JPS6240434Y2 - - Google Patents

Description

[Detailed description of the invention] This invention inspects lead bending of semiconductor integrated circuit devices (hereinafter referred to as IC devices) that are continuously transported across a chute at an inspection position, and as a result, lead bending is detected. This invention relates to a device that detects only non-standard IC elements and removes them from the chute.

Generally, IC devices produced in large quantities in IC device manufacturing equipment are sequentially supplied to the measuring device section of IC device testing equipment, inserted into a socket, and their electrical characteristics are measured or their operation tested to determine their acceptability. When installing an IC element by inserting the leads into the through-holes of a printed circuit board using an automatic insertion device, check in advance whether each lead of the IC element can be inserted into each hole of the socket, and check whether the IC element can be inserted into each hole. It is necessary to supply only IC elements and exclude IC elements that cannot be inserted.

Figure 1 shows a perspective view of an example of a dual in-line package (DIP) type IC device testing device, and 1 is a magazine store containing a large number of magazines containing tape-type IC devices to be tested. Take out one magazine from the stock part and this magazine stock part and insert the IC inside the magazine.
IC consisting of a loader section that supplies elements to the chute
This is the element storage/supply equipment section. Reference numeral 2 denotes a singulation equipment section, which separates the IC elements that are continuously conveyed from the IC element storage/supply equipment section 1 over a chute.
This is to separate the samples into individual pieces and supply them to the measuring device section 3. 3 is a measuring device section that inserts the lead of the IC element supplied by the individualization device section 2 into the socket and tests its operation; 4 is a measuring device section that judges the quality of the IC element based on the operation test result and distinguishes between good and defective products. This is a sorting device section that sorts out good products, and numerals 5 and 6 are storage sections that separate and store the good products and defective products that have been sorted out by the sorting device section 4. Each part 1 to 6 is connected by a chute, and the sorting device part 4 and the storage parts 5 and 6 are connected by a chute having a curved part due to their positional relationship. The structure includes a switching chute in order to separate the IC elements sent from the device section 3 into good and defective products and send them to storage sections 5 and 6. Further, as shown in the second figure, the IC element 7 is continuously fed in a state where it straddles a chute 8. In addition,
₈₁ is a chute roof portion for preventing the IC element 7 on the chute 8 from falling off.

In such an inspection device, the IC is
When testing the operation of element 7, we check whether each lead of the IC element can be pushed into each hole of the socket, supply IC elements that can be pushed, and check whether each lead of the IC element can be pushed into each hole of the socket.
It is necessary to exclude IC elements.

Conventionally, as disclosed in Utility Model Application No. 55-71076, for example, a gate was provided in the chute to restrict the range of inward bending and outward bending of the lead, and this gate was used to detect lead bending of an IC element. It's summery. However, in such a device, as shown in FIG.
Non-standard IC element 7 with bent leads including a and 19b
Although a and 7b can be detected and eliminated, if the IC element lead is bent in the longitudinal direction, this longitudinal lead bending cannot be detected regardless of whether it is within or outside the allowable range, as shown in Figure 3 c. As such, there is a drawback that non-standard IC elements 7c with lead bends, including leads 19c whose longitudinal lead bends are outside the allowable range, cannot be detected and excluded. Therefore, such an IC element 7c
The leads are unintentionally sent to the socket of the measuring device section 3 of the inspection device, making it impossible to push each lead into each hole in the socket, further increasing the bending of the leads, and causing entanglement in the handling section of the pushing device, etc. cause trouble. Therefore, it is necessary for a person to temporarily stop the device and remove this IC element 7c from the chute using an appropriate tool such as tweezers or a needle.
This is time-consuming and reduces the operating rate. In addition, if the measuring device section 3 is not a socket type but a contact type, when inspecting each lead of the IC element 7c by contacting each contact lead, the lead 19c bent in the longitudinal direction beyond the allowable range will not be connected to the contact lead. Since normal contact cannot be made and proper inspection cannot be performed, there is a drawback that even good IC elements can be mistakenly judged as defective.

The present invention was devised to avoid the above-mentioned drawbacks, and is intended to prevent IC devices that contain leads whose inner and outer bends are outside the permissible range from among IC devices that are continuously transported across a chute. The present invention aims to provide a device that can reliably and quickly detect IC elements including leads whose longitudinal lead bends are outside the permissible range by inspecting the lead bends, and remove them from the chute.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 is a perspective view thereof.

In FIG. 4, 8a is a chute connected to, for example, the individualizing device section 2 of the apparatus shown in FIG. 1, and 8d is a chute similarly connected to the measuring device section 3. Reference numeral 9 denotes a stopper for temporarily stopping the IC elements 7 that are continuously conveyed over the chute 8a on the chute 8b at the inspection position, and releasing the stop at the end of the inspection; 9a moves the stopper 9 up and down. It is a cylinder for Reference numeral 13 denotes a gauge block which is provided so as to be movable up and down along a guide 15 at the inspection position, and on its upper surface there is a gauge block on the chute 8b at the inspection position which is temporarily stopped by the stopper 9.
A hole 13a is provided corresponding to each lead 19 of the IC element 7 and having a size that allows insertion of the lead 19 when the lead bending is within the standard. Figure 5 shows that each lead 19 of an IC element within the standard is connected to a gauge block 13.
This figure shows the state in which it is inserted into each hole 13a. X indicates an allowable range for inside bending of the lead, Y indicates an allowable range for outward bending of the lead, and Z indicates an allowable range for lead bending in the longitudinal direction. If the lead 19 of the IC element 7 is bent beyond this allowable range, as shown in FIGS. 3a to 3c, the bent leads 19a, 1
9b and 19c will not be inserted into the hole 13a. 14 is a cylinder for moving the gauge block 13 up and down. 10 is a guide portion 10a inserted into the through hole 11a of the support stand 11 at the inspection position.
A guide roof that can be moved up and down by inserting the guide roof, 12
A lower limit positioning stopper is screwed onto the guide portion 10a, and supports the guide roof 10 on the support base 11 while being set at a desired lower limit position so as to provide a required gap between the guide roof 10 and the IC element 7. The guide roof 10 serves to prevent the IC element 7 on the chute 8b at the inspection position from falling off. Reference numeral 16 denotes an optical detector consisting of, for example, a light source and a light receiving element, for detecting the upward movement of the guide roof 10 at the upper end of the guide portion 10a to detect a non-standard IC element with bent leads. Only when this detector 16 detects a non-standard IC element with a bent lead, the detection signal is used to drive the cylinder 17 to rotate through the shaft 18, thereby detecting the non-standard IC element with a bent lead. This is a removal chute for removing the liquid into the storage box 20 outside the chute. In addition, 8
₁ a, 8 ₁ c, 8 ₂ d are chute 8 a, 8 c, respectively.
This is a chute roof portion for preventing the IC element 7 on the top 8d from falling off.

Since the embodiment has the above-described configuration, for example, the IC elements 7 continuously transported from the individualizing device section 2 in FIG. At this point, the IC element 7 is temporarily stopped by the lower end of the stopper 9, which has been moved downward by actuating the cylinder 9a, and the gauge block 13 is raised to a predetermined position along the guide 15 by the cylinder 14. make it move. At this time, if the bends of all the leads 19 of the IC element 7 are within the standard, each lead 19 is inserted into each hole 13a of the gauge block 13 as shown in FIGS. The IC element 7 is not moved upward at the upward movement end position (the position shown in FIG. 4). Therefore, the guide roof 10 does not move upward and no detection signal is emitted from the detector 16, so the cylinder 17 does not operate and the chute 8c does not rotate. Next, the gauge block 13 is moved downward by the cylinder 14 to disengage each lead 19 from the hole 13a, and the IC element is freed from the gauge block 13, and then the stopper 9 is moved upward by the cylinder 9a to close the stopper. 9, the IC device on chute 8b passes through chute 8c and 8d to the next measuring device section 3 as a standard IC device.
sent to. Also, all leads 19 of IC element 7
If even one of the leads is bent beyond the standard as shown in Figure 3 a to c, the bent lead 1
9a, 19b or 19c is not inserted into the hole 13a of the gauge block 13 facing it, but comes into contact with the upper surface of the gauge block 13.
At the end position of the upward movement of the gauge block 13, the IC element 7a, 7b or 7c is moved upward by the upper surface of the gauge block 13. This IC element 7a,
The upward movement of 7b or 7c causes the guide roof 10 to move upward, and this upward movement is detected by the detector 16, which issues a detection signal. The cylinder 17 is actuated by this detection signal, and the chute 8c is rotated via the shaft 18. While the chute 8c is in this rotating state, the gauge block 13 is moved down by the cylinder 14 to make the IC element freer than the gauge block 13, and then the stopper 9 is moved up by the cylinder 9a and stopped by the stopper 9. If solved, IC elements 7a, 7 on chute 8b
b or 7c is shoot 8 as a non-standard IC element.
c, it is removed into the storage box 20 and is not sent to the next measuring device section 3 via the chute 8d. By repeating the above operations, it is possible to detect and eliminate only non-standard IC elements with bent leads among the IC elements that are continuously transported across the chute without stopping the equipment. can.

It goes without saying that the present invention can be applied to devices that connect to IC elements using either a socket type or a contact type.

As described above, according to the present invention, a gauge block with a hole in the top surface that is large enough to allow insertion of the leads when the bending of each lead of the IC element is within the standard is used to straddle the chute. The system is designed to inspect IC devices that are continuously transported at the same time for internal and external bends and lead bends in the longitudinal direction, and to detect and exclude only non-standard IC devices with bent leads outside the chute. Therefore, it is possible to quickly detect and eliminate not only IC devices with leads whose internal and external bends are outside the allowable range, but also IC devices with leads whose longitudinal lead bends are outside the allowable range.
Therefore, the drawbacks of transporting non-standard IC devices with bent leads in the longitudinal direction, which could not be eliminated in the past, such as tangles in the case of socket type, reduced operating rate due to temporary stoppage of equipment, and non-standard IC devices with bent leads in the longitudinal direction. This not only eliminates the need for manual removal, but also eliminates the disadvantages of the contact type, namely malfunctions due to non-contact between the lead and the contact lead.
Misjudgment can be eliminated. In particular, with this invention, lead bending can be detected outside of standard without stopping the equipment.
Since it is possible to detect and exclude IC devices and transport IC devices with bent leads within specifications, it has the advantage of greatly improving the operating rate of the device.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing an example of a Dave-type IC element testing device, Figure 2 is a cross-sectional view of the chute section showing the transport state of IC elements, and Figures 3 a to c are three examples of IC elements with bent leads that do not meet the specifications. FIG. 4 is a perspective view showing the first
FIG. 5 is a perspective view showing an embodiment of the device of the present invention that can be used in the device shown in the figure, and FIG. 5 is a perspective view of the main parts thereof. 7...IC element, 19...Lead, 7a, 7
b, 7c... Non-standard IC element with bent leads, 19
a, 19b, 19c...Lead bent beyond the allowable range, 8a, 8d...Chute, 8b...Chute at inspection position, 8c...Exclusion chute, 9...
Stopper, 9a...Cylinder for stopper operation, 1
0...Guide roof, 10a...Guide part, 11...
...Support stand, 11a...Through hole, 12...Lower limit positioning stopper, 13...Gauge block, 13a
... Hole, 14 ... Cylinder for operating gauge block, 15 ... Guide, 16 ... Optical detector, 1
7... Removal chute drive cylinder, 20...
storage box.

Claims (1)

[Scope of utility model registration request] A stopper is provided at the test position to allow the IC devices that are continuously transported to be straddled over the chute to be temporarily stopped on the chute at the test position and released after the test. A gauge block has a hole on the top surface that is large enough to accommodate each lead of the IC element on the chute at the inspection position that is temporarily stopped and the lead can be inserted when the lead bend is within the standard. A guide roof is provided at a position that can be moved up and down, and is moved upward by the upward movement of a non-standard IC element whose leads are not all inserted into each hole of the gauge block, and whose leads are bent. A detector is installed next to the chute at the inspection position to detect non-standard IC elements with bent leads, and only when this detector detects non-standard IC elements with bent leads. A device for detecting and removing non-standard IC elements with bent leads, which comprises an exclusion chute that is driven by a detection signal to remove non-standard IC elements with bent leads from the chute.