JPH08306830A - Ic package positioning method of characteristics classification equipment, and its structure - Google Patents

Abstract

PURPOSE: To provide accurate and stable positioning structure of an IC package of a characteristics classification equipment. CONSTITUTION: IC package positioning structure of a characteristics classification equipment mounts an IC package and brings an IC lead into contact connection with a socket terminal 16a. The structure is provided with a positioning block 10, a spring 17, and a terminal presser foot 15 having plunger mechanism. The positioning block 10 is arranged above an IC socket part, and has taper guides 13, 14 formed on both ends in the X direction of the IC package mounting position and a plurality of square guide pins 11, 12 formed on both ends in the Y direction. The spring 17 engages freely the positioning block 10, in the vertical direction, with the IC socket part. The plunger mechanism brings the IC lead into contact with the IC socket terminal while pressing the IC package, after the IC package is mounted on the positioning block 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package positioning method for a characteristic selection device and its structure when performing characteristic selection in an IC package characteristic selection device.

[0002]

2. Description of the Related Art Surface mount type IC packages (SOP,
The device used in the characteristic selection process (QFP, SOJ, etc.) is called a handler. As is well known, a handler is a device that automatically puts assembled LSIs (ICs) into a test device and automatically classifies and stores them according to characteristic results. Among the above IC packages,
SOP is a small outline package, QFP
Is a quad flat package and SOJ is an abbreviation for small outline J-leaded package.

First, a predetermined number of LSs that have been assembled
The I device, that is, the IC package 1 is stored in a storage container as shown in FIGS. FIG. 3 shows a tray type storage container,
FIG. 4 shows a magazine type. 5 (a)-
(D) is a partial configuration diagram of the above-mentioned handler, and is an operation explanatory diagram for explaining a state in which the IC package 1 is inserted into the characteristic selection device 6 in this handler.

In this handler, the IC package 1 stored in the tray 4 or the storage container as shown in the magazine 4a is stored in the socket 3 of the characteristic selection device 6 by the robot 5 as shown in FIG. It is sucked and conveyed to the upper side, and then lowered to the upper surface of the positioning guide 2 of the socket portion 7 as shown in FIG. Next, subsequently, as shown in FIG. 5C, the suction is released (OFF), guided by the positioning guide 2, and stored in the socket 3. Then, in this state, the measurement for the characteristic test is performed,
After receiving the determination result of acceptability, the robot 5 or the like again transports and stores it in a predetermined storage container.

[0005]

However, in the conventional IC package positioning method and its mechanism as described above, the positioning mechanism for picking up the IC package by the transfer robot or the like and mounting it on the socket is as shown in FIG. As shown in Fig. 2, the positioning by dropping the socket part into the positioning guide part is often used.
-Small packages such as 8p (8-pin SOP) are lightweight and small, so the IC package is caught on the positioning guide of the socket in the middle, resulting in an oblique state as shown in Fig. 5 (d). There is a problem that it will end up. Then, in such a state, the positioning cannot be performed reliably, the socket terminal and the IC lead corresponding thereto are not in contact with each other, so-called contact failure occurs, and the lead of the IC is deformed. There is a problem that the socket and the terminal retainer are immediately damaged.

[0006]

According to the present invention, there is provided an IC package positioning method for a characteristic selecting device, wherein an IC socket of the characteristic selecting device having a plurality of contact pins is provided with taper guides at both ends in the X direction of the IC package and both ends in the Y direction. A positioning block for positioning each of the plurality of rectangular guide pins is arranged in a socket portion composed of an IC socket, the positioning block is vertically locked to the IC socket, and the IC package is mounted on the positioning block. Is pressed to connect the leads of the IC package to the contact pins.

Further, the IC of the characteristic selection apparatus according to the present invention
The package positioning structure is arranged above the IC socket part in the IC package positioning structure of the characteristic selection device in which the IC package is mounted and the IC lead and the socket terminal of the IC socket part are contact-connected.
A positioning block having taper guides provided at both ends in the X direction of the package mounting position and a plurality of angular guide pins provided at both ends in the Y direction, and the positioning block is vertically movable with respect to the IC socket portion. It has an automatic locking means for stopping and a terminal retainer having a plunger mechanism for contacting the IC lead with the socket terminal while pressing the IC package after mounting the IC package on the positioning block. Here, it is convenient and preferable that the above-mentioned automatic locking means that locks vertically is operated by a spring force.

[0008]

According to the present invention, the positioning block for positioning both ends of the IC package in the X direction by the taper guide and the two ends in the Y direction by the plurality of angular guide pins are arranged in the socket portion of the IC socket. Since the IC package is mounted on the positioning block while being moved up and down freely, the IC package is pressed by, for example, a terminal retainer to connect the lead of the IC package and the contact pin,
Particularly, since the guide pins are accommodated between the corner-shaped guide pins and the direction without the lead is guided by the taper of the taper guide, the IC package is accurately positioned.

[0009]

1 is a schematic view for explaining the structure of an embodiment of a positioning block used in an IC package positioning method of a characteristic selection device according to the present invention. 2 is an explanatory view showing a state when the positioning block is attached to the socket portion 16. In this embodiment, as an example, the positioning means for the SOP and 8P of a small and lightweight IC package will be described. 1 and 2, the positioning block 10 includes a socket terminal 16a including a plurality of contact pins instead of the positioning guide 2 provided in the socket portion 7 of the conventional characteristic selecting device 6 shown in FIG. Used in the socket section 16.

The positioning block 10 has a central portion that guides and supports the IC package (not shown in FIG. 1) in four directions by guide pins 11, 11a, 12, 12a and opposing taper guides 13, 14 to form a socket. Although not shown in FIG. 1 for positioning, the IC package 1 is provided with leads in two directions (Y direction) and other directions in which the leads perpendicular to this direction are not provided. The shape of the guide is greatly different from the two directions (X direction). That is, the guide pins 11 (including 11a) in the lead direction (Y direction), 12 (12a)
Is also provided in a position existing between the leads when the IC package is dropped, and is formed to have a thickness (height) up to the bent portion of the leads in order to further increase the strength. There is. Further, the taper guides 13 and 14 in the direction without lead (X direction) are the guide pins 11 and 1.
It is formed as a guide piece larger than 1a, 12, 12a.

Further, as described above, the taper guide 13,
Since 14 has a structure that does not contact the socket terminal 16a and the IC lead (not shown), the material is SUS.
It is made of a metal such as (non-rust steel) material or SK (carbon steel) material. The dimensions of L1 between the taper guides 13 and 14 (see the middle left diagram in FIG. 1) and L2 between the guide pins 11 and 11a (see the right diagram in FIG. 1) are as follows. The size (size) is sufficient to absorb the play of 4a and the teaching error of the robot 5.

Next, the operation will be described. First, the IC package 1 is adsorbed and taken out from the storage container such as the tray 4 and the magazine 4a from the supply unit (not shown), and the socket portion 16 of the characteristic selection device (not shown) is provided by the robot 5 or the like.
Transport above. The positioning block 10 is housed in the central portion of the socket portion 16, but the socket portion 16 includes the upper flat surface portion of the socket portion 16 and the socket portion 16.
A slight vertical movement is possible by the action of the springs 17 which are provided in the bottom portion of, for example, two pairs of holes 18 and holes 18a, respectively (see the lower left diagram of FIG. 2). When the IC package 1 is mounted on the positioning block 10, a gap of about 0.1 to 0.2 mm is formed between the bottom surface of the IC lead and the top surface of the socket terminal 16a. As a result, the IC package 1
Without hooking the lead of
Reliable positioning is possible.

Further, in a state where the positioning block 10 is installed in the socket portion 16, as shown in the upper left diagram of FIG. 2, the corner-shaped guide pins 11, 12 and the like are provided between the adjacent socket terminals 16a. Although installed, the clearance between them and the socket terminal 16a is about 0.1 mm, so a durable metal (for example, SUS) can be used instead of the conventional insulator such as PEEK material. PE
EK is a common name for polyether ether ketone and is known as a crystalline heat-resistant resin. Further, the inclination of the inwardly tapered portions (see FIG. 1) of the guide pins 11, 11a, 12, 12a and the tapered guides 13, 14 is set to 9 °, which is the same as the taper angle of the lower die of the IC package 1. This allows more accurate positioning when the IC package 1 is dropped.

In the case of measuring the characteristics, when the IC lead and the socket terminal 16a are contacted with each other, the tip of the IC lead is pressed by the portion A inside the terminal retainer 15 made of an insulating block to make contact. There is. However, in this embodiment, when the IC package 1 is mounted on the positioning block 10, there is a gap of about 0.2 mm between the bottom surface of the IC lead and the socket terminal 16a. This may cause the lead to float and bend. Therefore, as a countermeasure, a plunger mechanism is provided in the terminal retainer 15, and first, the upper surface of the IC package 1 is pressed by this plunger mechanism to
After the lead and the socket terminal 16a come into contact with each other, by pressing the tip of the IC lead with the terminal retainer 15,
The structure is such that the IC lead and the socket terminal 16a are contact-connected.

Among the surface mount type IC packages,
In particular, I described the positioning method and its structure for small and lightweight SOP / 8P packages, including QFP, SOJ and P.
Also in other medium-sized surface mount type IC packages such as LCC (Plastic Leaded Chip Carrier, etc.), highly stable positioning can be realized by changing the taper angle and various dimensions of the positioning block.

As described in detail above, according to this embodiment, both ends of the IC package in the X direction are tapered guides, and Y guides are provided.
After positioning the positioning block, which positions each end in the direction by a plurality of angled guide pins, in the socket portion of the IC socket, move the positioning block up and down in the IC socket while locking it, and after mounting the IC package on the positioning block. Since the IC package is pressed by, for example, a terminal retainer to connect the leads of the IC package and the contact pin to each other and the structure thereof is used to position the IC package of the characteristic selection device, a guide pin with a corner shape is used. Since each lead terminal is accommodated between the lead terminals and the lead-free direction is guided by the taper of the taper guide, the IC package can be accurately positioned. As a result, damage to the socket and the terminal retainer is prevented, and the quality of the lead appearance is improved.

[0017]

As described above in detail, according to the present invention, when the IC package of the characteristic selecting device is positioned, the socket I of the characteristic measuring device of the characteristic selecting device is I-shaped.
Since the positioning block of the C package is installed, and in particular, the angular guide pin is provided in the positioning block between the socket terminals serving as the contact pins, each angular guide pin is I
Since it is locked in the socket with the C lead interposed, accurate positioning of the IC package can be achieved. Therefore, damage to the socket and the terminal retainer is prevented, stable IC package positioning is performed, and quality improvement of the lead appearance is expected.

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating a structure of an embodiment of a positioning block of an IC package of a characteristic selection device of the present invention.

FIG. 2 is an explanatory diagram showing an example of a state in which the positioning block of FIG. 1 is attached to a socket part.

FIG. 3 is an explanatory view of one container of a predetermined number of IC packages that have been assembled.

FIG. 4 is an explanatory diagram of another storage container for a predetermined number of IC packages that has been assembled.

FIG. 5 is an explanatory diagram illustrating a state in which an IC package is attached to a conventional handler.

[Explanation of symbols]

 1 IC package 2 Positioning guide 3 Socket 4 Tray 4a Magazine 5 Robot 6 Characteristic selection device 7 Socket part 10 Positioning block 11, 11a, 12, 12a Guide pin 13, 14 Tapered guide 15 Terminal retainer 16 Socket part 16a Socket terminal 17 Spring 18 , 18a hole

Claims (3)

[Claims] 1. An IC socket of a characteristic selection device having a plurality of contact pins, wherein a positioning block for positioning both ends of the IC package in the X direction by taper guides and both ends in the Y direction by a plurality of angular guide pins is provided.
The IC block is arranged in a socket portion composed of a C socket, the positioning block is vertically locked to the IC socket, the IC package is mounted on the positioning block, and the IC package is pressed to form a lead of the IC package. An IC package positioning method for a characteristic selection device, characterized in that the contact pin is contact-connected. 2. In an IC package positioning structure of a characteristic selection device, wherein an IC package is mounted and an IC lead is connected to a socket terminal of an IC socket portion in a contact manner, the IC package positioning structure is disposed above the IC socket portion, and the IC package mounting position is set. A positioning block having taper guides provided at both ends in the X direction and a plurality of angular guide pins provided at both ends in the Y direction, and the positioning block is vertically movably locked to the IC socket portion. And a terminal retainer having a plunger mechanism for contacting the IC lead with the socket terminal while pressing the IC package after mounting the IC package on the positioning block. IC package positioning structure for the characteristic selection device. 3. The characteristic selecting apparatus according to claim 2, wherein the automatic locking means is operated by a spring force.
C package positioning structure.