JPS59152737U - Mold for resin molding of electronic parts - Google Patents

Mold for resin molding of electronic parts

Info

Publication number
JPS59152737U
JPS59152737U JP4571083U JP4571083U JPS59152737U JP S59152737 U JPS59152737 U JP S59152737U JP 4571083 U JP4571083 U JP 4571083U JP 4571083 U JP4571083 U JP 4571083U JP S59152737 U JPS59152737 U JP S59152737U
Authority
JP
Japan
Prior art keywords
mold
resin molding
runner
electronic parts
injection part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4571083U
Other languages
Japanese (ja)
Inventor
大浦　雅広
Original Assignee
日本インタ−ナショナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナショナル整流器株式会社 filed Critical 日本インタ−ナショナル整流器株式会社
Priority to JP4571083U priority Critical patent/JPS59152737U/en
Publication of JPS59152737U publication Critical patent/JPS59152737U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の電子部品の樹脂モールド用金型の概略
構成を示す平面図、第２図は、上記金型に樹脂を充填し
加圧した状態の一部切欠断面図、第３図は、上記金型か
ら取り出した樹脂成形体の平面図、第４図は、上記金型
の要部拡大図、第５図は、本考案に係る樹脂モールド用
金型の概略構成を示す平面図である。 ２１・・・樹脂注入部、３１・・・メインランナ部、４
０．４１・・・サブランナ部、４１ｂ・・・接続端。　
　　　　　−”−第　３　図Fig. 1 is a plan view showing a schematic configuration of a conventional resin molding die for electronic components, Fig. 2 is a partially cutaway cross-sectional view of the above-mentioned die filled with resin and pressurized, and Fig. 3. is a plan view of the resin molded body taken out from the mold, FIG. 4 is an enlarged view of the main parts of the mold, and FIG. 5 is a plan view showing the schematic configuration of the mold for resin molding according to the present invention. It is. 21... Resin injection part, 31... Main runner part, 4
0.41...Subrunner part, 41b...Connection end.
−”−Figure 3

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂注入部と、この注入部に連結されたメインランチ部
と、このメインランナ部から分岐する複数のサブランナ
部を有するものにおいて、前記注入部に最も近接する前
記サブランナ部の前記メインランチ部への接続端を前記
注入部に沿ってわん曲させて接続し、前記注入部から直
接導出される前記サブランナ部が存在しないことを特徴
とする電子部品の樹脂モールド用金型。In the resin injection part, a main launch part connected to the injection part, and a plurality of sub-runner parts branching from the main runner part, the sub-runner part closest to the injection part is connected to the main launch part. A mold for resin molding an electronic component, characterized in that the connecting end is connected by being curved along the injection part, and the sub-runner part that is directly led out from the injection part does not exist.
JP4571083U 1983-03-31 1983-03-31 Mold for resin molding of electronic parts Pending JPS59152737U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4571083U JPS59152737U (en) 1983-03-31 1983-03-31 Mold for resin molding of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4571083U JPS59152737U (en) 1983-03-31 1983-03-31 Mold for resin molding of electronic parts

Publications (1)

Publication Number Publication Date
JPS59152737U true JPS59152737U (en) 1984-10-13

Family

ID=30176241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4571083U Pending JPS59152737U (en) 1983-03-31 1983-03-31 Mold for resin molding of electronic parts

Country Status (1)

Country Link
JP (1) JPS59152737U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101858A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Mold

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101858A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Mold

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