JPS58162643U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58162643U
JPS58162643U JP5888982U JP5888982U JPS58162643U JP S58162643 U JPS58162643 U JP S58162643U JP 5888982 U JP5888982 U JP 5888982U JP 5888982 U JP5888982 U JP 5888982U JP S58162643 U JPS58162643 U JP S58162643U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
metal body
mounting part
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5888982U
Other languages
Japanese (ja)
Other versions
JPS6228763Y2 (en
Inventor
広治 古里
岡村　富雄
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP5888982U priority Critical patent/JPS58162643U/en
Publication of JPS58162643U publication Critical patent/JPS58162643U/en
Application granted granted Critical
Publication of JPS6228763Y2 publication Critical patent/JPS6228763Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す実装構造図である。図
において１は樹脂ケース、１ａは筒状取付部、２はビス
、３はスプリングワッシャ、４は平ワツシヤ、５は放熱
フィン、６は半導体素子、７は樹脂、８は金属体である
。FIG. 1 is a mounting structure diagram showing an embodiment of the present invention. In the figure, 1 is a resin case, 1a is a cylindrical mounting portion, 2 is a screw, 3 is a spring washer, 4 is a flat washer, 5 is a radiation fin, 6 is a semiconductor element, 7 is a resin, and 8 is a metal body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 底面に筒状取付部を設けた樹脂ケースに所要電気接続し
た半導体素子を収納し、これを樹脂封止するようにした
半導体装置において前記筒状取付部に金属体を内接せし
めると共に金属体の先端部を前記筒状取付部の先端と同
等もしくはこれより突出せしめるように構成したことを
特徴とする半導体装置。In a semiconductor device in which a semiconductor element with required electrical connections is housed in a resin case having a cylindrical mounting part on the bottom surface, and this is sealed with resin, a metal body is inscribed in the cylindrical mounting part and the metal body is A semiconductor device characterized in that the tip portion is configured to be equal to or protrude from the tip of the cylindrical attachment portion.
JP5888982U 1982-04-22 1982-04-22 semiconductor equipment Granted JPS58162643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5888982U JPS58162643U (en) 1982-04-22 1982-04-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5888982U JPS58162643U (en) 1982-04-22 1982-04-22 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS58162643U true JPS58162643U (en) 1983-10-29
JPS6228763Y2 JPS6228763Y2 (en) 1987-07-23

Family

ID=30069242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5888982U Granted JPS58162643U (en) 1982-04-22 1982-04-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58162643U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112737A (en) * 2014-03-19 2014-06-19 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112737A (en) * 2014-03-19 2014-06-19 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS6228763Y2 (en) 1987-07-23

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