JPS5991757U - solid-state imaging device - Google Patents

solid-state imaging device

Info

Publication number
JPS5991757U
JPS5991757U JP18837282U JP18837282U JPS5991757U JP S5991757 U JPS5991757 U JP S5991757U JP 18837282 U JP18837282 U JP 18837282U JP 18837282 U JP18837282 U JP 18837282U JP S5991757 U JPS5991757 U JP S5991757U
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging device
package
electronic cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18837282U
Other languages
Japanese (ja)
Inventor
谷彦 章
Original Assignee
東京電子工業株式会社
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京電子工業株式会社, 株式会社東芝 filed Critical 東京電子工業株式会社
Priority to JP18837282U priority Critical patent/JPS5991757U/en
Publication of JPS5991757U publication Critical patent/JPS5991757U/en
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る固体撮像装置を示す断面図、第2
図は電子冷却素子の制御回路を示すブロック図である。 1・・・固体撮像装置、2・・・パッケージ、2a・・
・収容部、3・・・固体撮像素子、4・・・電子冷却素
子、9・・・保護ガラス。
FIG. 1 is a sectional view showing a solid-state imaging device according to the present invention, and FIG.
The figure is a block diagram showing the control circuit of the electronic cooling element. 1... Solid-state imaging device, 2... Package, 2a...
- Accommodating section, 3... Solid-state image sensor, 4... Electronic cooling element, 9... Protective glass.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 冷却面と放熱面とを有する電子冷却素子の冷却面側に固
体撮像素子を配設するとともに、この電子冷却素子と固
体撮像素子とをパッケージの収容部に収容し、さらにこ
のパッケージの収容部を前記固体撮像素子の撮像面を保
護する透明ガラスで覆うようにした固体撮像装置におい
て、前記パッケージを熱伝導体で形成するとともに、こ
のイ寸ツケージの一部を前記電子冷却素子の放熱面側に
当接させ、電子冷却素子の放熱面から発生する熱の一部
を前記パッケージを介して前記透明ガラスに伝達させる
ようにしたことを特徴とする固体撮像装置。
A solid-state imaging device is disposed on the cooling surface side of an electronic cooling device having a cooling surface and a heat dissipation surface, and the electronic cooling device and solid-state imaging device are housed in a housing section of a package. In the solid-state imaging device in which the imaging surface of the solid-state imaging device is covered with a transparent glass that protects the imaging surface, the package is formed of a heat conductor, and a part of the cage is placed on the heat radiation surface side of the electronic cooling device. A solid-state imaging device characterized in that the package is brought into contact with the transparent glass so that part of the heat generated from the heat radiation surface of the electronic cooling element is transmitted to the transparent glass via the package.
JP18837282U 1982-12-13 1982-12-13 solid-state imaging device Pending JPS5991757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18837282U JPS5991757U (en) 1982-12-13 1982-12-13 solid-state imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18837282U JPS5991757U (en) 1982-12-13 1982-12-13 solid-state imaging device

Publications (1)

Publication Number Publication Date
JPS5991757U true JPS5991757U (en) 1984-06-21

Family

ID=30406393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18837282U Pending JPS5991757U (en) 1982-12-13 1982-12-13 solid-state imaging device

Country Status (1)

Country Link
JP (1) JPS5991757U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183372A (en) * 1998-12-10 2000-06-30 Osaka Gas Co Ltd Flame sensor
JP2023517377A (en) * 2020-03-16 2023-04-25 ゼジャン・ハーレイ・テクノロジー・カンパニー・リミテッド Condensation prevention system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183372A (en) * 1998-12-10 2000-06-30 Osaka Gas Co Ltd Flame sensor
JP2023517377A (en) * 2020-03-16 2023-04-25 ゼジャン・ハーレイ・テクノロジー・カンパニー・リミテッド Condensation prevention system and method

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