JPS61149490U - - Google Patents
Info
- Publication number
- JPS61149490U JPS61149490U JP1985031293U JP3129385U JPS61149490U JP S61149490 U JPS61149490 U JP S61149490U JP 1985031293 U JP1985031293 U JP 1985031293U JP 3129385 U JP3129385 U JP 3129385U JP S61149490 U JPS61149490 U JP S61149490U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- image sensor
- state image
- housing
- peltier element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Color Television Image Signal Generators (AREA)
Description
第１図は本考案に係る固体カラー撮像装置の実
施例を示す要部側面図であり、第２図は上記実施
例の固体カラー撮像装置の要部底面図であり、第
３図は上記実施例におけるＣＣＤイメージセンサ
近傍の放熱等価回路図である。
１……色分解プリズム、２ｒ，２ｇ，２ｂ……
ＣＣＤイメージセンサ、３……プリズム保持具、
４……筐体、７……放熱部材、８……断熱部材、
９……周辺回路基板、１０……ペルチエ素子、１
１……放熱金具。
FIG. 1 is a side view of the main parts of the solid-state color imaging device according to the embodiment of the present invention, FIG. 2 is a bottom view of the main parts of the solid-state color imaging device of the above embodiment, and FIG. FIG. 3 is a heat dissipation equivalent circuit diagram in the vicinity of a CCD image sensor in an example. 1...Color separation prism, 2r, 2g, 2b...
CCD image sensor, 3... prism holder,
4... Housing, 7... Heat radiation member, 8... Heat insulation member,
9... Peripheral circuit board, 10... Peltier element, 1
1... Heat dissipation metal fittings.
Claims (1)
固体イメージセンサと該固体イメージセンサの近
傍の配設される周辺回路基板との間に熱抵抗の大
きな断熱部材を配設するとともに、上記固体イメ
ージセンサのパツケージに結合した熱抵抗の小さ
な放熱部材と上記筐体との間にペルチエ素子を設
け、上記固体イメージセンサが発生する熱を上記
ペルチエ素子により上記筐体に強制的に放熱する
ようにしたことを特徴とする固体カラー撮像装置
。 A heat insulating member with high thermal resistance is disposed between the solid-state image sensor fixed to the color separation prism attached to the casing and the peripheral circuit board disposed near the solid-state image sensor, and the solid-state image sensor A Peltier element is provided between a heat dissipating member having a low thermal resistance coupled to the package and the housing, and the heat generated by the solid-state image sensor is forcibly radiated to the housing by the Peltier element. A solid-state color imaging device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985031293U JPS61149490U (en) | 1985-03-05 | 1985-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985031293U JPS61149490U (en) | 1985-03-05 | 1985-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149490U true JPS61149490U (en) | 1986-09-16 |
Family
ID=30531769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985031293U Pending JPS61149490U (en) | 1985-03-05 | 1985-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149490U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58148572A (en) * | 1982-02-27 | 1983-09-03 | Sony Corp | Solid-state image pickup device |
| JPS58201472A (en) * | 1982-05-20 | 1983-11-24 | Toshiba Corp | Cooling mechanism of image pickup element |
-
1985
- 1985-03-05 JP JP1985031293U patent/JPS61149490U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58148572A (en) * | 1982-02-27 | 1983-09-03 | Sony Corp | Solid-state image pickup device |
| JPS58201472A (en) * | 1982-05-20 | 1983-11-24 | Toshiba Corp | Cooling mechanism of image pickup element |
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