JPH01159380U - - Google Patents

Info

Publication number
JPH01159380U
JPH01159380U JP5571088U JP5571088U JPH01159380U JP H01159380 U JPH01159380 U JP H01159380U JP 5571088 U JP5571088 U JP 5571088U JP 5571088 U JP5571088 U JP 5571088U JP H01159380 U JPH01159380 U JP H01159380U
Authority
JP
Japan
Prior art keywords
socket
thermomodule
package
cooling
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5571088U
Other languages
Japanese (ja)
Other versions
JPH0644049Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988055710U priority Critical patent/JPH0644049Y2/en
Publication of JPH01159380U publication Critical patent/JPH01159380U/ja
Application granted granted Critical
Publication of JPH0644049Y2 publication Critical patent/JPH0644049Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のＩＣソケツトの第一実施例に
よる縦断面図、第２図は該ＩＣソケツトに装着さ
れるべきサーモモジユールの斜視図、第３図は第
１図の部分拡大図、第４図は第二実施例によるＩ
Ｃソケツトの斜視図、第５図は第三実施例による
ＩＣソケツトの縦断面図、第６図は従来のＩＣソ
ケツトの縦断面図である。 １……ソケツト本体、２……コンタクトピン、
３……押えカバー、５……サーモモジユール、５
ａ……冷却用金属板、５ａ′……発熱側の金属板
、５ｂ……サーモエレメント、Ｐ……ＩＣパツケ
ージ、Ｌ……リード端子。 FIG. 1 is a vertical sectional view of a first embodiment of the IC socket of the present invention, FIG. 2 is a perspective view of a thermomodule to be attached to the IC socket, and FIG. 3 is a partially enlarged view of FIG. 1. FIG. 4 shows I according to the second embodiment.
FIG. 5 is a perspective view of a C socket, FIG. 5 is a vertical sectional view of an IC socket according to a third embodiment, and FIG. 6 is a vertical sectional view of a conventional IC socket. 1...Socket body, 2...Contact pin,
3... Presser foot cover, 5... Thermo module, 5
a... Metal plate for cooling, 5a'... Metal plate on the heating side, 5b... Thermoelement, P... IC package, L... Lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱伝導性の高い金属材料で形成された一対の金
属板間に、電流により一端側が低温度に、他端側
が高温度になる複数のサーモエレメントを、前後
左右の方向に列設せしめて挾持して成るサーモモ
ジユールを、低温度側の上記金属板がソケツト内
に収容されたＩＣパツケージの上面又は下面に密
着し得るように、押えカバー又はソケツト本体に
配設して、上記ＩＣパツケージを冷却するように
したＩＣソケツト。 A plurality of thermo elements, which are heated at one end and high at one end by electric current, are arranged in rows in the front, back, left, and right directions and are sandwiched between a pair of metal plates made of a highly thermally conductive metal material. A thermomodule consisting of a thermomodule is disposed on the holding cover or the socket body so that the metal plate on the low temperature side can be brought into close contact with the upper or lower surface of the IC package housed in the socket, thereby cooling the IC package. IC socket designed to
JP1988055710U 1988-04-25 1988-04-25 IC socket Expired - Lifetime JPH0644049Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988055710U JPH0644049Y2 (en) 1988-04-25 1988-04-25 IC socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988055710U JPH0644049Y2 (en) 1988-04-25 1988-04-25 IC socket

Publications (2)

Publication Number Publication Date
JPH01159380U true JPH01159380U (en) 1989-11-06
JPH0644049Y2 JPH0644049Y2 (en) 1994-11-14

Family

ID=31281614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988055710U Expired - Lifetime JPH0644049Y2 (en) 1988-04-25 1988-04-25 IC socket

Country Status (1)

Country Link
JP (1) JPH0644049Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018503818A (en) * 2015-02-05 2018-02-08 リーノ インダストリアル インコーポレイテッド Inspection device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022779U (en) * 1983-07-22 1985-02-16 山一電機工業株式会社 IC socket
JPS60172350U (en) * 1984-04-24 1985-11-15 山一電機株式会社 Heat dissipation device in IC socket
JPS6235477A (en) * 1985-08-08 1987-02-16 日本電気株式会社 Testing ic socket
JPS6249249U (en) * 1985-09-13 1987-03-26

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022779U (en) * 1983-07-22 1985-02-16 山一電機工業株式会社 IC socket
JPS60172350U (en) * 1984-04-24 1985-11-15 山一電機株式会社 Heat dissipation device in IC socket
JPS6235477A (en) * 1985-08-08 1987-02-16 日本電気株式会社 Testing ic socket
JPS6249249U (en) * 1985-09-13 1987-03-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018503818A (en) * 2015-02-05 2018-02-08 リーノ インダストリアル インコーポレイテッド Inspection device

Also Published As

Publication number Publication date
JPH0644049Y2 (en) 1994-11-14

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