JPS6156580U - - Google Patents

Info

Publication number
JPS6156580U
JPS6156580U JP13933784U JP13933784U JPS6156580U JP S6156580 U JPS6156580 U JP S6156580U JP 13933784 U JP13933784 U JP 13933784U JP 13933784 U JP13933784 U JP 13933784U JP S6156580 U JPS6156580 U JP S6156580U
Authority
JP
Japan
Prior art keywords
component
inclined part
lead
view
socket body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13933784U
Other languages
Japanese (ja)
Other versions
JPH0124634Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984139337U priority Critical patent/JPH0124634Y2/ja
Publication of JPS6156580U publication Critical patent/JPS6156580U/ja
Application granted granted Critical
Publication of JPH0124634Y2 publication Critical patent/JPH0124634Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す図で、ａは
平面図、ｂはＡＡ′断面図、ｃは部分斜視図であ
る。第２図は従来の構成例を示す図で、ａは側面
図、ｂは平面図である。第３図は４方向フラツト
パツケージ形ＩＣの平面図（リード曲との例を示
す図）である。第４図は吸着及び押え兼用形吸着
押え具の一例を示す図である。 １：ソケツト本体、５：ＩＣ部品、５ａ：リー
ド片、８：ガイド部、８ａ：傾斜部、９：吸着コ
レツト、１０：リード押え。 FIG. 1 is a diagram showing an embodiment of this invention, in which a is a plan view, b is a sectional view taken along line AA', and c is a partial perspective view. FIG. 2 is a diagram showing an example of a conventional configuration, in which a is a side view and b is a plan view. FIG. 3 is a plan view of a four-way flat package type IC (a diagram showing an example of lead music). FIG. 4 is a diagram showing an example of a suction and presser type suction and presser. 1: Socket body, 5: IC component, 5a: Lead piece, 8: Guide portion, 8a: Inclined portion, 9: Suction collet, 10: Lead holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソケツト本体１上面にＩＣ部品５のリード片５
ａをガイドするための傾斜部８ａを有するガイド
部８を一体成形し、その傾斜部８ａに沿つてＩＣ
部品５を下降又は落下させる機構９及びリード押
え機構１０を有することを特徴とする半導体検査
装置。 The lead piece 5 of the IC component 5 is placed on the top surface of the socket body 1.
A guide part 8 having an inclined part 8a for guiding the IC is integrally molded, and the IC is inserted along the inclined part 8a.
A semiconductor inspection device characterized by having a mechanism 9 for lowering or dropping a component 5 and a lead holding mechanism 10.
JP1984139337U 1984-09-17 1984-09-17 Expired JPH0124634Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984139337U JPH0124634Y2 (en) 1984-09-17 1984-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984139337U JPH0124634Y2 (en) 1984-09-17 1984-09-17

Publications (2)

Publication Number Publication Date
JPS6156580U true JPS6156580U (en) 1986-04-16
JPH0124634Y2 JPH0124634Y2 (en) 1989-07-25

Family

ID=30697713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984139337U Expired JPH0124634Y2 (en) 1984-09-17 1984-09-17

Country Status (1)

Country Link
JP (1) JPH0124634Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0285373U (en) * 1988-12-19 1990-07-04

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5389271U (en) * 1976-12-23 1978-07-21
JPS5435165U (en) * 1977-08-12 1979-03-07
JPS5631478U (en) * 1979-08-17 1981-03-27
JPS5662690U (en) * 1979-10-19 1981-05-27
JPS5917870U (en) * 1982-07-24 1984-02-03 利昌工業株式会社 Flat semiconductor package test substrate
JPS5942982U (en) * 1982-09-14 1984-03-21 利昌工業株式会社 Semiconductor package test substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435165B2 (en) * 1973-03-03 1979-10-31
JPS5917870B2 (en) * 1976-02-19 1984-04-24 株式会社東芝 Pulse laser device
JPS5362212A (en) * 1976-11-15 1978-06-03 Fujita Corp Method of preventing freezing pressure in underground tank for storing loww temperature liquids
JPS5942982B2 (en) * 1979-02-19 1984-10-18 松下電器産業株式会社 Electrode formation method for compound semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5389271U (en) * 1976-12-23 1978-07-21
JPS5435165U (en) * 1977-08-12 1979-03-07
JPS5631478U (en) * 1979-08-17 1981-03-27
JPS5662690U (en) * 1979-10-19 1981-05-27
JPS5917870U (en) * 1982-07-24 1984-02-03 利昌工業株式会社 Flat semiconductor package test substrate
JPS5942982U (en) * 1982-09-14 1984-03-21 利昌工業株式会社 Semiconductor package test substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0285373U (en) * 1988-12-19 1990-07-04

Also Published As

Publication number Publication date
JPH0124634Y2 (en) 1989-07-25

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