JPS6322748U - - Google Patents
Info
- Publication number
- JPS6322748U JPS6322748U JP11722486U JP11722486U JPS6322748U JP S6322748 U JPS6322748 U JP S6322748U JP 11722486 U JP11722486 U JP 11722486U JP 11722486 U JP11722486 U JP 11722486U JP S6322748 U JPS6322748 U JP S6322748U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- recess
- semiconductor device
- lead frame
- hybrid semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000008602 contraction Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案に係る樹脂封止型半導体
装置の一実施例の上面図及び同図ａのＡ―Ａ′断
面図、第２図は従来例の上面図、第３図は従来の
回路構成例である。
１：リードフレーム、１ａ〜１ｄ：リード部、
２：樹脂、７：凹部、８：デイスクリート部品。
1A and 1B are a top view of an embodiment of a resin-sealed semiconductor device according to the present invention and a sectional view taken along line AA' in FIG. 1A, FIG. 2 is a top view of a conventional example, and FIG. This is an example of a conventional circuit configuration. 1: Lead frame, 1a to 1d: Lead part,
2: Resin, 7: Recess, 8: Discrete parts.
Claims (1)
を配置した樹脂封止型ハイブリツド半導体装置で
あつて、樹脂モールド部に、前記構成部材のうち
モールド時の熱或いは熱収縮に耐えられない部品
を配置すべき位置に、前記リードフレームまで達
する凹部を形成してなり、該凹部に前記部品を搭
載したことを特徴とする樹脂封止型ハイブリツド
半導体装置。 A resin-sealed hybrid semiconductor device in which electrically functional components are arranged on a lead frame, in which parts of the components that cannot withstand heat or thermal contraction during molding are arranged in the resin mold part. 1. A resin-sealed hybrid semiconductor device, characterized in that a recess is formed at a position that reaches the lead frame, and the component is mounted in the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11722486U JPS6322748U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11722486U JPS6322748U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322748U true JPS6322748U (en) | 1988-02-15 |
Family
ID=31002539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11722486U Pending JPS6322748U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322748U (en) |
-
1986
- 1986-07-29 JP JP11722486U patent/JPS6322748U/ja active Pending