JPS619867U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS619867U JPS619867U JP9361984U JP9361984U JPS619867U JP S619867 U JPS619867 U JP S619867U JP 9361984 U JP9361984 U JP 9361984U JP 9361984 U JP9361984 U JP 9361984U JP S619867 U JPS619867 U JP S619867U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- insulating substrate
- soldering parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a, bt cは本考案の一実施例による混成
集積回路装置の基板の表面図及び2つの側面図、第2図
はその斜視図である。
第3図atbtCは従来の混成集積回路装置の基板の表
面図及び2つの側面図、第4図a, b, cは他の従
来の混成集積回路装置の表面図及び2つの側面図である
。
1・・・セラミック回路基板、2・・・半田付け部、3
・・・導体(配線)、4・・・端面スルーホール、5・
・・スルーホール、6・・・溝。1a and btc are a top view and two side views of a substrate of a hybrid integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a perspective view thereof. FIG. 3 atbtC is a front view and two side views of a substrate of a conventional hybrid integrated circuit device, and FIGS. 4 a, b, and c are a front view and two side views of another conventional hybrid integrated circuit device. 1... Ceramic circuit board, 2... Soldering part, 3
... Conductor (wiring), 4... End surface through hole, 5.
...Through hole, 6...groove.
Claims (1)
部間の前記絶縁基板間には溝が形成されていることを特
徴とする混成集積回路装置。1. A hybrid integrated circuit device comprising a plurality of soldering parts on an insulating substrate, and a groove is formed between the soldering parts on the insulating substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9361984U JPS619867U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9361984U JPS619867U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS619867U true JPS619867U (en) | 1986-01-21 |
Family
ID=30651459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9361984U Pending JPS619867U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS619867U (en) |
-
1984
- 1984-06-22 JP JP9361984U patent/JPS619867U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS619867U (en) | Hybrid integrated circuit device | |
JPS6016574U (en) | flexible printed wiring board | |
JPS6027472U (en) | circuit board equipment | |
JPS6134765U (en) | printed wiring board | |
JPS6057154U (en) | flexible printed board | |
JPS60176568U (en) | circuit board | |
JPS5939965U (en) | printed wiring board structure | |
JPS5827947U (en) | Hybrid integrated circuit device | |
JPS58146372U (en) | printed wiring board | |
JPS58130371U (en) | printed wiring board | |
JPS6053183U (en) | Printed circuit board bonding equipment | |
JPS59127258U (en) | flexible printed circuit board | |
JPS5989576U (en) | Wiring chip | |
JPS5964249U (en) | thermal head | |
JPH0241474U (en) | ||
JPS5877084U (en) | circuit board | |
JPS60116266U (en) | substrate | |
JPS59170930U (en) | switch device | |
JPS59189257U (en) | printed wiring board | |
JPS6113994U (en) | electronic equipment | |
JPS58146373U (en) | printed wiring board | |
JPS5883790U (en) | Printed wiring board connection device | |
JPS59146813U (en) | flat cable | |
JPS5881949U (en) | integrated circuit board | |
JPS58184787U (en) | flexible cable |