JPH0124634Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an inspection device for flat package type electronic components, and in particular to electrical contact in a test head.

<Conventional technology> Conventionally, open/close sockets have been used to measure flat package semiconductor integrated circuit components (hereinafter referred to as IC components), such as SOPs, mini molds, 2-way flats, 4-way flats, etc. Ta.
A side view of this opening/closing socket is shown in FIG. 2a, and a plan view of the contact portion is shown in FIG. 2b. That is, the IC component 5 is inserted into the socket body 1', the top cover 2 is closed, and the lead piece 5a of the IC component 5 is pressed against the contact 4 with a constant pressure by the fixing lever 3 to ensure electrical contact. Normally, the socket body 1' is connected to an electronic measuring device through the contact 4 to determine whether the parts are good or not.

Further, as another technique, there is Utility Application No. 58-113721 "Semiconductor Inspection Apparatus" filed by the present applicant. In this technique, a guide plate having an inclined portion for guiding lead pieces of an IC component is attached or bonded onto the socket body 1.

<Problems to be solved by the invention> Therefore, in the former of the above-mentioned conventional techniques,
Since the flat type IC component 5 has a large number of terminals and is small, the width and pitch of the lead pieces 5a are small, and some have long legs.When the IC component 5 is inserted into the socket body 1', Since the lead pieces 5a (particularly the lead pieces located at both ends of a group of lead pieces arranged in parallel in the same direction) collide with the lead guide edge 6, lead bending tends to occur.

For this reason, some lead bends 5b (indicated by broken lines) as shown in Fig. 3 occurred during the IC assembly process.
When inserting the lead into the socket body 1', it does not align with the lead guide edge 6 of the socket body 1', and it overlaps with the molded part surface 7 of the socket body 1', resulting in poor contact and lead bending. do. This has been dealt with by manually pushing the lead into the guide edge 6 or by correcting the bent lead 5b, but the above method is impossible, especially in automatic IC component insertion/extraction equipment (autohandler). There was a problem with insufficient contact.

Further, even if the lead is not bent, if the insertion position of the IC component 5 is not fully aligned with respect to the socket body 1, the lead piece 5a will not enter the guide edge 6 and will not fit into the upper surface 7 of the socket body 1. If the IC component 5 or the lead piece 5a is pressed from above at this time, the lead may be bent.

Therefore, the above-mentioned Utility Application No. 58-113721 "Semiconductor inspection equipment" is a technology that solves the above problems,
Since the guide plate is attached or glued onto the socket body, there is an advantage that the existing socket body can be used as is without modifying or manufacturing a new socket body. Since a high degree of precision is required, there was a problem in that the work was quite difficult, such as mounting using a microscope.

<Means for solving the problems> In order to solve these problems, this invention
A guide part having an inclined part for guiding the lead piece of the IC component is integrally molded on the upper surface of the socket main body, and a mechanism for lowering or dropping the IC part along the inclined part and a lead holding mechanism are provided.

<Operation> After the IC component to be inspected is positioned, it is transported above the socket body and lowered. This allows the IC component to be inserted into a predetermined position on the socket body. In this state, the lead pressing mechanism presses the lead piece of the IC component from above to ensure electrical contact between the lead piece and the contact.

If the IC component is a bent lead product,
As the IC component is lowered, the bent lead piece comes into contact with the inclined part of the guide part and descends along the inclined part, and is finally settled in a predetermined position, and is pressed by the lead holding mechanism. You get the right contact with the contact.

Further, the lowering of the IC component is performed by restraint of a mechanism that lowers the IC component until the height of the IC component from the socket body reaches a set constant value, and the IC component is lowered by the restraint of the mechanism that lowers the IC component, until the height of the IC component from the socket body reaches the fixed value. Then the above
It is also possible to adopt a configuration in which the IC component is released from the above mechanism and falls under its own weight.

If such a configuration is adopted, the above-mentioned socket may be damaged when dropped onto the socket body due to an error during position adjustment, a positional shift occurring during transportation or dropping, etc.
Even if the position of the IC component is slightly shifted, as long as the shift is within a range where the lead pieces at the ends of the lead piece group come into contact with the slope, the IC component will fall to the predetermined position due to its own weight.

At this time, if the IC component is a bent lead product, the bent lead piece comes into contact with the inclined part,
The IC component may not be able to reach a predetermined position on the socket body, but if the lead presser mechanism presses the lead piece from above in this state, the IC component will descend and the curved The ivy reed piece slides on the inclined part,
Eventually it will fall into place.

<Example> Figure 1 shows an example of this invention.
Figure 1a shows the IC component inserted into the socket body, Figure 1b shows the AA' section of the socket body, and Figure 1c shows the guide portion.

In the figure, 1 is a socket body formed by a mold, 4 is an embedded metal contact,
It has spring properties in the vertical direction. 8 is the socket body 1
It is a guide part that is integrally molded and protrudes upward at the four corners of the upper surface 7, and is used to guide the IC component 5 as shown in FIG.
An inclined portion 8a is provided on the side into which the lead piece 5a is inserted. Reference numeral 8b denotes a relief provided so that the IC component 5 does not get caught at the corner of the main body. The slope of the inclined portion 8a is approximately 50° to 85°, and the height of the guide portion 8 is approximately 2.5 to 5 mm. Reference numeral 9 denotes a conveying tool (suction collet) that picks up the IC component 5 from above and moves up and down.
The IC component 5 is lowered by lowering the collet 9 to a position where all of the lead pieces 5a contact the upper ends of the contacts 4, and the lead pieces 5a are pressed down with a specified pressure by the lead pressers 10 in four directions, and the leads are removed. Approximately 0.2 kg of pressure is applied to each terminal of the piece 5a to make electrical contact with the contactor 4, which is used as input/output to the test machine.

Therefore, a flat package IC component 5 with lead pieces 5a protruding in four directions as shown in FIG.
This is a two-way lead type flat package IC, and the lead piece 5a is bent outward as shown by the broken line.
Even in case b, the collet 9 contacts the inclined part 8a of the guide part 8 during its descent, and even if it descends further and reaches the home position, it contacts the inclined part 8a, and even if it descends further and reaches the home position, the slope remains. The lead piece 5b, which is stopped in the middle of the part 8a, is vertically lowered from the IC lead guide edge 6 of the socket body 1 along the inclined part 8a along the inclined part 8a by lowering the lead holder 10, and is able to make proper contact. be.

Note that the width of the lead holder 10 is determined from the width dimension from the lead piece 5a at one end to the lead piece 5a at the other end in four or two directions of the socket contactor 4.
This is to reduce the size by about 0.2mm. However, Figure 1b
In this figure, only two directions are shown, and the other two directions are omitted.

In addition, as an example in which the suction collet 9 and the lead presser 10 are combined, the suction presser 11 shown in FIG. 4 attaches a vacuum in the hollow and sucks and presses the IC component 5.
But it is possible.

This embodiment has been described above as a countermeasure against lead bending, but as shown in FIG. 1, by releasing the suction at the position of the upper gap L between the lead piece 5a and the socket body 1 during the descent by the suction collet 9, Let the IC part 5 fall naturally, and then
A predetermined contact can be obtained. This method is also effective for bending the lead, but if the IC component 5 is suctioned without sufficient position adjustment of about ±0.1 mm or the position is misaligned due to suction, the lead piece 5a may be placed directly above the contact. Even when the guide part 8 is not lowered, the position can be adjusted by dropping it onto the inclined part 8a of the guide part 8. Therefore, there is an advantage that the position regulation at the previous stage can be performed in a simplified form.

Note that the gap L is suitably about 0.2 to 1.0 mm, and in reality, the upper limit is a position lower than the upper surface of the guide portion 8.

In addition, in this embodiment, the sloped part 8a of the guide part 8 has been shown as an example in which a sloped surface is formed continuously from the upper end of the lead guide edge 6, but the sloped part 8a of the guide part 8 is continuously formed vertically from the upper end of the lead guide edge 6. It is also conceivable that the side surface of the guide portion 8 is formed at , and an inclined surface is formed continuously from the upper end side of the side surface.

Furthermore, the inclined surface is not limited to a flat surface, but may be a suitable curved surface.

In addition, the suction collet 9 and the lead presser 10
As an example that can also be used as a suction presser 11 shown in FIG. 4, a vacuum is attached to a hollow space and the IC component 5 is sucked and pressed.

Furthermore, although the above embodiment has been explained based on a four-way flat package type IC component, this invention is not limited thereto;
It can also be applied to mini-mold, two-way flat type, etc. IC parts. For example, when the present invention is applied to the two-way flat type IC component, only four inclined portions are provided, but the operation is the same as that of the previous embodiment.

<Effects of the invention> As explained in detail above, this invention integrally molds the guide part on the socket body, and utilizes the sloped part of the guide part to prevent the IC component from bending or bending the lead. Even if the position of the IC component is not properly regulated, the IC component can be placed in a predetermined position and brought into contact with the contacts of the socket, so automatic insertion in the autohandler can be performed without using pattern recognition. In addition, since the permissible range of the position adjustment of the IC component is relaxed in the case of manual operation, there is an effect that the operability is improved.

Furthermore, since the guide portion is formed integrally with the socket main body, the problem of difficulty in mounting the guide plate in the structure in which the guide plate is attached is solved.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of this invention, in which a is a plan view, b is a sectional view along AA', and c is a partial perspective view. FIG. 2 is a diagram showing an example of a conventional configuration, in which a is a side view and b is a plan view. FIG. 3 is a plan view of a four-way flat package type IC (a diagram showing an example of lead music). FIG. 4 is a diagram showing an example of a suction and presser type suction and presser. 1: Socket body, 5: IC component, 5a: Lead piece, 8: Guide part, 8a: Inclined part, 9: Suction collet, 10: Lead holder.

Claims (1)

[Claims for Utility Model Registration] The socket body 1 has a guide portion 8 on the upper surface thereof, which is composed of a plurality of inclined portions 8a for guiding a plurality of lead pieces 5a of the IC component 5, and the socket body 1
In the flat package type IC component 5 inspection device, which is equipped with a mechanism 9 for lowering or dropping and loading the IC component 5 on the upper part of the socket, and a lead piece holding mechanism 10, the guide section 8 is integrated into the socket body 1. The molded inclined portion 8a is formed of a surface parallel to the protruding direction of the lead piece 5a, and the shortest distance between the opposing inclined portions 8a is the plurality of lead pieces guided by the opposing inclined portions 8a. 5a.