JPH0167046U - - Google Patents

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Publication number
JPH0167046U
JPH0167046U JP1987161533U JP16153387U JPH0167046U JP H0167046 U JPH0167046 U JP H0167046U JP 1987161533 U JP1987161533 U JP 1987161533U JP 16153387 U JP16153387 U JP 16153387U JP H0167046 U JPH0167046 U JP H0167046U
Authority
JP
Japan
Prior art keywords
conduction layer
heat conduction
insulating substrate
heat
provided under
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987161533U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161533U priority Critical patent/JPH0167046U/ja
Publication of JPH0167046U publication Critical patent/JPH0167046U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この考案の一実施例によるサーマル
ヘツドを示す要部断面図、第2図は従来のサーマ
ルヘツドを示す要部断面図である。 図において、1は絶縁基板、2は低熱伝導層、
3は発熱素子、4は放熱板、5は凹部である。な
お、図中同一符号は同一、または相当部分を示す
FIG. 1 is a sectional view of a main part of a thermal head according to an embodiment of this invention, and FIG. 2 is a sectional view of a main part of a conventional thermal head. In the figure, 1 is an insulating substrate, 2 is a low thermal conductive layer,
3 is a heating element, 4 is a heat sink, and 5 is a recess. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】 表面に発熱素子を有する低熱伝導層と、 上記低熱伝導層の下に設けられ、上記低熱伝導
層を介して上記発熱素子と対向する位置の裏側に
凹部を設けた絶縁基板と、 上記絶縁基板の下に設けられた、上記発熱素子
から伝わる熱を放散する放熱板と、 を具備するサーマルヘツド。
[Claims for Utility Model Registration] A low heat conduction layer having a heat generating element on its surface; and a recess provided under the low heat conduction layer and facing the heat generating element through the low heat conduction layer. A thermal head comprising: an insulating substrate; and a heat sink dissipating heat transmitted from the heating element, provided under the insulating substrate.
JP1987161533U 1987-10-21 1987-10-21 Pending JPH0167046U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161533U JPH0167046U (en) 1987-10-21 1987-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161533U JPH0167046U (en) 1987-10-21 1987-10-21

Publications (1)

Publication Number Publication Date
JPH0167046U true JPH0167046U (en) 1989-04-28

Family

ID=31444552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161533U Pending JPH0167046U (en) 1987-10-21 1987-10-21

Country Status (1)

Country Link
JP (1) JPH0167046U (en)

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