JPS6134765U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6134765U
JPS6134765U JP11984984U JP11984984U JPS6134765U JP S6134765 U JPS6134765 U JP S6134765U JP 11984984 U JP11984984 U JP 11984984U JP 11984984 U JP11984984 U JP 11984984U JP S6134765 U JPS6134765 U JP S6134765U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
substrate
conductor
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11984984U
Other languages
Japanese (ja)
Inventor
勝次 工藤
満夫 桑原
一成 才木
Original Assignee
株式会社明電舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明電舎 filed Critical 株式会社明電舎
Priority to JP11984984U priority Critical patent/JPS6134765U/en
Publication of JPS6134765U publication Critical patent/JPS6134765U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ， Ｂは従来の印刷配線板の表面（部品実装面
）図と裏面（はんだ付面）図、第２図Ａ，Ｂは本考案に
係る印刷配線板の表面（部品実装面）図と裏面（はんだ
付面）図である。 １・・・プリント板（基板）、２・・・導体、３・・・
ダミーの導体。Figures 1A and B are the front (component mounting side) and back (soldering side) views of a conventional printed wiring board, and Figures 2A and B are the front (component mounting side) of the printed wiring board according to the present invention. They are a figure and a back side (soldering side) view. 1... Printed board (board), 2... Conductor, 3...
dummy conductor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に形成される導体パターンに密な部分と疎の部分
を有してなる印刷配線板において、基板が全体的な均一
なパターンとなるよう前記疎の部分にタ′ミーの導体パ
ターンを形成し、かつ基板の表裏面で導体の面積比を１
対１に近づけるように構成したことを特徴とする印刷配
線板。In a printed wiring board in which a conductor pattern formed on a substrate has a dense portion and a sparse portion, a tampered conductor pattern is formed in the sparse portion so that the substrate has an overall uniform pattern. and the area ratio of the conductor on the front and back surfaces of the board is 1.
A printed wiring board characterized in that it is configured to have a ratio close to 1:1.
JP11984984U 1984-08-02 1984-08-02 printed wiring board Pending JPS6134765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11984984U JPS6134765U (en) 1984-08-02 1984-08-02 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11984984U JPS6134765U (en) 1984-08-02 1984-08-02 printed wiring board

Publications (1)

Publication Number Publication Date
JPS6134765U true JPS6134765U (en) 1986-03-03

Family

ID=30678706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11984984U Pending JPS6134765U (en) 1984-08-02 1984-08-02 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6134765U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333898A (en) * 1986-07-28 1988-02-13 新神戸電機株式会社 Manufacture of electromagnetic shielded double-sided printed circuit board
JPH09107159A (en) * 1996-10-07 1997-04-22 Hokuriku Electric Ind Co Ltd Circuit board and method of manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333898A (en) * 1986-07-28 1988-02-13 新神戸電機株式会社 Manufacture of electromagnetic shielded double-sided printed circuit board
JPH09107159A (en) * 1996-10-07 1997-04-22 Hokuriku Electric Ind Co Ltd Circuit board and method of manufacture

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