JPS60103852U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS60103852U
JPS60103852U JP19642483U JP19642483U JPS60103852U JP S60103852 U JPS60103852 U JP S60103852U JP 19642483 U JP19642483 U JP 19642483U JP 19642483 U JP19642483 U JP 19642483U JP S60103852 U JPS60103852 U JP S60103852U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
board
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19642483U
Other languages
Japanese (ja)
Inventor
清水　永
風見　明
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP19642483U priority Critical patent/JPS60103852U/en
Publication of JPS60103852U publication Critical patent/JPS60103852U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案を説明する斜視図、第２図及び第３図は
本考案を説明する横断面図および縦断面図、第４図は本
考案の構造に於ける輻射熱の影響を説明する特性図であ
る。 主な図番の説明、１，２は混成集積回路基板、３は枠体
、４は発熱回路素子、５は他の回路素子、８は外部リー
ドである。Figure 1 is a perspective view explaining the present invention, Figures 2 and 3 are cross-sectional views and vertical cross-sectional views explaining the present invention, and Figure 4 is an illustration of the influence of radiant heat on the structure of the present invention. It is a characteristic diagram. Explanation of main figure numbers: 1 and 2 are hybrid integrated circuit boards, 3 is a frame, 4 is a heating circuit element, 5 is another circuit element, and 8 is an external lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 二枚の良熱伝導性混成集積回路基板を枠体の両面に固着
した混成集積回路装置に於いて、一方の基板に発熱回路
素子を設は他方の基板に他の回路素子を設け、前記他方
の基板から前記一方の基板を離間させて輻射熱による温
度上昇を防止して成る混成集積回路装置。In a hybrid integrated circuit device in which two highly thermally conductive hybrid integrated circuit boards are fixed to both sides of a frame, a heating circuit element is provided on one board, another circuit element is provided on the other board, and the other circuit element is provided on the other board. 1. A hybrid integrated circuit device, wherein said one substrate is separated from said substrate to prevent temperature rise due to radiant heat.
JP19642483U 1983-12-20 1983-12-20 Hybrid integrated circuit device Pending JPS60103852U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19642483U JPS60103852U (en) 1983-12-20 1983-12-20 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19642483U JPS60103852U (en) 1983-12-20 1983-12-20 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS60103852U true JPS60103852U (en) 1985-07-15

Family

ID=30421425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19642483U Pending JPS60103852U (en) 1983-12-20 1983-12-20 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS60103852U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312854U (en) * 1986-05-19 1988-01-27
WO2013121522A1 (en) * 2012-02-14 2013-08-22 三菱電機株式会社 Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (en) * 1972-07-19 1974-03-16
JPS5729319U (en) * 1980-07-25 1982-02-16
JPS5812952B2 (en) * 1975-05-16 1983-03-10 三菱レイヨン株式会社 Jiyuunanna Cellulo - Sukeifushiyokufuno Seizouhou

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (en) * 1972-07-19 1974-03-16
JPS5812952B2 (en) * 1975-05-16 1983-03-10 三菱レイヨン株式会社 Jiyuunanna Cellulo - Sukeifushiyokufuno Seizouhou
JPS5729319U (en) * 1980-07-25 1982-02-16

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312854U (en) * 1986-05-19 1988-01-27
WO2013121522A1 (en) * 2012-02-14 2013-08-22 三菱電機株式会社 Semiconductor device
US9190397B2 (en) 2012-02-14 2015-11-17 Mitsubishi Electric Corporation Semiconductor device

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