metal mold for semiconductor device
JPS6450454A (en) Manufacture of lead frame and semiconductor device
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS57178352A (en) Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JPS5669852A (en) Lead frame for semiconductor device
JPS5275180A (en) Package for integrated circuits
JPS6458318A (en) Method for forming seal lip of filter element
JPS55157235A (en) Manufacture of semiconductor integrated circuit
JPS5242372A (en) Process for production of semiconductor device
JPS5756911A (en) Manufacture of stabilizer for discharge lamp
JPS54107261A (en) Production of resin seal-type semiconductor device and lead frame used in this production
JPS55139241A (en) Resin molding machine of substrate
JPS55147939A (en) Molded motor
JPS53104171A (en) Mold for semiconductor device