JPS5991757U - solid-state imaging device - Google Patents
solid-state imaging deviceInfo
- Publication number
- JPS5991757U JPS5991757U JP18837282U JP18837282U JPS5991757U JP S5991757 U JPS5991757 U JP S5991757U JP 18837282 U JP18837282 U JP 18837282U JP 18837282 U JP18837282 U JP 18837282U JP S5991757 U JPS5991757 U JP S5991757U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- package
- electronic cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案に係る固体撮像装置を示す断面図、第2
図は電子冷却素子の制御回路を示すブロック図である。
1・・・固体撮像装置、2・・・パッケージ、2a・・
・収容部、3・・・固体撮像素子、4・・・電子冷却素
子、9・・・保護ガラス。FIG. 1 is a sectional view showing a solid-state imaging device according to the present invention, and FIG.
The figure is a block diagram showing the control circuit of the electronic cooling element. 1... Solid-state imaging device, 2... Package, 2a...
- Accommodating section, 3... Solid-state image sensor, 4... Electronic cooling element, 9... Protective glass.
Claims (1)
体撮像素子を配設するとともに、この電子冷却素子と固
体撮像素子とをパッケージの収容部に収容し、さらにこ
のパッケージの収容部を前記固体撮像素子の撮像面を保
護する透明ガラスで覆うようにした固体撮像装置におい
て、前記パッケージを熱伝導体で形成するとともに、こ
のイ寸ツケージの一部を前記電子冷却素子の放熱面側に
当接させ、電子冷却素子の放熱面から発生する熱の一部
を前記パッケージを介して前記透明ガラスに伝達させる
ようにしたことを特徴とする固体撮像装置。A solid-state imaging device is disposed on the cooling surface side of an electronic cooling device having a cooling surface and a heat dissipation surface, and the electronic cooling device and solid-state imaging device are housed in a housing section of a package. In the solid-state imaging device in which the imaging surface of the solid-state imaging device is covered with a transparent glass that protects the imaging surface, the package is formed of a heat conductor, and a part of the cage is placed on the heat radiation surface side of the electronic cooling device. A solid-state imaging device characterized in that the package is brought into contact with the transparent glass so that part of the heat generated from the heat radiation surface of the electronic cooling element is transmitted to the transparent glass via the package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18837282U JPS5991757U (en) | 1982-12-13 | 1982-12-13 | solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18837282U JPS5991757U (en) | 1982-12-13 | 1982-12-13 | solid-state imaging device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5991757U true JPS5991757U (en) | 1984-06-21 |
Family
ID=30406393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18837282U Pending JPS5991757U (en) | 1982-12-13 | 1982-12-13 | solid-state imaging device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5991757U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183372A (en) * | 1998-12-10 | 2000-06-30 | Osaka Gas Co Ltd | Flame sensor |
JP2023517377A (en) * | 2020-03-16 | 2023-04-25 | ゼジャン・ハーレイ・テクノロジー・カンパニー・リミテッド | Condensation prevention system and method |
-
1982
- 1982-12-13 JP JP18837282U patent/JPS5991757U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183372A (en) * | 1998-12-10 | 2000-06-30 | Osaka Gas Co Ltd | Flame sensor |
JP2023517377A (en) * | 2020-03-16 | 2023-04-25 | ゼジャン・ハーレイ・テクノロジー・カンパニー・リミテッド | Condensation prevention system and method |
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