JPS6454392U - - Google Patents
Info
- Publication number
- JPS6454392U JPS6454392U JP14901087U JP14901087U JPS6454392U JP S6454392 U JPS6454392 U JP S6454392U JP 14901087 U JP14901087 U JP 14901087U JP 14901087 U JP14901087 U JP 14901087U JP S6454392 U JPS6454392 U JP S6454392U
- Authority
- JP
- Japan
- Prior art keywords
- skin
- electronic circuit
- circuit component
- cooling fin
- sandwiched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
Description
第1図はこの考案の一実施例を示す断面図、第
2図は従来の電子回路モジユールを示す外観図、
第3図は第2図の断面AAを示す図、第4図はデ
ユアルインタイプの電子回路部品をプリント基板
に実装した状態を示す断面図である。
図において、1は冷却フイン、2はスキン、3
はスペーサ、4はプリント基板、5はフラツトパ
ツクタイプの電子回路部品、6はコネクタプラグ
、7はダクト、8はデユアルインタイプの電子回
路部品、9はリードフレーム、10はスルーホー
ル、11は熱伝導ラバーである。なお、各図中同
一符号は同一または相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an external view showing a conventional electronic circuit module,
FIG. 3 is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a It is a heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記冷却フインの両面にロウ付けまたは接着によ
つて接合された矩形金属薄板である2枚のスキン
と、電子回路部品が実装されており、かつ上記電
子回路部品の実装されている面が上記スキンと向
い合うように配せられた2枚のプリント基板と、
上記スキンと上記電子回路部品とで挟持され、か
つシリコンゴムを主成分とし矩形板状に成形され
た熱伝導ラバーと、上記プリント基板と上記スキ
ンとの周辺部分で挟持されたスペーサとで構成し
た事を特徴とする電子回路モジユール。 A cooling fin made of a corrugated thin metal plate,
Two skins, which are rectangular thin metal plates, are bonded to both sides of the cooling fin by brazing or adhesive, and an electronic circuit component is mounted on the skin, and the surface on which the electronic circuit component is mounted is the skin. Two printed circuit boards placed facing each other,
The heat conductive rubber is sandwiched between the skin and the electronic circuit component, and is made of silicone rubber as a main component and is formed into a rectangular plate shape, and the spacer is sandwiched between the printed circuit board and the skin. An electronic circuit module characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14901087U JPS6454392U (en) | 1987-09-29 | 1987-09-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14901087U JPS6454392U (en) | 1987-09-29 | 1987-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6454392U true JPS6454392U (en) | 1989-04-04 |
Family
ID=31420843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14901087U Pending JPS6454392U (en) | 1987-09-29 | 1987-09-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6454392U (en) |
-
1987
- 1987-09-29 JP JP14901087U patent/JPS6454392U/ja active Pending
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