JPS6212897U - - Google Patents
Info
- Publication number
- JPS6212897U JPS6212897U JP10499785U JP10499785U JPS6212897U JP S6212897 U JPS6212897 U JP S6212897U JP 10499785 U JP10499785 U JP 10499785U JP 10499785 U JP10499785 U JP 10499785U JP S6212897 U JPS6212897 U JP S6212897U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- camera
- back side
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 230000010287 polarization Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Details Of Measuring And Other Instruments (AREA)
Description
第1図はこの考案に係るカメラの放熱装置の一
例を示す要部の断面図、第2図はこの考案の他の
例を示す第1図のさらに要部の構成図、第3図は
カメラの放熱装置の従来例を示す断面図である。
10はカメラ一体型VTR、10Aはカメラ部
、10BはVTR部、10Cは光学系、1〜4は
筐体、8は偏光系、9A〜9はCCD、20(2
0A〜20C)は放熱板、25は補助放熱板であ
る。
Fig. 1 is a sectional view of the main parts showing an example of a heat dissipation device for a camera according to this invention, Fig. 2 is a configuration diagram of the main parts of Fig. 1 showing another example of this invention, and Fig. 3 is a sectional view of the main parts of the camera. FIG. 2 is a sectional view showing a conventional example of a heat dissipation device. 10 is a camera integrated VTR, 10A is a camera section, 10B is a VTR section, 10C is an optical system, 1 to 4 are housings, 8 is a polarizing system, 9A to 9 are CCDs, 20 (2
0A to 20C) are heat sinks, and 25 is an auxiliary heat sink.
Claims (1)
なる撮像素子が貼着され、 この撮像素子の裏面側に対向して熱変形材より
なる放熱板が配置され、 カメラ筐体内部の温度が所定の温度以上に上昇
したときこの放熱板を上記撮像素子の裏面側に自
動的に密着させてその放熱を行うようにしたカメ
ラの放熱装置。[Claims for Utility Model Registration] An image sensor made of a semiconductor element such as a CCD is attached to the polarization system of the camera, and a heat sink made of a thermally deformable material is arranged opposite to the back side of the image sensor, and the camera housing A heat dissipation device for a camera that automatically brings this heat dissipation plate into close contact with the back side of the image sensor to radiate heat when the temperature inside the body rises above a predetermined temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10499785U JPS6212897U (en) | 1985-07-10 | 1985-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10499785U JPS6212897U (en) | 1985-07-10 | 1985-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6212897U true JPS6212897U (en) | 1987-01-26 |
Family
ID=30979010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10499785U Pending JPS6212897U (en) | 1985-07-10 | 1985-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6212897U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8432486B2 (en) | 2010-03-25 | 2013-04-30 | Panasonic Corporation | Heat dissipating structure for an imaging unit |
-
1985
- 1985-07-10 JP JP10499785U patent/JPS6212897U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8432486B2 (en) | 2010-03-25 | 2013-04-30 | Panasonic Corporation | Heat dissipating structure for an imaging unit |
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