JPS6249249U - - Google Patents
Info
- Publication number
- JPS6249249U JPS6249249U JP14117485U JP14117485U JPS6249249U JP S6249249 U JPS6249249 U JP S6249249U JP 14117485 U JP14117485 U JP 14117485U JP 14117485 U JP14117485 U JP 14117485U JP S6249249 U JPS6249249 U JP S6249249U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- integrated circuit
- peltier element
- dissipation device
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の集積回路用放熱装置の一実
施例を示す概略縦断面図、第２図は各部の温度状
態を示す図、第３図は集積回路用放熱装置の一実
施例を示す斜視図、第４図は集積回路用放熱装置
の従来例を示す概略縦断面図、第５図は各部の温
度状態を示す図。
１……集積回路、１ａ……高温部、２……放熱
板、３……ペルチエ素子、３ａ……冷却面、３ｂ
……放熱面、４……断熱材。
Fig. 1 is a schematic vertical cross-sectional view showing an embodiment of the integrated circuit heat dissipation device of this invention, Fig. 2 is a diagram showing the temperature state of each part, and Fig. 3 is an embodiment of the integrated circuit heat dissipation device. FIG. 4 is a perspective view, FIG. 4 is a schematic vertical sectional view showing a conventional example of a heat dissipation device for integrated circuits, and FIG. 5 is a diagram showing the temperature state of each part. DESCRIPTION OF SYMBOLS 1... Integrated circuit, 1a... High temperature part, 2... Heat sink, 3... Peltier element, 3a... Cooling surface, 3b
... Heat dissipation surface, 4 ... Insulation material.
Claims (1)
面が集積回路側に位置し、放熱面が放熱部材側に
位置するペルチエ素子を取付けたことを特徴とす
る集積回路用放熱装置。 ２ 集積回路、およびペルチエ素子の側面が断熱
部材で包囲されている上記実用新案登録請求の範
囲第１項記載の集積回路用放熱装置。[Claims for Utility Model Registration] 1. A Peltier element is installed between the high temperature part of the integrated circuit and the heat dissipation member, the cooling surface of which is located on the integrated circuit side, and the heat dissipation surface of which is located on the heat dissipation member side. Heat dissipation device for integrated circuits. 2. The heat dissipation device for an integrated circuit according to claim 1, wherein the side surfaces of the integrated circuit and the Peltier element are surrounded by a heat insulating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14117485U JPS6249249U (en) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14117485U JPS6249249U (en) | 1985-09-13 | 1985-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249249U true JPS6249249U (en) | 1987-03-26 |
Family
ID=31048719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14117485U Pending JPS6249249U (en) | 1985-09-13 | 1985-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01159380U (en) * | 1988-04-25 | 1989-11-06 |
-
1985
- 1985-09-13 JP JP14117485U patent/JPS6249249U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01159380U (en) * | 1988-04-25 | 1989-11-06 |
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