JPS6013745U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS6013745U JPS6013745U JP10586283U JP10586283U JPS6013745U JP S6013745 U JPS6013745 U JP S6013745U JP 10586283 U JP10586283 U JP 10586283U JP 10586283 U JP10586283 U JP 10586283U JP S6013745 U JPS6013745 U JP S6013745U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- hybrid integrated
- power transistor
- protruding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を説明する断面図、第２図および第３図
は本考案者による従来の改良例を説明する上面図および
断面図、第４図および第５図は本考案を説明する上面図
および断面図である。
主な図番の説明、１１は基板、１３はヒートシンク、１
４はパワートランジスタ、１５は枠体、′１６は封止樹
脂層、１８は蓋体、２０は間隔片、２２はひさし部であ
る。Fig. 1 is a sectional view explaining a conventional example, Figs. 2 and 3 are a top view and a sectional view illustrating an improvement of the conventional example by the present inventor, and Figs. 4 and 5 are illustrating the present invention. FIG. 2 is a top view and a cross-sectional view. Explanation of main drawing numbers, 11 is the board, 13 is the heat sink, 1
4 is a power transistor, 15 is a frame body, 16 is a sealing resin layer, 18 is a lid body, 20 is a spacing piece, and 22 is a canopy part.
Claims (1)
ンジスタを具備する混成集積回路に於いて、゛前記ヒー
トシンクを取り囲み且つ内側に突出した間隔片と下部に
設は前記ヒートシンク近傍まで突出されたひさし部とを
備え前記ヒートシンクより離間して配置した枠体と、該
枠体内に充填され前記パワートランジスタを完全に被覆
する封止樹脂層とを有することを特徴とする混成集積回
路。In a hybrid integrated circuit comprising a power transistor fixed on an insulating substrate via a heat sink, a spacer piece surrounding the heat sink and protruding inwardly, and an eave portion provided at the bottom and protruding to the vicinity of the heat sink are provided. A hybrid integrated circuit comprising: a frame disposed apart from the heat sink; and a sealing resin layer filled in the frame and completely covering the power transistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10586283U JPS6013745U (en) | 1983-07-06 | 1983-07-06 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10586283U JPS6013745U (en) | 1983-07-06 | 1983-07-06 | hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6013745U true JPS6013745U (en) | 1985-01-30 |
| JPS6311735Y2 JPS6311735Y2 (en) | 1988-04-05 |
Family
ID=30247967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10586283U Granted JPS6013745U (en) | 1983-07-06 | 1983-07-06 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6013745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0229529U (en) * | 1988-08-12 | 1990-02-26 |
-
1983
- 1983-07-06 JP JP10586283U patent/JPS6013745U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0229529U (en) * | 1988-08-12 | 1990-02-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6311735Y2 (en) | 1988-04-05 |
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