JPS5917870U - Flat semiconductor package test substrate - Google Patents

Flat semiconductor package test substrate

Info

Publication number
JPS5917870U
JPS5917870U JP11248182U JP11248182U JPS5917870U JP S5917870 U JPS5917870 U JP S5917870U JP 11248182 U JP11248182 U JP 11248182U JP 11248182 U JP11248182 U JP 11248182U JP S5917870 U JPS5917870 U JP S5917870U
Authority
JP
Japan
Prior art keywords
semiconductor package
test substrate
package test
flat semiconductor
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11248182U
Other languages
Japanese (ja)
Other versions
JPH0120701Y2 (en
Inventor
守谷　忠司
Original Assignee
利昌工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 利昌工業株式会社 filed Critical 利昌工業株式会社
Priority to JP11248182U priority Critical patent/JPS5917870U/en
Publication of JPS5917870U publication Critical patent/JPS5917870U/en
Priority to US06/875,517 priority patent/US4766371A/en
Application granted granted Critical
Publication of JPH0120701Y2 publication Critical patent/JPH0120701Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来のフラットパッケージ型半導素子試験用
ソケットの側面図であり、第２図イ９口は、この考案の
フラットパッケージ型半導体素子試験用基板を例示する
ための一部拡大断面図、第３図は第２図に対応ずや主要
部の平面図である。 １．１′・・・絶縁基板、２・・・銅箔回路、２′・・
・端子部、３・・・フラットパッケージ、４・・・テー
パ、５・・・固定板、６・・・固定枠、７・・・耐熱性
ゴムシート、８・・・突起、９・・・穴。 補正　昭５８．　８．２３ 考案の名称を次のように補正する。 ■フラット型半導体パッケージ試験用基板実用新案登録
請求の範囲を次のように補正する。 Ｏ実用新案登録請求の範囲 電気回路を形成したプリント配線板の所定位置に、フラ
ット型半導体パッケージのコーナ部もしくは辺部の２力
所以上で位置決めするための固定板を有する固定枠を取
り付けたことを特徴とするフラット型半導体パッケージ
試験用基板。 図面の簡単な説明を次のように補正する。 明細書第６頁第５〜６行目および第７〜８行目の「型半
導体素子」を削除します。FIG. 1 is a side view of a conventional flat package type semiconductor device testing socket, and FIG. 3, which corresponds to FIG. 2, are plan views of the main parts. 1.1'...Insulating board, 2...Copper foil circuit, 2'...
・Terminal part, 3...Flat package, 4...Taper, 5...Fixing plate, 6...Fixing frame, 7...Heat-resistant rubber sheet, 8...Protrusion, 9... hole. Amended 1984. 8.23 The title of the invention shall be amended as follows. ■The scope of the claim for utility model registration of flat type semiconductor package test substrate shall be amended as follows. O Utility Model Registration Scope of Claims A fixing frame having fixing plates for positioning at two or more force points on the corner or side of a flat semiconductor package is attached to a predetermined position of a printed wiring board on which an electric circuit is formed. A flat semiconductor package test board featuring: The brief description of the drawing has been amended as follows. Delete "type semiconductor device" from lines 5 to 6 and lines 7 to 8 of page 6 of the specification.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気回路を形成したプリント配線板の所定位置に、フラ
ットパッケージ型半導体素子のコーナ部もしくは辺部の
２力所以上で位置決めするための固定板を有する固定枠
を取り付けたことを特徴とするフラットパッケージ型半
導体素子試験用基板。A flat package characterized in that a fixing frame having a fixing plate for positioning a flat package type semiconductor element at two or more force points at a corner or a side is attached to a predetermined position of a printed wiring board on which an electric circuit is formed. Substrate for testing type semiconductor devices.
JP11248182U 1982-07-24 1982-07-24 Flat semiconductor package test substrate Granted JPS5917870U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11248182U JPS5917870U (en) 1982-07-24 1982-07-24 Flat semiconductor package test substrate
US06/875,517 US4766371A (en) 1982-07-24 1986-06-19 Test board for semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11248182U JPS5917870U (en) 1982-07-24 1982-07-24 Flat semiconductor package test substrate

Publications (2)

Publication Number Publication Date
JPS5917870U true JPS5917870U (en) 1984-02-03
JPH0120701Y2 JPH0120701Y2 (en) 1989-06-21

Family

ID=30260740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11248182U Granted JPS5917870U (en) 1982-07-24 1982-07-24 Flat semiconductor package test substrate

Country Status (1)

Country Link
JP (1) JPS5917870U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156580U (en) * 1984-09-17 1986-04-16

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53160369U (en) * 1977-05-23 1978-12-15
JPS5467672A (en) * 1977-11-09 1979-05-31 Hitachi Ltd Jig of inspecting characteristic of electronic parts
JPS55146938A (en) * 1979-05-02 1980-11-15 Chiyou Lsi Gijutsu Kenkyu Kumiai Aging device for semiconductor element
JPS58140479U (en) * 1982-03-16 1983-09-21 日本電気ホームエレクトロニクス株式会社 Semiconductor device characteristic measuring device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53160369U (en) * 1977-05-23 1978-12-15
JPS5467672A (en) * 1977-11-09 1979-05-31 Hitachi Ltd Jig of inspecting characteristic of electronic parts
JPS55146938A (en) * 1979-05-02 1980-11-15 Chiyou Lsi Gijutsu Kenkyu Kumiai Aging device for semiconductor element
JPS58140479U (en) * 1982-03-16 1983-09-21 日本電気ホームエレクトロニクス株式会社 Semiconductor device characteristic measuring device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156580U (en) * 1984-09-17 1986-04-16

Also Published As

Publication number Publication date
JPH0120701Y2 (en) 1989-06-21

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