JP2853422B2 - Package socket insertion apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for inserting a socket into a package, and more particularly, to an apparatus and method for inserting a package into a package. The present invention relates to an insertion device and an insertion method thereof.

In recent years, the progress of semiconductor devices has been remarkable, and semiconductor devices have been used in all fields. by the way,
In general, in an electronic device such as a semiconductor device, even if the design is appropriate and the manufacturing process is well managed, it is inevitable that some defects will be mixed. Therefore, an inspection method called screening is an indispensable step in quality assurance in order to stabilize characteristics and remove defects.

[0003] In screening, from visual inspection,
There are various methods, electrical and mechanical, but excessive screening has a significant effect on the cost of the product. Among them, all products are tested for a long time in a high temperature atmosphere while applying a specified load.
An inspection method called burn-in (Burn In)
Due to the large-scale equipment and the complexity of the process, the price is greatly affected. Therefore, how to perform burn-in efficiently is an important issue.

[0004]

2. Description of the Related Art Burn-in of a semiconductor device is performed using a printed board called a burn-in board. In other words, a burn-in socket, which is a type of IC socket, is provided on a printed board, and semiconductor devices to be tested are inserted into the socket one by one, and then the board is inserted in the burn-in device. Done.

[0005] Incidentally, there are various package forms of the semiconductor device. And in addition to increasing the number of leads,
In response to demands for smaller packages and lower height when mounted on printed circuit boards, for example, conventional DIP (dual in
from the form in which the leads protrude downward from the package, such as SOP (small outline package) or QFP (quad flat package), the leads protrude laterally from the side wall of the package. Flat packages are increasing.

[0006] When a package such as a DIP is inserted into a socket, the lead is sandwiched between the contacts and elastically contacted and fixed, so that it can be stably inserted without a lid on the socket. However, in the case of packages such as SOP and QFP,
Since the leads protrude laterally from the package, it is necessary to press them with the top lid to make the leads resiliently contact the contacts. Thus, in response to such changes in the package form, the form of the socket has also changed.

FIG. 4 is a configuration diagram of an example of a burn-in socket. In the figure, 6 is a package, 6a is a lead, 8
Is a socket, 8a is a lead guide, 8b is a contact, 8c is a positioning guide, 81 is a lower lid, and 82 is an upper lid.

The socket 8 exemplified here is a socket for performing the burn-in by inserting the SOP package 6 therein. The socket 8 includes a lower lid 81 and an upper lid 82. Opposite sides of the lower lid 81 and the upper lid 82 are urged to be always open and pivoted. On the other side, the lower lid 81 and the upper lid 82 are locked. A positioning guide is provided on the upper surface of the lower lid 81 so as to hold the package 6 to be inserted.
8c is provided. In addition, package 6 during burn-in
The contacts 8b for applying a load to are arranged side by side with the lead guide 8a as a partition.

When inserting the package 6,
When the lead 82 of the package 6 is opened and the lead 6a of the package 6 is fitted into the lead guide 8a of the lower lid 81 to make contact with the contact 8b, and the upper lid 82 is closed and locked, the package 6 is pressed and the lead 6a is brought into contact with the contact 8b. It comes into contact with the ball.

[0010]

However, as the package 6 becomes smaller and the number of leads 6a increases and becomes thinner and the pitch becomes narrower, the individual leads 6a are surely connected to the lead guide 8a of the socket 8. It is troublesome to confirm that it is fitted.

For this reason, when the upper lid 82 is closed while the lead 6a is not properly fitted into the lead guide 8a, the lead 6a
There is a problem that the package 6 is bent or the package 6 is damaged.

In view of the above, the present invention provides a package insertion device and a package insertion device which drop a package into a predetermined position of a socket and confirm that the lead is securely fitted to the lead guide, thereby preventing a problem of insertion. It is intended to provide a way.

[0013]

SUMMARY OF THE INVENTION The above-mentioned object comprises a transfer member, a support member, a movable member, a detection member, and a detection means, wherein the transfer member is attached to a robot hand and moves. The support member is supported below the transport member, and has a suction pad for vacuum-sucking a package on a lower wall of a central portion, and a pair of through holes formed on both sides of the suction pad. Having the movable member,
The sliding member is fitted in the through hole and slidably movable up and down, and a lower end portion protrudes from the through hole by its own weight, and the detection member is a movable member having one end portion forming a pair. In the socket insertion device for a package configured to be installed on an upper end portion, and in the socket insertion device for the package, the package is vacuum-sucked by a suction pad of the support member, and then the transport member is moved to move the package. The package lead is positioned at the height of the upper wall of the lead guide of the socket just above the contact, and then the package is detached from the suction pad, pressed down by the weight of the movable member, and the lead is dropped. And a socket insertion method for a package configured to detect that the detection member has moved following the drop of the movable member. It is solved Te.

[0014]

When a flat package such as an SOP or QFP is inserted into a socket, the lead may be bent or the package may be damaged if the top lid is closed until the package leads do not fit into the lead guide. In the present invention, it is possible to detect that the lead has been fitted to the lead guide.

That is, the package is positioned above the socket, and the package is pressed down by the weight of the movable member. And the lead does not fit into the lead guide,
When the package is floating, the groove of the detection member is also moved upward. When the lead is fitted into the lead guide and the movable member is lowered, the groove of the detection member is moved downward. Then, by detecting the moved position of the groove, it is confirmed whether or not the lead is fitted in the lead guide.

With this arrangement, it is possible to prevent an error in which the upper lid of the socket is closed carelessly in a state where the lead is not fitted to the lead guide.

[0017]

FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention.
2 is a cross-sectional view of FIG. 1, FIG. 2 (A) is a state in which the package is not sucked, FIG. 2 (B) is a state in which the package is sucked, and FIG. 3 is a side view for explaining an insertion procedure of the present invention. 3A shows the state of the package being sucked and moved, FIG. 3B shows the state of normal insertion, and FIG. 3C shows the state of abnormal insertion. In the figure, 1 is a conveying member, 2 is a supporting member, 2a
Is a suction pad, 2b is a through hole, 2c is a spring, 3 is a movable member,
4 is a detecting member, 4a is a groove, 5 is a detecting means, 5 is a detecting means,
5a is a light emitting element, 5b is a light receiving element, 6 is a package, 6a is a lead, 7 is a robot hand, 8 is a socket, 8a is a lead guide, and 8b is a contact.

In FIGS. 1 and 2, the transfer member 1 is attached to a robot hand 7 so that it can move up and down, back and forth, and left and right. A support member 2 is supported below the transport member 1 in a state of being urged downward by four springs 2c. The spring 2c is provided to cushion the package 6 so as not to apply excessive pressure when the package 6 is suction-supported.

A suction pad 2a for vacuum-sucking the package 6 is provided on the lower wall at the center of the support member 2. A pair of through holes 2b are provided on both sides of the suction pad 2a. The movable member 3 is fitted into the through hole 2b so as to slide vertically.

The movable member 3 is made of, for example, a heavy rod such as a metal, and always protrudes from the lower wall of the support member 2 by a predetermined length by its own weight as shown in FIG. The length of the protrusion is, for example, about 1 mm corresponding to a step between the upper wall of the lead guide 8a of the socket 8 and the contact 8b. When the package 6 is sucked, the movable member 3 is pushed up by the upper wall of the package 6 and retracted as shown in FIG. 2B.

The detecting member 4 is a supporting member 2 whose one end is a pair.
And is linked to the vertical movement of the support member 2. Further, a groove 4a split into two branches is provided at the other end bent in the L shape. The groove 4a is located at the reference position S indicated by a dashed line in FIG. 2A when the movable member 3 is lowered by its own weight and the movable member 3 is lowered and protrudes from the lower wall. However, when the movable member 3 is pushed up by the suction of the package 6, the movable member 3 moves above the reference position S as shown in FIG. The position of the groove 4a above and below the reference position S can be detected by the detecting means 5.

The detecting means 5 is, for example, a so-called photo-interrupter comprising a pair of light-emitting elements 5a and light-receiving elements 5b opposed to each other with the groove 4a interposed therebetween. . Then, the position of the groove 4a due to the vertical movement of the detection member 4 is detected,
This is to know the vertical position of the package 6.

As shown in FIG. 4, a plurality of sockets 8 are burn-in sockets and are provided on a burn-in board (not shown). Then, the robot hand 7 sequentially inserts the package 6 into the socket 8.

In FIG. 3, the procedure for inserting the socket 8 is as follows. First, the package 6 is vacuum-sucked by the suction pad 2a to move the support member 2 onto the socket 8. At this time, as shown in FIG. 3A, the movable member 3 has been lifted upward, so that the groove 4a of the detection member 4 is also located above the reference position S. When the package 6 is detached at the position where the lead 6 a of the package 6 is located at the height of the lead guide 8 a of the socket 8, the package 6 is pressed down by the weight of the movable member 3.

Now, as shown in FIG. 3B, if the lead 6a of the package 6 is guided by the lead guide 8a of the socket 8 and falls down and the lead 6a comes into contact with the contact 8b, the movable member 3 will lose its own weight. As a result, the groove 4a of the detecting member 4 also descends and is located at the reference position S. In this state, since the support member 2 is released and the upper cover (not shown) is closed, the socket 8 of the package 6 is inserted.
Insertion into the end.

However, as shown in FIG. 3C, when the lead 6a of the package 6 rides on the lead guide 8a of the socket 8 and does not fall,
Since the movable member 3 does not descend, the detection member 4 does not descend.
Therefore, the groove 4a is not located at the reference position S. Since this state is an abnormal insertion state, if the upper lid (not shown) is closed, the leads 6a will be deformed or the package 6 will be damaged. Then, the package 6 is re-adsorbed,
The support member 2 is pushed up to perform the insertion operation again.

Such an abnormal insertion state is shown in FIG.
As shown by a dashed line, the lead 6a of the package 6 may ride on the lead guide 8a only on one side and the package 6 may not fall, or the lead 6a may be bent by only one lead. There are times when you get up and do not get depressed.

In this example, the socket is a burn-in socket. However, the IC socket for a normal flat package has the same basic structure that the top cover is closed when the package is inserted. Therefore, the application of the present invention is not limited only to the burn-in socket.

[0029]

The burn-in of a flat package such as an SOP, particularly when the upper lid of the socket is closed while the leads are not securely guided, often causes defects such as deformation of the leads. According to this, the package can be securely inserted into the socket.

Therefore, the present invention greatly contributes to the efficiency of burn-in which is complicated and costly in the inspection process of the semiconductor device but cannot be avoided from the viewpoint of quality control.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention.

FIGS. 2A and 2B are cross-sectional views of FIG. 1, wherein FIG. 2A is a state in which a package is not sucked, and FIG.

FIG. 3 is a side view illustrating an insertion procedure according to the present invention;
(A) is the state of suction and movement of the package, (B) is the normal insertion state, and (C) is the abnormal insertion state.

FIG. 4 is a configuration diagram of an example of a burn-in socket.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Transport member 2 Support member 2a Suction pad 2b
Through hole 2c Spring 3 Movable member 4 Detecting member 4a Groove 5 Detecting means 5a Light emitting element 5b
Light receiving element 6 Package 6a Lead 7 Robot hand 8 Socket 8a Lead guide 8b
Contact

Claims (3)

(57) [Claims] A transport member (1), a support member (2), a movable member (3), and a detection member (4), wherein the transport member (1) is attached to a robot hand (7). The support member (2) is supported below the transfer member (1), and a suction pad (2a) for vacuum-sucking the package (6) on a lower wall of a central portion; It has a pair of through holes (2b) formed on both sides of the suction pad (2a), and the movable member (3) fits into the through hole (2b) and slides vertically. The lower end of the movable member has a lower end protruding from the through-hole (2b) by its own weight.
(3) A socket insertion device for a package, which is installed on the upper end of (3). 2. A detecting means (5), wherein the detecting member (4) has a forked groove (4a) at the other end, and the detecting means (5) comprises a light emitting element. (5a) and a light receiving element (5b), and when the package (6) is sucked by the suction pad (2a) and the lower end of the movable member (3) is pushed up, the detecting member ( The fact that the groove (4a) of (4) has moved upward and that the package (6) has been detached and that the movable member (3) has been removed
2. The socket insertion device for a package according to claim 1, wherein when the lower end portion of the package projects, the groove (4a) is detected to move downward. 3. The package insertion device according to claim 1, wherein the package is inserted by a suction pad (2a) of the support member (2).
(6) is vacuum-adsorbed, and then the transfer member (1) is moved to
Connect the lead (6a) of (6) to the socket (8) just above the contact (8b).
Then, the package (6) is detached from the suction pad (2a) and pressed down by the weight of the movable member (3), and the lead (6) is placed at the height of the upper wall of the lead guide (8a).
(6a) is dropped into the lead guide (8a), and the movement of the detection member (4) is detected by following the fall of the movable member (3). .