JPS61103958U - - Google Patents

Info

Publication number
JPS61103958U
JPS61103958U JP18740884U JP18740884U JPS61103958U JP S61103958 U JPS61103958 U JP S61103958U JP 18740884 U JP18740884 U JP 18740884U JP 18740884 U JP18740884 U JP 18740884U JP S61103958 U JPS61103958 U JP S61103958U
Authority
JP
Japan
Prior art keywords
solid
image sensor
attaches
state image
fixing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18740884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18740884U priority Critical patent/JPS61103958U/ja
Publication of JPS61103958U publication Critical patent/JPS61103958U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Facsimile Heads (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は従来の固体撮像素子の取
付構造の側面図、第3図はこの考案の実施例を示
し、同図イは正面図、同図ロは断面図、第4図は
この考案の実施例の斜視図である。 1は固体撮像装置、2は地板、3は回路基板、
5は保持部材、8は充填材、9はパターンである
1 and 2 are side views of a conventional mounting structure for a solid-state image sensor, FIG. 3 shows an embodiment of this invention, where A is a front view, B is a sectional view, and FIG. FIG. 1 is a perspective view of an embodiment of this invention. 1 is a solid-state imaging device, 2 is a ground plane, 3 is a circuit board,
5 is a holding member, 8 is a filler, and 9 is a pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固体撮像素子を固定し、かつ回路基板を断熱材
を介して取り付けた固定部材と、この固定部材を
倒れ調整可能に取り付けた保持部材との間に、熱
伝導状のよい充填材を介装したことを特徴とする
固体撮像素子の取付構造。
A filling material with good thermal conductivity is interposed between a fixing member that fixes the solid-state image sensor and attaches the circuit board via a heat insulating material, and a holding member that attaches this fixing member so that it can be tilted and adjusted. A mounting structure for a solid-state image sensor characterized by the following.
JP18740884U 1984-12-12 1984-12-12 Pending JPS61103958U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18740884U JPS61103958U (en) 1984-12-12 1984-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18740884U JPS61103958U (en) 1984-12-12 1984-12-12

Publications (1)

Publication Number Publication Date
JPS61103958U true JPS61103958U (en) 1986-07-02

Family

ID=30744872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18740884U Pending JPS61103958U (en) 1984-12-12 1984-12-12

Country Status (1)

Country Link
JP (1) JPS61103958U (en)

Similar Documents

Publication Publication Date Title
JPS61103958U (en)
JPS58118756U (en) Mounting structure of semiconductor image sensor
JPH01139676U (en)
JPS6448095U (en)
JPS63187344U (en)
JPH0334292U (en)
JPS62158895U (en)
JPS63147993U (en)
JPS63170964U (en)
JPH0330440U (en)
JPS61144692U (en)
JPS6228446U (en)
JPH045685U (en)
JPH02113386U (en)
JPH01135478U (en)
JPS6240888U (en)
JPS6146744U (en) Heat dissipation mechanism for integrated circuit devices
JPH02138437U (en)
JPH01113364U (en)
JPH0171490U (en)
JPH0476697U (en)
JPH029463U (en)
JPS61140593U (en)
JPH0179846U (en)
JPS6261568U (en)