JPS61189668U - - Google Patents
Info
- Publication number
- JPS61189668U JPS61189668U JP7314485U JP7314485U JPS61189668U JP S61189668 U JPS61189668 U JP S61189668U JP 7314485 U JP7314485 U JP 7314485U JP 7314485 U JP7314485 U JP 7314485U JP S61189668 U JPS61189668 U JP S61189668U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- image sensor
- state image
- heat transfer
- transfer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 2
Landscapes
- Color Television Image Signal Generators (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案に係る固体カラー撮像装置の実
施例を示す模式的な側断面図であり、第２図は上
記実施例におけるＣＣＤイメージセンサの色分解
プリズムへの取り付け部分を分解して示した要部
分解斜視図である。
１……色分解プリズム、２ｒ，２ｇ，２ｂ……
ＣＣＤイメージセンサ、３……プリズム保持具、
４……装置筐体、１０……伝熱材料。
FIG. 1 is a schematic side sectional view showing an embodiment of the solid-state color imaging device according to the present invention, and FIG. 2 is an exploded view of the attachment portion of the CCD image sensor to the color separation prism in the above embodiment. FIG. 1...Color separation prism, 2r, 2g, 2b...
CCD image sensor, 3... prism holder,
4...Device housing, 10...Heat transfer material.
Claims (1)
後も硬度の低い伝熱材料を固体イメージセンサの
パツケージに塗布するとともに、上記伝熱材料を
上記固体イメージセンサのパツケージから装置筐
体まで連続的に塗布して成り、上記固体イメージ
センサの熱を上記伝熱材料を介して上記装置筐体
に放熱するようにしたことを特徴とする固体撮像
装置。 A liquid heat transfer material containing a thermally conductive substance that is viscous and has low hardness even after curing is applied to the package of the solid-state image sensor, and the heat transfer material is continuously applied from the package of the solid-state image sensor to the device housing. A solid-state imaging device, characterized in that the solid-state image sensor is coated with a solid-state image sensor, and the heat of the solid-state image sensor is radiated to the device casing via the heat transfer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7314485U JPS61189668U (en) | 1985-05-17 | 1985-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7314485U JPS61189668U (en) | 1985-05-17 | 1985-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61189668U true JPS61189668U (en) | 1986-11-26 |
Family
ID=30612225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7314485U Pending JPS61189668U (en) | 1985-05-17 | 1985-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61189668U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01222579A (en) * | 1988-03-01 | 1989-09-05 | Olympus Optical Co Ltd | Image pickup device |
-
1985
- 1985-05-17 JP JP7314485U patent/JPS61189668U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01222579A (en) * | 1988-03-01 | 1989-09-05 | Olympus Optical Co Ltd | Image pickup device |
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