JPS6447096U - - Google Patents

Info

Publication number
JPS6447096U
JPS6447096U JP14145587U JP14145587U JPS6447096U JP S6447096 U JPS6447096 U JP S6447096U JP 14145587 U JP14145587 U JP 14145587U JP 14145587 U JP14145587 U JP 14145587U JP S6447096 U JPS6447096 U JP S6447096U
Authority
JP
Japan
Prior art keywords
heat
hybrid integrated
heat sink
integrated device
detection element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14145587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14145587U priority Critical patent/JPS6447096U/ja
Publication of JPS6447096U publication Critical patent/JPS6447096U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る混成集積装置の構成を概
略的に示す平面図、第2図は第1図A―A
上における部分断面図、第3図は本考案に係る混
成集積装置の別の実施例における部分断面図、第
4図は従来の混成集積装置の構成を概略的に示す
平面図、第5図は第4図A―A線上における
部分断面図、第6図は従来の別の混成集積装置の
構成を概略的に示す平面図、第7図は第6図A
―A線上における部分断面図である。 1……基板、2……発熱素子、4……熱検出素
子、7……ヒートシンク。
FIG. 1 is a plan view schematically showing the configuration of a hybrid integration device according to the present invention, FIG. 2 is a partial cross-sectional view taken along line A 1 - A 1 in FIG. FIG. 4 is a plan view schematically showing the configuration of a conventional hybrid integrated device; FIG. 5 is a partial sectional view taken along line A 2 - A 2 in FIG. 4; FIG. 7 is a plan view schematically showing the configuration of another conventional hybrid integration device, and FIG. 6A 3
- It is a partial sectional view on line A3 . 1...Substrate, 2...Heating element, 4...Heat detection element, 7...Heat sink.

Claims (1)

【実用新案登録請求の範囲】 (1) 混成集積回路用の基板上にこの基板よりも
熱伝導率の高いヒートシンクを備え、前記ヒート
シンクの上に発熱を伴う素子と熱検出素子とを備
えることを特徴とする混成集積装置。 (2) 前記発熱を伴う素子及び前記熱検出素子は
、前記ヒートシンクの同一面上に設けたことを特
徴とする実用新案登録請求の範囲第1項に記載の
混成集積装置。 (3) 前記ヒートシンクは、金属部材でなること
を特徴とする実用新案登録請求の範囲第1項また
は第2項に記載の混成集積装置。 (4) 前記発熱を伴う素子及び前記熱検出素子の
少なくとも一方と、前記ヒートシンクとの間に電
気絶縁膜があることを特徴とする実用新案登録請
求の範囲第3項に記載の混成集積装置。 (5) 前記熱検出素子は、パツケージされた素子
であることを特徴とする実用新案登録請求の範囲
第1項、第2項、第3項または第4項に記載の混
成集積装置。
[Claims for Utility Model Registration] (1) A heat sink having higher thermal conductivity than the substrate is provided on a substrate for a hybrid integrated circuit, and an element that generates heat and a heat detection element are provided on the heat sink. Features of hybrid integration equipment. (2) The hybrid integrated device according to claim 1, wherein the heat generating element and the heat detection element are provided on the same surface of the heat sink. (3) The hybrid integrated device according to claim 1 or 2, wherein the heat sink is made of a metal member. (4) The hybrid integrated device according to claim 3, wherein there is an electrical insulating film between at least one of the heat generating element and the heat detecting element and the heat sink. (5) The hybrid integrated device according to claim 1, 2, 3, or 4, wherein the heat detection element is a packaged element.
JP14145587U 1987-09-16 1987-09-16 Pending JPS6447096U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14145587U JPS6447096U (en) 1987-09-16 1987-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14145587U JPS6447096U (en) 1987-09-16 1987-09-16

Publications (1)

Publication Number Publication Date
JPS6447096U true JPS6447096U (en) 1989-03-23

Family

ID=31406529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14145587U Pending JPS6447096U (en) 1987-09-16 1987-09-16

Country Status (1)

Country Link
JP (1) JPS6447096U (en)

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