JPS6214793U - - Google Patents
Info
- Publication number
- JPS6214793U JPS6214793U JP10500785U JP10500785U JPS6214793U JP S6214793 U JPS6214793 U JP S6214793U JP 10500785 U JP10500785 U JP 10500785U JP 10500785 U JP10500785 U JP 10500785U JP S6214793 U JPS6214793 U JP S6214793U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic circuit
- circuit component
- recess
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａは、この考案の一実施例を示す外観図
、第１図ｂは第１図ａの断面ＣＣを示す図、第２
図は従来の電子回路モジユールを示す外観図、第
３図は第２図の断面ＡＡを示す図、第４図はデユ
アルインタイプの電子回路部品をプリント基板に
実装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインタイプの電子回
路部品、９はリードフレーム、１０はスルーホー
ル、１１は放熱板、１２はフイン付放熱板、１３
は放熱フイン部、１４は凹部、１５はパツキン、
１６は頭部である。なお、各図中同一符号は同一
または相当部分を示す。
Fig. 1a is an external view showing one embodiment of this invention, Fig. 1b is a view showing the cross section CC of Fig. 1a, and Fig. 2
The figure is an external view of a conventional electronic circuit module, Figure 3 is a cross-sectional view taken along section AA of Figure 2, and Figure 4 is a cross-sectional view of dual-in type electronic circuit components mounted on a printed circuit board. . In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a Heat sink, 12 is a heat sink with fins, 13
14 is a concave portion, 15 is a packing,
16 is the head. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
た矩形状のプリント基板と、一面に放熱フインが
形成され、反対面には上記電子回路部品を覆うよ
うに凹部を設け、上記放熱板に接するように配し
たフイン付放熱板と、上記凹部の底に上記電子回
路部品の頭部が接するように配したゴム系材料か
らなるパツキンと、上記フイン付放熱板及び上記
プリント基板の周辺部分で挾持されたスペーサと
で構成されている事を特徴とする電子回路モジユ
ール。 A rectangular printed circuit board on which electronic circuit components are mounted via a plate-shaped heat sink, a heat sink fin is formed on one side, a recess is provided on the opposite side to cover the electronic circuit component, and the heat sink is provided with a recessed portion to cover the electronic circuit component. A heat sink with fins arranged so as to be in contact with each other, a packing made of a rubber material arranged so that the head of the electronic circuit component is in contact with the bottom of the recess, and a peripheral portion of the heat sink with fins and the printed circuit board. An electronic circuit module characterized by being comprised of a sandwiched spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10500785U JPS6214793U (en) | 1985-07-10 | 1985-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10500785U JPS6214793U (en) | 1985-07-10 | 1985-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214793U true JPS6214793U (en) | 1987-01-29 |
Family
ID=30979028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10500785U Pending JPS6214793U (en) | 1985-07-10 | 1985-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214793U (en) |
-
1985
- 1985-07-10 JP JP10500785U patent/JPS6214793U/ja active Pending
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