JPS6315098U - - Google Patents
Info
- Publication number
- JPS6315098U JPS6315098U JP10780986U JP10780986U JPS6315098U JP S6315098 U JPS6315098 U JP S6315098U JP 10780986 U JP10780986 U JP 10780986U JP 10780986 U JP10780986 U JP 10780986U JP S6315098 U JPS6315098 U JP S6315098U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- cooling fin
- heat dissipation
- dissipation block
- skin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 230000009977 dual effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の電子回路モジユールを示す外観図、
第３図は第２図の断面ＡＡを示す図、第４図はデ
ユアルインラインタイプの電子回路部品をプリン
ト基板に実装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインラインタイプの
電子回路部品、９はリードフレーム、１０はスル
ーホール、１１は放熱ブロツクである。なお、各
図中同一符号は同一または相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an external view showing a conventional electronic circuit module,
FIG. 3 is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in-line type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual in-line type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a It is a heat dissipation block. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記冷却フインの両面にロウ付けまたは接着によ
つて接合された矩形金属薄板である２枚のスキン
と、上記スキンの上記冷却フインと接合されてい
る面の反対側の面に設けられかつセラミツクス材
料から成る放熱ブロツクと、第１の面が上記スキ
ンと相対するように配せられるとともに上記第１
の面の反対側の第２の面には電子回路部品が実装
されておりかつ上記電子回路部品は上記放熱ブロ
ツクと適合する位置に配されている２枚のプリン
ト基板とで構成されている事を特徴とする電子回
路モジユール。 A cooling fin made of a corrugated thin metal plate,
Two skins are rectangular thin metal plates bonded to both sides of the cooling fin by brazing or adhesive, and a ceramic material is provided on the surface of the skin opposite to the surface bonded to the cooling fin. a heat dissipation block consisting of a heat dissipation block, the first surface of which is arranged so as to face the skin;
An electronic circuit component is mounted on the second surface opposite to the surface, and the electronic circuit component is composed of two printed circuit boards placed at positions that match the heat dissipation block. An electronic circuit module featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10780986U JPS6315098U (en) | 1986-07-14 | 1986-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10780986U JPS6315098U (en) | 1986-07-14 | 1986-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315098U true JPS6315098U (en) | 1988-02-01 |
Family
ID=30984429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10780986U Pending JPS6315098U (en) | 1986-07-14 | 1986-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315098U (en) |
-
1986
- 1986-07-14 JP JP10780986U patent/JPS6315098U/ja active Pending
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