JPH0229529U - - Google Patents
Info
- Publication number
- JPH0229529U JPH0229529U JP10716488U JP10716488U JPH0229529U JP H0229529 U JPH0229529 U JP H0229529U JP 10716488 U JP10716488 U JP 10716488U JP 10716488 U JP10716488 U JP 10716488U JP H0229529 U JPH0229529 U JP H0229529U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- power semiconductor
- heat sink
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は本考案の混成集積回路を示す断面図、
第２図は従来例を示す断面図である。
１…混成集積回路基板、２…導電路、３…ヒー
トシンク、４…パワー半導体素子、５…封止樹脂
層、６…樹脂膜、７…ワイヤ。
FIG. 1 is a cross-sectional view showing the hybrid integrated circuit of the present invention;
FIG. 2 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Hybrid integrated circuit board, 2... Conductive path, 3... Heat sink, 4... Power semiconductor element, 5... Sealing resin layer, 6... Resin film, 7... Wire.
Claims (1)
シンクを介して固着されたパワー半導体素子と、 前記パワー半導体素子とその近傍の導電路とを
電気的に接続するワイヤと、 前記ヒートシンク上に塗布され前記パワー半導
体素子を密封する封止樹脂層とを備えた混成集積
回路において、 前記封止樹脂層から導出された前記ワイヤと前
記ヒートシンク間の前記封止樹脂層表面に樹脂膜
が形成されたことを特徴とする混成集積回路。 (2) 前記樹脂膜は前記ヒートシンク側面まで延
在配置されたことを特徴とする請求項第１項記載
の混成集積回路。 (3) 前記混成集積回路基板はアルミニウム基板
であることを特徴とする請求項第１項記載の混成
集積回路。 (4) 前記樹脂膜はシリコンゴムであることを特
徴とする請求項第１項記載の混成集積回路。[Claims for Utility Model Registration] (1) A hybrid integrated circuit board, a power semiconductor element fixed on the hybrid integrated circuit board via a heat sink with good thermal conductivity, and a conductive element in the vicinity of the power semiconductor element. A hybrid integrated circuit comprising a wire that electrically connects the wire and a sealing resin layer coated on the heat sink and sealing the power semiconductor element, wherein the wire led out from the sealing resin layer and the A hybrid integrated circuit characterized in that a resin film is formed on the surface of the sealing resin layer between the heat sinks. (2) The hybrid integrated circuit according to claim 1, wherein the resin film extends to a side surface of the heat sink. (3) The hybrid integrated circuit according to claim 1, wherein the hybrid integrated circuit board is an aluminum substrate. (4) The hybrid integrated circuit according to claim 1, wherein the resin film is silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107164U JP2536626Y2 (en) | 1988-08-12 | 1988-08-12 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988107164U JP2536626Y2 (en) | 1988-08-12 | 1988-08-12 | Hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229529U true JPH0229529U (en) | 1990-02-26 |
| JP2536626Y2 JP2536626Y2 (en) | 1997-05-21 |
Family
ID=31341332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988107164U Expired - Lifetime JP2536626Y2 (en) | 1988-08-12 | 1988-08-12 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2536626Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013745U (en) * | 1983-07-06 | 1985-01-30 | 三洋電機株式会社 | hybrid integrated circuit |
-
1988
- 1988-08-12 JP JP1988107164U patent/JP2536626Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013745U (en) * | 1983-07-06 | 1985-01-30 | 三洋電機株式会社 | hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2536626Y2 (en) | 1997-05-21 |
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