JPS6322795U - - Google Patents
Info
- Publication number
- JPS6322795U JPS6322795U JP11735386U JP11735386U JPS6322795U JP S6322795 U JPS6322795 U JP S6322795U JP 11735386 U JP11735386 U JP 11735386U JP 11735386 U JP11735386 U JP 11735386U JP S6322795 U JPS6322795 U JP S6322795U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- waves
- thin metal
- circuit components
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 1
Description
第１図はこの考案の一実施例を示す外観図、第
２図は第１図の断面ＣＣを示す図、第３図は従来
の電子回路モジユールを示す外観図、第４図は第
３図の断面ＡＡを示す図、第５図は第３図の断面
ＢＢを示す図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント配線板、５は電子回路
部品、６はコネクタプラグ、７はダクト、８は冷
却空気、９はダクト入口部、１０はダクト出口部
、１１は第１の冷却フイン、１２は第２の冷却フ
イン、１３は第３の冷却フインである。なお、各
図中同一符号は同一または相当部分を示す。
Fig. 1 is an external view showing an embodiment of this invention, Fig. 2 is a view showing cross section CC of Fig. 1, Fig. 3 is an external view showing a conventional electronic circuit module, and Fig. 4 is Fig. 3 FIG. 5 is a diagram showing cross section AA of FIG. 3, and FIG. 5 is a diagram showing cross section BB of FIG. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed wiring board, 5 is an electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is cooling air, 9 is a duct inlet, 10 is a duct outlet, 11 is a first cooling fin, 12 13 is a second cooling fin, and 13 is a third cooling fin. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
の間隔がそれぞれ異なり、かつ上記波の間隔の大
きさによつて順次配置された少なくとも２個以上
の冷却フインと、上記冷却フインの両面にロウ付
けまたは接着によつて接合された矩形金属薄板で
ある２枚のスキンと、一方の面には電子回路部品
が実装されており、かつ上記電子回路部品の実装
されている面と反対側の面は上記スキンと向い合
うように配せられた２枚のプリント配線板とで構
成した事を特徴とする電子回路モジユール。 At least two or more cooling fins formed by forming a thin metal plate into a wave shape, each having a different interval between the waves, and arranged sequentially according to the size of the interval between the waves, and brazing on both sides of the cooling fin. Alternatively, two skins, which are rectangular thin metal plates bonded together by adhesive, have electronic circuit components mounted on one surface, and the surface opposite to the surface on which the electronic circuit components are mounted is An electronic circuit module comprising the skin and two printed wiring boards arranged to face each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735386U JPS6322795U (en) | 1986-07-30 | 1986-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735386U JPS6322795U (en) | 1986-07-30 | 1986-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322795U true JPS6322795U (en) | 1988-02-15 |
Family
ID=31002785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11735386U Pending JPS6322795U (en) | 1986-07-30 | 1986-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322795U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000502516A (en) * | 1996-10-17 | 2000-02-29 | ブラゾニックス インコーポレイテッド | Cold plate with uniform pressure drop and uniform flow |
| JP2010040757A (en) * | 2008-08-05 | 2010-02-18 | Denso Corp | Electronic component cooler |
| JP2020035830A (en) * | 2018-08-28 | 2020-03-05 | 株式会社デンソー | Wave fin and heat exchanger |
-
1986
- 1986-07-30 JP JP11735386U patent/JPS6322795U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000502516A (en) * | 1996-10-17 | 2000-02-29 | ブラゾニックス インコーポレイテッド | Cold plate with uniform pressure drop and uniform flow |
| JP2010040757A (en) * | 2008-08-05 | 2010-02-18 | Denso Corp | Electronic component cooler |
| JP2020035830A (en) * | 2018-08-28 | 2020-03-05 | 株式会社デンソー | Wave fin and heat exchanger |
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