JPS6245841U - - Google Patents

Info

Publication number
JPS6245841U
JPS6245841U JP1985137169U JP13716985U JPS6245841U JP S6245841 U JPS6245841 U JP S6245841U JP 1985137169 U JP1985137169 U JP 1985137169U JP 13716985 U JP13716985 U JP 13716985U JP S6245841 U JPS6245841 U JP S6245841U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
electronic device
case
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985137169U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985137169U priority Critical patent/JPS6245841U/ja
Publication of JPS6245841U publication Critical patent/JPS6245841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に依る実施例を示す断面図、第
２図は本考案に用いる混成集積回路の断面図、第
３図は従来例を示す断面図である。 １……金属基板、２……外部リード、３……混
成集積回路、４……フレキシブル基板、５……ケ
ース、６……円錐バネ、７……放熱板、８……半
導体素子、９……蓋体、１０……外部引出し電極
、１１……ネジ。 FIG. 1 is a cross-sectional view showing an embodiment according to the present invention, FIG. 2 is a cross-sectional view of a hybrid integrated circuit used in the present invention, and FIG. 3 is a cross-sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Metal substrate, 2... External lead, 3... Hybrid integrated circuit, 4... Flexible board, 5... Case, 6... Conical spring, 7... Heat sink, 8... Semiconductor element, 9... ... Lid body, 10 ... External extraction electrode, 11 ... Screw.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板裏面の絶縁薄膜上に発熱を伴う半導体
素子を設け、前記金属基板から導出された外部リ
ードをＪ型に曲折した混成集積回路と、該混成集
積回路の外部リードと接続を行なうフレキシブル
基板と、ケースに放熱板が固着された電子機器に
於いて、前記ケースに前記フレキシブル基板に接
続した混成集積回路を収納し、前記混成集積回路
の裏面をバネで圧縮し前記放熱板に密着させ放熱
することを特徴とする電子機器。 A hybrid integrated circuit in which a semiconductor element that generates heat is provided on an insulating thin film on the back side of a metal substrate, and external leads led out from the metal substrate are bent into a J shape, and a flexible substrate that is connected to the external leads of the hybrid integrated circuit. In an electronic device in which a heat sink is fixed to a case, a hybrid integrated circuit connected to the flexible substrate is housed in the case, and the back surface of the hybrid integrated circuit is compressed by a spring and brought into close contact with the heat sink to radiate heat. An electronic device characterized by:
JP1985137169U 1985-09-06 1985-09-06 Pending JPS6245841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985137169U JPS6245841U (en) 1985-09-06 1985-09-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985137169U JPS6245841U (en) 1985-09-06 1985-09-06

Publications (1)

Publication Number Publication Date
JPS6245841U true JPS6245841U (en) 1987-03-19

Family

ID=31040970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985137169U Pending JPS6245841U (en) 1985-09-06 1985-09-06

Country Status (1)

Country Link
JP (1) JPS6245841U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
JP2012054262A (en) * 2010-08-31 2012-03-15 Mitsubishi Electric Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
JP2012054262A (en) * 2010-08-31 2012-03-15 Mitsubishi Electric Corp Semiconductor device

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