JPS61129397U - - Google Patents
Info
- Publication number
- JPS61129397U JPS61129397U JP1325385U JP1325385U JPS61129397U JP S61129397 U JPS61129397 U JP S61129397U JP 1325385 U JP1325385 U JP 1325385U JP 1325385 U JP1325385 U JP 1325385U JP S61129397 U JPS61129397 U JP S61129397U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- electronic circuit
- square hole
- cover
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012856 packing Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 5
- 238000001816 cooling Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図ａはこの考案の一実施例を示す外観図、
第１図ｂは第１図ａの断面ＣＣを示す図、第２図
は従来の電子回路モジユールを示す外観図、第３
図は第２図の断面ＡＡを示す図、第４図はデユア
ルインタイプの電子回路部品をプリント基板に実
装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインタイプの電子回
路部品、９はリードフレーム、１０はスルーホー
ル、１１は頭部、１２は放熱フイン部、１３はフ
ランジ部、１４は放熱板、１５はカバー、１６は
角穴、１７はパツキンである。なお、各図中同一
符号は同一または相当部分を示す。
Figure 1a is an external view showing an embodiment of this invention;
FIG. 1b is a diagram showing the cross section CC of FIG. 1a, FIG. 2 is an external view showing a conventional electronic circuit module, and FIG.
The figure is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a 12 is a heat radiation fin portion, 13 is a flange portion, 14 is a heat radiation plate, 15 is a cover, 16 is a square hole, and 17 is a packing. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
基板と、上記電子回路部品の頭部に接着され、か
つ上記電子回路部品と接着されている面と反対側
の面には放熱フイン部が形成され、さらにフラン
ジ部を有する放熱板と、上記放熱板を上記放熱フ
イン部側から覆うように配されかつ上記放熱フイ
ン部が突出できるように角穴が設けられていると
ともに上記角穴の周囲にはゴム系材料からなるパ
ツキンが具備されており上記パツキンを介して上
記フランジ部と接するように配されたカバーと、
上記プリント基板と上記カバーとの周辺部分で挾
持されたスペーサとで構成されている事を特徴と
する電子回路モジユール。 A rectangular plate-shaped printed circuit board on which an electronic circuit component is mounted, and a heat dissipation fin portion that is bonded to the head of the electronic circuit component and is formed on a surface opposite to the surface that is bonded to the electronic circuit component. , further comprising a heat dissipation plate having a flange portion, a square hole arranged to cover the heat dissipation plate from the heat dissipation fin portion side, and a square hole so that the heat dissipation fin portion can protrude, and a square hole is provided around the square hole. a cover provided with a packing made of a rubber-based material and arranged so as to be in contact with the flange portion through the packing;
An electronic circuit module comprising a spacer held between the printed circuit board and the cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1325385U JPH0322951Y2 (en) | 1985-02-01 | 1985-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1325385U JPH0322951Y2 (en) | 1985-02-01 | 1985-02-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61129397U true JPS61129397U (en) | 1986-08-13 |
| JPH0322951Y2 JPH0322951Y2 (en) | 1991-05-20 |
Family
ID=30497091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1325385U Expired JPH0322951Y2 (en) | 1985-02-01 | 1985-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322951Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837387A (en) * | 1994-07-22 | 1996-02-06 | Nec Corp | Heat radiating and mounting structure for power amplifier |
| JP2014163605A (en) * | 2013-02-26 | 2014-09-08 | Sharp Corp | Air conditioner and electric apparatus |
-
1985
- 1985-02-01 JP JP1325385U patent/JPH0322951Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837387A (en) * | 1994-07-22 | 1996-02-06 | Nec Corp | Heat radiating and mounting structure for power amplifier |
| JP2014163605A (en) * | 2013-02-26 | 2014-09-08 | Sharp Corp | Air conditioner and electric apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322951Y2 (en) | 1991-05-20 |
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