JPS6454393U - - Google Patents
Info
- Publication number
- JPS6454393U JPS6454393U JP14998887U JP14998887U JPS6454393U JP S6454393 U JPS6454393 U JP S6454393U JP 14998887 U JP14998887 U JP 14998887U JP 14998887 U JP14998887 U JP 14998887U JP S6454393 U JPS6454393 U JP S6454393U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- electronic circuit
- cooling fin
- thin metal
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の電子回路モジユールを示す外観図、
第３図は第２図の断面ＡＡを示す図、第４図はデ
ユアルインタイプの電子回路部品をプリント基板
に実装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインタイプの電子回
路部品、９はリードフレーム、１０はスルーホー
ル、１１は熱伝導ラバーである。なお、各図中同
一符号は同一または相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an external view showing a conventional electronic circuit module,
FIG. 3 is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a It is a heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記冷却フインの両面にロウ付けまたは接着によ
つて接合された矩形金属薄板である２枚のスキン
と、上記スキンの上記冷却フインが接合されてい
る面の反対側の面に接着されており、かつシリコ
ンゴムを主成分とし矩形板状に成形された２枚の
熱伝導ラバーと、第１の面には電子回路部品が実
装されており、かつ上記第１の面と反対側の第２
の面は上記熱伝導ラバーと接するよう配した２枚
のプリント基板とで構成した事を特徴とする電子
回路モジユール。 A cooling fin made of a corrugated thin metal plate,
two skins that are rectangular thin metal plates bonded to both sides of the cooling fin by brazing or gluing, and bonded to a surface of the skin opposite to the surface to which the cooling fins are bonded; and two heat-conducting rubber sheets formed into rectangular plates mainly made of silicone rubber; an electronic circuit component is mounted on the first surface;
An electronic circuit module comprising two printed circuit boards arranged so that the surface thereof is in contact with the heat conductive rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14998887U JPS6454393U (en) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14998887U JPS6454393U (en) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6454393U true JPS6454393U (en) | 1989-04-04 |
Family
ID=31422721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14998887U Pending JPS6454393U (en) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6454393U (en) |
-
1987
- 1987-09-30 JP JP14998887U patent/JPS6454393U/ja active Pending
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