JPS556840A - Optical semiconductor device and resin sealing method of the same - Google Patents

Optical semiconductor device and resin sealing method of the same

Info

Publication number
JPS556840A
JPS556840A JP7897678A JP7897678A JPS556840A JP S556840 A JPS556840 A JP S556840A JP 7897678 A JP7897678 A JP 7897678A JP 7897678 A JP7897678 A JP 7897678A JP S556840 A JPS556840 A JP S556840A
Authority
JP
Japan
Prior art keywords
semiconductor device
mold
optical semiconductor
contact surface
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7897678A
Other languages
Japanese (ja)
Other versions
JPS6114658B2 (en
Inventor
Hirokazu Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7897678A priority Critical patent/JPS556840A/en
Publication of JPS556840A publication Critical patent/JPS556840A/en
Publication of JPS6114658B2 publication Critical patent/JPS6114658B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prevent a mark of the contact surface of a mold from appearing on the head of an optical semiconductor device by checking the contact surface from reaching the head in the resin sealing of the semiconductor device.
CONSTITUTION: A fixing plate for a lead frame 34 previously wire-bonded having a pin attached thereto for positioning thereof is mounted to a lower mold of a resin sealing mold comprising an uppor mold and the lower mold. The side of the plate 33 makes a part of the bottom of a cavity. An epoxy resin is injected into the cavity 37 from a resin runner 35 through a gate 38. The joining of the cavity is made avoiding the contact surface from meeting the spherical section. With such an arrangement, the mark of the contact surface of the mold can be checked from appearing on the head of an optical semiconductor device, thereby improving the appearance.
COPYRIGHT: (C)1980,JPO&Japio
JP7897678A 1978-06-28 1978-06-28 Optical semiconductor device and resin sealing method of the same Granted JPS556840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7897678A JPS556840A (en) 1978-06-28 1978-06-28 Optical semiconductor device and resin sealing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7897678A JPS556840A (en) 1978-06-28 1978-06-28 Optical semiconductor device and resin sealing method of the same

Publications (2)

Publication Number Publication Date
JPS556840A true JPS556840A (en) 1980-01-18
JPS6114658B2 JPS6114658B2 (en) 1986-04-19

Family

ID=13676920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7897678A Granted JPS556840A (en) 1978-06-28 1978-06-28 Optical semiconductor device and resin sealing method of the same

Country Status (1)

Country Link
JP (1) JPS556840A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059531U (en) * 1983-09-28 1985-04-25 有限会社ティ・アンド・ケイ・インターナショナル研究所 Mold for resin encapsulation of light emitting diodes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059531U (en) * 1983-09-28 1985-04-25 有限会社ティ・アンド・ケイ・インターナショナル研究所 Mold for resin encapsulation of light emitting diodes
JPS6317250Y2 (en) * 1983-09-28 1988-05-16

Also Published As

Publication number Publication date
JPS6114658B2 (en) 1986-04-19

Similar Documents

Publication Publication Date Title
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS6457738A (en) Package for semiconductor device
JPS556840A (en) Optical semiconductor device and resin sealing method of the same
JPS56103483A (en) Manufacture of semiconductor device for photoelectric conversion
JPS5558557A (en) Resin mold type electronic component and lead frame used therefor
JPS55160449A (en) Semiconductor device
GB9121541D0 (en) Encapsulating semiconductor devices
JPS5664446A (en) Method of molding synthetic resin insert for metal terminal, metal terminal and mold
JPS56167336A (en) Manufacture of resin-sealed type module
JPS6469019A (en) Method of sealing light-emitting diode with resin
JPS57128931A (en) Resin sealing for semiconductor device
JPS57211259A (en) Semiconductor device
JPS645022A (en) Resin sealing method for optical semiconductor device
JPS53104171A (en) Mold for semiconductor device
JPS54136621A (en) Manufacture of resin-cast transformer
JPS5830673Y2 (en) transfer mold mold
JPS6447035A (en) Manufacture of optical semiconductor device
JPS5613738A (en) Manufacture of semiconductor device
JPS53149765A (en) Metal mold for semiconductor device
JPS5387173A (en) Molding mold
JPS53147765A (en) Resin injection molding
JPS57170542A (en) Semiconductor device
JPS5799748A (en) Metal mold for resin sealing in semiconductor device
JPS642329A (en) Resin sealing metallic mold
JPS6454752A (en) Pin grid array semiconductor package