JPH0174687U - - Google Patents
Info
- Publication number
- JPH0174687U JPH0174687U JP1987169908U JP16990887U JPH0174687U JP H0174687 U JPH0174687 U JP H0174687U JP 1987169908 U JP1987169908 U JP 1987169908U JP 16990887 U JP16990887 U JP 16990887U JP H0174687 U JPH0174687 U JP H0174687U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- prism
- circuit board
- mounting bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Color Television Image Signal Generators (AREA)
Description
第１図本考案の一実施例の正面図、第２図は本
実施例における周辺回路基板部の詳細断面図であ
る。
１……固体撮像素子、２……色分解プリズム、
３……取付用金具、４……周辺回路基板、４ａ…
…金属部、４ｂ……絶縁材、５……放熱部材、６
……筐体。
FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a detailed sectional view of a peripheral circuit board portion in this embodiment. 1... Solid-state image sensor, 2... Color separation prism,
3...Mounting metal fittings, 4...Peripheral circuit board, 4a...
...metal part, 4b...insulating material, 5...heat dissipation member, 6
...Housing.
Claims (1)
具と、前記色分解プリズムの光射出部に固定され
た固体撮像素子と、該固体撮像素子の近傍に配置
された周辺回路基板とを有する固体撮像カメラに
おいて、前記周辺回路基板は前記固体撮像素子と
接する部分に絶縁材を施こした金属基板からなり
、該金属基板の金属部と前記プリズム取付金具と
を熱的に短絡させるように配した熱抵抗の小さな
放熱部材を備えることを特徴とする固体撮像カメ
ラ。 A solid-state imaging camera having a prism mounting bracket to which a color separation prism is attached, a solid-state imaging device fixed to a light exit portion of the color-separation prism, and a peripheral circuit board disposed near the solid-state imaging device, The peripheral circuit board is made of a metal substrate with an insulating material applied to the portion that comes into contact with the solid-state image sensor, and has a low thermal resistance arranged so as to thermally short-circuit the metal part of the metal substrate and the prism mounting bracket. A solid-state imaging camera comprising a heat dissipation member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169908U JPH0174687U (en) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169908U JPH0174687U (en) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0174687U true JPH0174687U (en) | 1989-05-19 |
Family
ID=31460382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169908U Pending JPH0174687U (en) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0174687U (en) |
-
1987
- 1987-11-05 JP JP1987169908U patent/JPH0174687U/ja active Pending
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