JPS62131450U - - Google Patents
Info
- Publication number
- JPS62131450U JPS62131450U JP1797686U JP1797686U JPS62131450U JP S62131450 U JPS62131450 U JP S62131450U JP 1797686 U JP1797686 U JP 1797686U JP 1797686 U JP1797686 U JP 1797686U JP S62131450 U JPS62131450 U JP S62131450U
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- thermally conductive
- semiconductor
- thermal protection
- protection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す斜視図、第２
図は従来例の斜視図である。
１１……放熱器、１２……電気絶縁板、１３…
…熱伝導部材、１６……半導体素子、１７……温
度検出素子。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view of a conventional example. 11...Radiator, 12...Electric insulation board, 13...
...Thermal conduction member, 16...Semiconductor element, 17...Temperature detection element.
Claims (1)
熱器と、該半導体素子の温度を検出する温度検出
素子とを含む熱保護装置において、上記半導体素
子に密着固定された熱抵抗の小さい熱伝導部材を
備え、該熱伝導部材に上記温度検出素子を取付け
たことを特徴とする半導体素子の熱保護装置。 ２ 上記熱伝導部材は上記半導体素子と上記放熱
器との間に介在している実用新案登録請求の範囲
第１項記載の半導体素子の熱保護装置。[Claims for Utility Model Registration] 1. A thermal protection device including a radiator that promotes dissipation of heat emitted from a semiconductor element and a temperature detection element that detects the temperature of the semiconductor element, which is closely fixed to the semiconductor element. 1. A thermal protection device for a semiconductor device, comprising a thermally conductive member having low thermal resistance, and the temperature detecting element is attached to the thermally conductive member. 2. The thermal protection device for a semiconductor device according to claim 1, wherein the thermally conductive member is interposed between the semiconductor device and the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1797686U JPH0410694Y2 (en) | 1986-02-10 | 1986-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1797686U JPH0410694Y2 (en) | 1986-02-10 | 1986-02-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131450U true JPS62131450U (en) | 1987-08-19 |
| JPH0410694Y2 JPH0410694Y2 (en) | 1992-03-17 |
Family
ID=30811228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1797686U Expired JPH0410694Y2 (en) | 1986-02-10 | 1986-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410694Y2 (en) |
-
1986
- 1986-02-10 JP JP1797686U patent/JPH0410694Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410694Y2 (en) | 1992-03-17 |
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