JPS5669852A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5669852A
JPS5669852A JP14574279A JP14574279A JPS5669852A JP S5669852 A JPS5669852 A JP S5669852A JP 14574279 A JP14574279 A JP 14574279A JP 14574279 A JP14574279 A JP 14574279A JP S5669852 A JPS5669852 A JP S5669852A
Authority
JP
Japan
Prior art keywords
resin
edge
piece
linking
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14574279A
Other languages
Japanese (ja)
Inventor
Tamotsu Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14574279A priority Critical patent/JPS5669852A/en
Publication of JPS5669852A publication Critical patent/JPS5669852A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To extend the life of punching die by coinciding the edge of linking pieces on the setting side of the semiconductor chip with the outer edge of the sealing resin, and forming a narrow part in each linking piece. CONSTITUTION:The edge 3e of the linking piece 3 is coincided with the outer edge 6b of the sealing resin 6. Since the space 5 between external leads 2 is included in a resin 6, and the resin does not flow out, so that it is not cut out. In order to remove linking piece 3, a jig is inserted into a hole 3d in a protruded piece 3c of the narrow portion 3b and the hole is expanded. In this constitution, the life of the jig is extended and the cost can be reduced.
JP14574279A 1979-11-09 1979-11-09 Lead frame for semiconductor device Pending JPS5669852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14574279A JPS5669852A (en) 1979-11-09 1979-11-09 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14574279A JPS5669852A (en) 1979-11-09 1979-11-09 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5669852A true JPS5669852A (en) 1981-06-11

Family

ID=15392090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14574279A Pending JPS5669852A (en) 1979-11-09 1979-11-09 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5669852A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127356A (en) * 1982-01-26 1983-07-29 Nippon Texas Instr Kk Resin sealing of semiconductor integrated circuit and lead frame used for the same
JPS6263458A (en) * 1985-09-13 1987-03-20 Nec Corp Lead frame for semiconductor device
JPS62200749A (en) * 1986-02-28 1987-09-04 Nec Kyushu Ltd Lead frame
JPS6310567U (en) * 1986-07-08 1988-01-23

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127356A (en) * 1982-01-26 1983-07-29 Nippon Texas Instr Kk Resin sealing of semiconductor integrated circuit and lead frame used for the same
JPS6347270B2 (en) * 1982-01-26 1988-09-21 Nippon Tekisasu Insutsurumentsu Kk
JPS6263458A (en) * 1985-09-13 1987-03-20 Nec Corp Lead frame for semiconductor device
JPS62200749A (en) * 1986-02-28 1987-09-04 Nec Kyushu Ltd Lead frame
JPS6310567U (en) * 1986-07-08 1988-01-23
JPH0521887Y2 (en) * 1986-07-08 1993-06-04

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