JPS6059531U - Mold for resin encapsulation of light emitting diodes - Google Patents

Mold for resin encapsulation of light emitting diodes

Info

Publication number
JPS6059531U
JPS6059531U JP15008983U JP15008983U JPS6059531U JP S6059531 U JPS6059531 U JP S6059531U JP 15008983 U JP15008983 U JP 15008983U JP 15008983 U JP15008983 U JP 15008983U JP S6059531 U JPS6059531 U JP S6059531U
Authority
JP
Japan
Prior art keywords
mold
light emitting
cavity
emitting diodes
resin encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15008983U
Other languages
Japanese (ja)
Other versions
JPS6317250Y2 (en
Inventor
道男 長田
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP15008983U priority Critical patent/JPS6059531U/en
Publication of JPS6059531U publication Critical patent/JPS6059531U/en
Application granted granted Critical
Publication of JPS6317250Y2 publication Critical patent/JPS6317250Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の発光ダイオードの樹脂封入成形品を示
す一部切欠平面図、第２図は、該従来成形品の樹脂成形
用金型における下型要部の平面図である。第３図乃至第
５図は本考案の実施例を示すものであり、第３図のＩ及
び■は、そのニラ割金型及び三ツ割金型例を夫々示して
いる。第４図は三ツ割金型例における下型要部の平面図
、第５図は本考案金型により成形された発光ダイオード
の樹脂封入成形品を示す一部切欠平面図である。　　　
　　。 １・・・上型、２・・・下型、３１・３□・３３・３４
・・・胴部キャビティ、４１・４□・４３・・・頭部キ
ャビティ、１５・・・透明樹脂体、１５１・・・頭部、
１５□・・・胴部。　　−FIG. 1 is a partially cutaway plan view showing a conventional resin-filled molded product of a light emitting diode, and FIG. 2 is a plan view of a main part of the lower mold of a resin molding die for the conventional molded product. FIGS. 3 to 5 show examples of the present invention, and I and ■ in FIG. 3 show examples of a leek-split mold and a three-split mold, respectively. FIG. 4 is a plan view of the main part of the lower mold in an example of a three-split mold, and FIG. 5 is a partially cutaway plan view showing a resin-filled molded product of a light emitting diode molded by the mold of the present invention.
. 1... Upper mold, 2... Lower mold, 31.3□.33.34
... body cavity, 41, 4□, 43... head cavity, 15... transparent resin body, 151... head,
15□... Torso. −

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 球面状の頭部キャビティと、該キャビティに連通させた
胴部キャビティとから成る発光ダイオードの樹脂封入成
形用キャビティ部を有する金型において、上記頭部キャ
ビティを円弧球面形状に形成すると共に、該頭部キャビ
ティの近接位置となる胴部キャビティに、溶融樹脂の注
入用ゲートを開口して構成したことを特徴とする発光ダ
イオードの樹脂封入成形用金型。In a mold having a cavity portion for resin-filled molding of a light emitting diode, which is composed of a spherical head cavity and a body cavity communicating with the cavity, the head cavity is formed into an arcuate spherical shape, and the head cavity is formed into an arcuate spherical shape. 1. A mold for resin-filled molding of a light emitting diode, characterized in that a gate for injecting molten resin is opened in a body cavity located close to a body cavity.
JP15008983U 1983-09-28 1983-09-28 Mold for resin encapsulation of light emitting diodes Granted JPS6059531U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15008983U JPS6059531U (en) 1983-09-28 1983-09-28 Mold for resin encapsulation of light emitting diodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15008983U JPS6059531U (en) 1983-09-28 1983-09-28 Mold for resin encapsulation of light emitting diodes

Publications (2)

Publication Number Publication Date
JPS6059531U true JPS6059531U (en) 1985-04-25
JPS6317250Y2 JPS6317250Y2 (en) 1988-05-16

Family

ID=30332980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15008983U Granted JPS6059531U (en) 1983-09-28 1983-09-28 Mold for resin encapsulation of light emitting diodes

Country Status (1)

Country Link
JP (1) JPS6059531U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108144A (en) * 1998-10-06 2000-04-18 Taiyo Ltd Manufacture of parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556840A (en) * 1978-06-28 1980-01-18 Nec Corp Optical semiconductor device and resin sealing method of the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556840A (en) * 1978-06-28 1980-01-18 Nec Corp Optical semiconductor device and resin sealing method of the same

Also Published As

Publication number Publication date
JPS6317250Y2 (en) 1988-05-16

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