JPS60118779U

JPS60118779U - Semiconductor test substrate with heating device

Info

Publication number: JPS60118779U
Application number: JP606384U
Authority: JP
Inventors: 守谷　忠司
Original assignee: 利昌工業株式会社
Priority date: 1984-01-19
Filing date: 1984-01-19
Publication date: 1985-08-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はプリント配線板の構造の一例を示すための斜視
図、第２図および第３図はこの考案の実施例を示すため
のイ蓋板およびロブリント配線板の要部断面図、第４図
および第５図は加熱装置としてのヒータの構造を例示す
るための断面図、第６図イはヒータの応用例を示すため
の平面図、同口はその拡大断面図、第７図は蓋板内面の
一部に埋め込みヒータを取り付けた例を模式的に示した
断面図、第８図は蓋板内面に加熱装置を装着した、状態
を例示するための一部切欠の斜視図である。１．１′・・・絶縁基板、２・・・回路、２′・・・端
子、３．４・・・半導体、３’、　　４’・・・リード
部、５・・・固定用穴、６・・・エラスチックコネクタ
ー、７・・・弾性体、８・・・蓋板、９・・・ヒータ、
１０・・・接着剤、１１・・・発熱体、１２・・・導線
、１３・・・保護材、１４・・・充填材、１５・・・プ
ラスチック板、１６・・・金属板。第２図（イ）　　「ミ７才ｉｏ、FIG. 1 is a perspective view showing an example of the structure of a printed wiring board, FIGS. 2 and 3 are sectional views of main parts of a cover board and a Roblint wiring board showing an embodiment of this invention, and FIG. 5 and 5 are cross-sectional views to illustrate the structure of the heater as a heating device, FIG. FIG. 8 is a cross-sectional view schematically showing an example in which an embedded heater is attached to a part of the inner surface of the plate, and FIG. 8 is a partially cutaway perspective view for illustrating a state in which a heating device is attached to the inner surface of the lid plate. 1.1'...Insulating board, 2...Circuit, 2'...Terminal, 3.4...Semiconductor, 3', 4'...Lead portion, 5...Fixing hole, 6... Elastic connector, 7... Elastic body, 8... Lid plate, 9... Heater,
DESCRIPTION OF SYMBOLS 10... Adhesive, 11... Heating element, 12... Conductor, 13... Protective material, 14... Filler, 15... Plastic plate, 16... Metal plate. Figure 2 (a) “My 7 year old io,

Claims

[Scope of utility model registration request]

A printed wiring board provided with a fixing hole, a fixing frame, or a fixing claw for determining and fixing a semiconductor device, and the main body of the semiconductor placed on this printed wiring board are pressed together to connect the leads of the semiconductor and the printed wiring. A semiconductor testing board consisting of a lid plate provided with an elastic body that brings the terminals on the board into close contact, with a heater provided at least inside the elastic body or on the entire surface or part of the lid plate to heat or keep the semiconductor warm. A semiconductor test substrate with a heating device characterized by: