JPS556840A - Optical semiconductor device and resin sealing method of the same - Google Patents
Optical semiconductor device and resin sealing method of the sameInfo
- Publication number
- JPS556840A JPS556840A JP7897678A JP7897678A JPS556840A JP S556840 A JPS556840 A JP S556840A JP 7897678 A JP7897678 A JP 7897678A JP 7897678 A JP7897678 A JP 7897678A JP S556840 A JPS556840 A JP S556840A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mold
- optical semiconductor
- contact surface
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent a mark of the contact surface of a mold from appearing on the head of an optical semiconductor device by checking the contact surface from reaching the head in the resin sealing of the semiconductor device.
CONSTITUTION: A fixing plate for a lead frame 34 previously wire-bonded having a pin attached thereto for positioning thereof is mounted to a lower mold of a resin sealing mold comprising an uppor mold and the lower mold. The side of the plate 33 makes a part of the bottom of a cavity. An epoxy resin is injected into the cavity 37 from a resin runner 35 through a gate 38. The joining of the cavity is made avoiding the contact surface from meeting the spherical section. With such an arrangement, the mark of the contact surface of the mold can be checked from appearing on the head of an optical semiconductor device, thereby improving the appearance.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7897678A JPS556840A (en) | 1978-06-28 | 1978-06-28 | Optical semiconductor device and resin sealing method of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7897678A JPS556840A (en) | 1978-06-28 | 1978-06-28 | Optical semiconductor device and resin sealing method of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS556840A true JPS556840A (en) | 1980-01-18 |
JPS6114658B2 JPS6114658B2 (en) | 1986-04-19 |
Family
ID=13676920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7897678A Granted JPS556840A (en) | 1978-06-28 | 1978-06-28 | Optical semiconductor device and resin sealing method of the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556840A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059531U (en) * | 1983-09-28 | 1985-04-25 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | Mold for resin encapsulation of light emitting diodes |
-
1978
- 1978-06-28 JP JP7897678A patent/JPS556840A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059531U (en) * | 1983-09-28 | 1985-04-25 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | Mold for resin encapsulation of light emitting diodes |
JPS6317250Y2 (en) * | 1983-09-28 | 1988-05-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS6114658B2 (en) | 1986-04-19 |
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