JPS61123595U - - Google Patents
Info
- Publication number
- JPS61123595U JPS61123595U JP746285U JP746285U JPS61123595U JP S61123595 U JPS61123595 U JP S61123595U JP 746285 U JP746285 U JP 746285U JP 746285 U JP746285 U JP 746285U JP S61123595 U JPS61123595 U JP S61123595U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- conductive rubber
- opposite
- electronic circuit
- skin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920006124 polyolefin elastomer Polymers 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の電子回路モジユールを示す外観図、
第３図は第２図の断面ＡＡを示す図、第４図はデ
ユアルインタイプの電子回路部品をプリント基板
に実装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインタイプの電子回
路部品、９はリードフレーム、１０はスルーホー
ル、１１は熱伝導ラバーである。なお、各図中同
一符号は同一または相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an external view showing a conventional electronic circuit module,
FIG. 3 is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a It is a heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記冷却フインの両面にロウ付けまたは接着によ
つて接合された矩形金属薄板である２枚のスキン
と、上記スキンの上記冷却フインが接合されてい
る面の反対側の面に接着されており、かつポリオ
レフイン系エラストマーとＡｌ２Ｏ３系フイラー
を主成分とし矩形板状に成形された２枚の熱伝導
性ラバーと、第１の面には電子回路部品が実装さ
れており、また上記第１の面の反対側の第２の面
は上記熱伝導ラバーの上記スキンと接着されてい
る面と反対側の面に接するように配した２枚のプ
リント基板とで構成されている事を特徴とする電
子回路モジユール。 A cooling fin made of a corrugated thin metal plate,
two skins that are rectangular thin metal plates bonded to both sides of the cooling fin by brazing or gluing, and bonded to a surface of the skin opposite to the surface to which the cooling fins are bonded; and two thermally conductive rubber sheets formed into a rectangular plate shape mainly composed of a polyolefin elastomer and an Al 2 O 3 filler; electronic circuit components are mounted on the first surface; The second surface opposite to the surface of the thermally conductive rubber is comprised of two printed circuit boards disposed so as to be in contact with the surface of the heat conductive rubber that is bonded to the skin and the opposite surface. electronic circuit module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP746285U JPS61123595U (en) | 1985-01-23 | 1985-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP746285U JPS61123595U (en) | 1985-01-23 | 1985-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123595U true JPS61123595U (en) | 1986-08-04 |
Family
ID=30485837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP746285U Pending JPS61123595U (en) | 1985-01-23 | 1985-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123595U (en) |
-
1985
- 1985-01-23 JP JP746285U patent/JPS61123595U/ja active Pending
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