JP2001264386A - Loader/unloader device for burn-in board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a loader/unloader device with simple device constitution capable of lowering cost, flexibly using in withdrawal mode and insertion mode with the same device. SOLUTION: The loader/unloader device comprises a board coveying unit for conveying a burn-in board to a specific location, an insertion/withdrawal means for inserting and withdrawing a semiconductor device to the burn-in board conveyed to the specific location by the board conveying unit, a putting means for putting a withdrawn semiconductor device or that to be inserted, a tray means for containing the withdrawn one or the one to be inserted, and a transfer means for conveying the semiconductor device between the putting means and the tray means. In the withdrawn mode, the insertion/withdrawal means works for the withdrawal function only and the tray means is used as a classifying containing tray. In the insertion mode, the means works for the insertion function only and the tray means is used as a supply tray.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a loader / unloader for inserting and removing a semiconductor device from a socket of a burn-in board.

[0002]

2. Description of the Related Art One or two semiconductor devices are simultaneously removed and mounted from a burn-in board socket, classified according to test results of a test burn-in apparatus, and a new untested semiconductor device is inserted and mounted in a socket. Loader unloader devices are known.

[0003] For example, a process of detecting and removing an initial failure of a memory semiconductor by accelerating with temperature and voltage and removing the defect is called burn-in, and it takes several hours to one week at a temperature of about 125 ° C and a voltage higher than normal use. The memory semiconductor is inserted and mounted in the socket of the burn-in board, and simultaneously removed and classified according to the function test (from 2 to 17). A semiconductor device loader / unloader is used for such removal classification. In order to ensure the quality and reliability of memory semiconductors with large capacity, functional tests (tests to verify that memory circuits operate normally, tests to verify that writing and reading are performed correctly under all conditions), defect checks, We need to verify weak points,
Applicants have named a device for performing such verification a test burn-in system. As described above, all the large-capacity memory semiconductors perform screening called burn-in. Burn-in is a high-temperature operation for a short time, and its purpose is to increase the detectability of an initial failure mode failure in a final inspection.

[0004]

The characteristics of this type of burn-in board loader / unloader are such that a large number of semiconductor devices can be burned-in test in a short time and classified into test results. There is a demand for handling a large number of semiconductor device insertion / removal operations in a short time. In addition, the pitch of the storage space of the semiconductor device supply tray and the pitch of the socket of the burn-in board are often different. This is because the size for storing only the semiconductor device is different from the size for the socket for connecting the terminals of the semiconductor device.
To simultaneously carry a plurality of semiconductor devices between different pitches, and to remove, insert and mount them, a pitch conversion device is required.

A conventional loader / unloader for a burn-in board only removes or inserts at most one or two semiconductor devices at a time, and is not always sufficient for a demand that a large number of semiconductor devices can be handled in a short time. Did not respond to Also, the conventional burn-in board loader / unloader does not include a versatile pitch converter, and thus cannot easily cope with semiconductor devices having different sizes. Furthermore, the conventional burn-in board loader / unloader device is designed to reduce the error of the burn-in board socket and the arrangement position, the position error and the suction position error of the suction call head used for inserting and removing the semiconductor device from the burn-in board socket. No sufficient measures have been taken to cope with the problem, and insertion errors and other inconveniences due to those errors are likely to occur.

[0006] In order to solve such problems of the prior art, the present applicant has previously filed Japanese Patent Application No. 10-285084.
A loader / unloader device for a burn-in board as disclosed in the specification has been developed and proposed. Although the device proposed above can solve the above-mentioned conventional problems, the overall device configuration becomes relatively complicated and the price becomes relatively expensive. Not something.

For example, in the apparatus proposed above, both a storage tray and a supply tray are provided, and removal of the semiconductor device from the burn-in board and insertion of the semiconductor device into the burn-in board are performed by a board transport unit. This is performed while moving the burn-in board forward and backward. Therefore, first of all, it is necessary to separately provide the extraction head and the insertion head, which complicates the configuration. Second, the structure of the board transfer unit for moving the burn-in board forward and backward is complicated.

Further, in the apparatus proposed above, an image processing system for preventing an erroneous insertion of a semiconductor device into a socket of a burn-in board uses an upper movable camera and two lower fixed cameras. , And it has a complicated configuration.

Furthermore, BGA and μB as semiconductor devices which have been recently developed and used
When inserting or removing a GA type IC package, the ball may fall off inside the socket of the burn-in board. However, the image processing system in the previously proposed device has such a ball drop-off. Is not suitable enough to quickly and reliably detect and stop the insertion of the semiconductor device into the socket, thereby preventing problems.

An object of the present invention is to solve the problems of the prior art as described above, to reduce the cost with a simpler configuration than the previously proposed apparatus, and to achieve higher functionality and higher detection capability. An object of the present invention is to provide a burn-in board loader / unloader device which can incorporate an image processing system.

[0011]

According to one aspect of the present invention, there is provided a loader-unloader for inserting and removing a semiconductor device from a socket of a burn-in board.
A board transfer unit for transferring the burn-in board to a predetermined position, and an insertion / extraction unit for inserting and removing a semiconductor device with respect to the burn-in board brought to the predetermined position by the board transfer unit;
Mounting means for mounting a removed semiconductor device or a semiconductor device to be inserted; tray means for storing a removed semiconductor device or a semiconductor device to be inserted; mounting means and the tray means And transfer transfer means for transferring the semiconductor device to and from the semiconductor device, and in the removal mode, the insertion / extraction means performs only the removal function, and the tray means is used as a classification storage tray, and In the mode, the insertion / extraction means performs only an insertion function, and the tray means is used as a supply tray.

According to one embodiment of the present invention, the placing means, the transfer transfer means and the tray means are provided as a pair of right and left, and the inserting / extracting means is controlled by a horizontal articulated robot. The insertion / extraction head is controlled so as to be alternately moved with respect to the left and right mounting means.

According to another embodiment of the present invention, one of the left and right mounting means, the left and right transfer transfer means and the left and right tray means is for removing and storing the other, and the other is for supplying. , So that it can operate in the insertion / extraction mode.

According to yet another embodiment of the present invention,
The transfer transfer means includes a moving arm supported at both ends, and a suction head movably suspended from the moving arm.

According to another aspect of the present invention, there is provided a loader / unloader for inserting / removing a semiconductor device into / from a socket of a burn-in board, and a board transfer unit for transferring the burn-in board to a predetermined position. Inserting / extracting means for inserting / extracting a semiconductor device from / to the burn-in board brought to the predetermined position by the board transfer unit; and a position of a socket of the burn-in board and a position of the semiconductor device inserted / extracted by the inserting / extracting means. And an image processing system for detecting an image. The image processing system includes an image processing camera which is moved in association with the insertion / extraction means.

According to one embodiment of the present invention, the insertion / extraction means includes an insertion / extraction head controlled by a horizontal articulated robot, and the image processing camera is controlled by the horizontal articulated robot. It is arranged near the insertion / extraction head.

According to another embodiment of the present invention, the insertion / extraction head is mounted on an axis of the horizontal articulated robot that is controlled to rotate, and the image processing camera is controlled by the horizontal articulated robot. Although the movement is controlled together with the insertion / extraction head, it is arranged at a fixed position with respect to the insertion / extraction head.

According to yet another embodiment of the present invention,
A socket opening / closing device is arranged in association with the board transport unit, and in a state where the socket of the burn-in board is opened by the socket opening / closing device, the image processing camera performs an operation of detecting a state in the socket. Can.

According to yet another embodiment of the present invention,
The image processing camera can detect the center and inclination θ of the semiconductor device and the center and inclination θ of the corresponding socket of the burn-in board, and the insertion / extraction head controls movement and rotation based on the detection information of the center and inclination θ. Is done.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in more detail with reference to the accompanying drawings according to embodiments and examples of the present invention.

FIG. 1 is a schematic plan block diagram showing the overall configuration of a burn-in board loader / unloader apparatus as one embodiment of the present invention. As shown in FIG.
The loader / unloader device for a burn-in board according to the present embodiment includes a cart for storing and transporting a carrier rack containing a plurality of burn-in boards (not shown) as an option, and a carrier as an option for receiving the carrier rack from the cart. A rack stocker 40, a carrier rack elevator 50 for receiving a carrier rack from the carrier rack stocker 40, and a burn-in board 1 from the carrier rack of the carrier rack elevator 50.
A board transport unit 60 for pulling out and transporting the semiconductor device 0, an insertion / extraction head 70 and an image processing camera 80, for removing the semiconductor device from the socket of the burn-in board 10 and inserting the semiconductor device into the socket of the burn-in board 10. Horizontal articulated robot 90, empty tray transfer 100, empty tray elevator 11
0, right transfer transfer 120, left transfer transfer 130, right supply and storage tray elevator 140, and five right single storage trays 141, 14.
2, 143, 144 and 145; right and left supply and storage tray elevator 150; and five left and single storage trays 151, 152, 153, 154 and 15
5, right alignment stage 160, left alignment stage 170, right DC and O / S (open short) tester 180, left DC and O / S
An S (open short) tester 190 is mainly provided. The board opening / closing device 200 is provided in association with the board transport unit 60.

Next, the components of the burn-in board loader / unloader having such an overall configuration will be described in order. First, the carrier rack stocker 4
0 is, for example, to receive a carrier rack from a trolley storing a carrier rack storing the burn-in board 10 and deliver it to the carrier rack elevator 50. In the carrier rack, for example, 10 to 12
A plurality of burn-in boards 10 can be stored in a stack.
As shown in FIG. 1, one burn-in board 10
In order to inspect a large number of semiconductor devices at once, a large number of sockets 12 into which a large number of semiconductor devices can be inserted are arranged in a matrix on a substrate 11 bordered by aluminum ribs, for example. The other end is provided with an edge connector section 14 for connection to a test apparatus.

Although not shown, for example, the carriage accommodates two carrier racks accommodating the burn-in board 10 so that they can be conveyed by hand. The carrier rack stocker 40 receives the carrier rack from the cart and delivers it to the carrier rack elevator 50 as described above. Although not shown in detail, the carrier rack stocker 40 has a two-stage structure, and each stage has a structure in which one carrier rack can be stored.

The carrier rack elevator 50 is for receiving carrier racks from the upper and lower stages of the carrier rack stocker 40 and connecting them to the board transport unit 60. FIG. 3 is a schematic rear view of the burn-in board loader / unloader device of FIG. 1, and a relatively detailed structure of the carrier rack elevator 50 is shown on the left side of FIG. As shown in this figure,
The carrier rack elevator 50 includes the carrier stocker 4
0 is provided with a vertically movable base 51 which can be moved up and down between an upper stage and a lower stage. This vertical movement base 51
Is for receiving the carrier racks 20 from the upper and lower stages of the carrier rack stocker 40 and connecting them to the board transport unit 60. Vertical base 5
1 is adapted to be guided up and down along an LM guide 52 provided on the main body, and in this embodiment, is engaged with a moving nut 53 attached and fixed to a vertically moving base 51 and a bearing 57. Ball screw 54 supported by
Is driven up and down by a pulse motor 55 to be moved up and down. An encoder 56 for generating a position signal is associated with the ball screw 55.

As shown in FIG. 3, when the vertical movement base 51 of the carrier rack elevator 50 is at a predetermined position with respect to the board transfer unit 60, the board transfer unit 60 operates and the The stored burn-in board 10 is pulled out. Although not shown in detail, the board transfer unit 60 grabs the edge of the burn-in board 10 from the carrier rack elevator 50 and moves the burner-in board 10 to a predetermined position with respect to the socket opening / closing device 200, that is, to a position for inserting and removing a semiconductor device. The structure is such that the burn-in board 10 can be transported and fixed there. In addition, the timing belt 59 hung on the pulley 58 pulls the carrier rack 20 from the carrier rack stocker 40 into the carrier rack elevator 50, and conversely, moves the carrier rack 20 from the carrier rack elevator 50 to the carrier rack stocker 40. Used for returning operation.

On the right side of FIG.
1 shows a horizontal articulated robot 90 arranged so as to have an operation area in which at least an insertion / extraction operation can be performed with respect to each socket of the burn-in board 10 fixed to the robot. As the horizontal articulated robot 90,
For example, an assembly robot manufactured and sold by Matsushita Electric Industrial Co., Ltd., PanaRobo HR-7 series HR-5
785 or the like can be used. As shown in FIG. 3, in this embodiment, a horizontal articulated robot 90 includes a first turning arm 92 attached to a main body base 91 so as to be able to turn in a horizontal plane, and a first turning arm 92. A second pivot arm 93 is attached to the pivot arm 92 so as to pivot in a horizontal plane. A Z-axis 94 that can move up and down while turning is attached to the tip of the second turning arm 93, and an insertion / extraction head 70 made of a suction head is attached to the lower end of the Z-axis 94. Furthermore, an image processing camera 80 is attached to the tip of the second turning arm 93.

FIG. 4 shows the detailed structure of the insertion / extraction head 70 and the image processing camera 80 attached to the horizontal articulated robot 90. As is well shown in FIG.
The insertion / extraction head 70 includes an insertion / extraction head mounting bracket 71.
And a Z nested with respect to the lower end of the Z axis 94.
It is mainly composed of a shaft shaft 72 and a suction pad 73 attached to the lower end of the Z-axis shaft 72.
An air passage 94A is formed in the Z axis 94 along the center axis, and an upper end of the air passage 94A is connected to an air pipe 96 via a pivotable air joint 95. The lower end of the air passage 94A is connected to a corresponding air passage formed along the center axis of the Z-axis shaft 72. Therefore, by energizing a decompressed air source (not shown) connected to the air pipe 96, it is possible to cause the suction pad 73 to perform an adsorption action through these air passages.

The suction pad 73 may be, for example, a silicone rubber pad, a conductive MC nylon pad, or a metal pad.

FIG. 6A is a plan view showing a detailed structure of the insertion / extraction head mounting bracket 71. As shown in FIG.
1 is formed with a circular opening 71C inserted around the lower end of the Z-axis 94 at the center, and tightens the tightening screw 71A with the lower end of the Z-axis 94 inserted into the circular opening 71C. Thereby, the insertion / extraction head mounting bracket 71 can be fixed to the lower end of the Z axis 94.

FIG. 6B is a partial cross-sectional view showing the detailed structure of the Z-axis shaft 72 and the state of attachment of the insertion / extraction head 70 to the Z-axis 94 via the insertion / extraction head attachment bracket 71. . As shown in this figure, near the upper end of the Z-axis shaft 72, a fall prevention flange 72A is provided.
A key groove 72B is formed, and near the lower end,
A displacement spring contact flange 72C for contacting one end of the displacement spring 75 is formed. This Z axis shaft 72
Is set so that the fall prevention flange 72A abuts on the edge 74A of the fall prevention plate 74, and the upper end thereof is nested in an opening 94B formed at the lower end of the Z axis 94, The fall prevention plate 74 is attached and fixed to the lower surface of the insertion / extraction head attachment bracket 71 by using, for example, attachment screws or the like, so that the plate 74 is attached to the Z-axis 94. At this time, the eccentric spring 75 is sandwiched between the lower surface of the fall prevention plate 74 and the eccentric spring contact flange 72C, and constantly exerts an elastic force for displacing the Z-axis shaft 72 downward. To give. Furthermore, the key screw 71B is screwed through the insertion / extraction head mounting bracket 71,
By engaging the tip of the key screw 71B with the key groove 72B at the upper end of the Z-axis shaft 72, the Z-axis shaft 72
Can rotate as the Z-axis 94 rotates, and can move upward in a nested manner in the Z-axis 94 against the shifting force of the shifting spring 75. Therefore, an impact or the like when the suction pad 73 contacts the suction surface of the semiconductor device can be released.

Next, the mounting structure of the image processing camera 80 will be described in detail. The image processing camera 80 is mounted on the tip of the second turning arm 93 of the horizontal articulated robot 90 using the camera mounting bracket 81. FIG.
Is a plan view of the camera mounting bracket 81. FIG.
5, the camera mounting bracket 81 has an opening 81A through which the Z-axis 94 is inserted.
And a screw hole 81B for screwing and fixing to the lower surface of the tip of the second turning arm 93. Furthermore, the camera mounting bracket 81 has a screw hole 81C for screwing a camera mounting angle 82 for mounting and fixing the image processing camera 80.

Next, the detailed structure and operation of the board transfer unit 60 and the socket opening / closing device 200 disposed in connection therewith will be described. FIG. 7 is a plan view of the socket opening / closing device 200 provided in relation to the board transfer unit 60. FIG. 8 is a plan view of the socket opening / closing device 200 and the board transfer unit provided in connection with the board transfer unit 60. FIG. 4 is a partially enlarged view for showing in detail a relationship with a socket on the burn-in board 10 fixed by 60.

As shown in these figures, the socket opening / closing device 200 includes a sawboard 201 made of, for example, an aluminum plate, and the sawboard 201 has a socket arrangement pitch of the burn-in board 10. A vertically long opening 202 is formed at a row pitch P corresponding to. The opening width of the opening 202 is adjusted to the inner diameter width of the socket 12 of the burn-in board 10, as is well shown in FIG. Also, at the upper end of the opening 202,
A taper 202A for dropping is provided. Cam slots 203 are provided on both sides of the
A cam 203 having A is attached.

On the other hand, an air cylinder 204 is fixedly disposed with respect to the board transfer unit 60 in relation to each of the cams 203 attached to the sawboard 201. A cam follower 205 that engages with a cam slot 203A of each corresponding cam 203 is connected to a piston rod of each air cylinder 204. Furthermore, Z-axis guides 2 for guiding the movement of the saw-shaped plate 201 in the Z-axis direction, that is, the vertical movement, are provided at the four corners of the saw-shaped plate 201.
A guide hole is formed for engagement with the reference numeral 06.

The socket opening / closing device 200 having such a structure operates as follows. First, in the state shown in FIG. 8, when the piston rod of the air cylinder 204 is at the retracted position and the cam follower 205
Of the cam slot 203A of the burn-in board 10
Is in the upper position to close it. When the socket 12 is closed in this manner, the holding claws 12A of the socket 12
Are closed so as to press the semiconductor device 1 inserted into the socket 12. When the air cylinder 204 is operated to extend the piston rod from the closed state of the socket 12, the cam follower 205 acts on the cam slot 203 A of the cam 203 to push down the cam 203, that is, the saw-shaped plate 201 moves the Z The shaft guide 206 acts so as to be pushed down. Therefore, the opening action piece 12 of the socket 12
B is pushed down, so that the holding claws 12
A is opened outward, and the socket 12 is changed from the closed state to the open state.

When the pitch of the burn-in board, the width of the socket, the height of the socket, and the like are changed in accordance with the type of the semiconductor device, the ratchet-shaped plate 201 and the cam 203 are designed so as to be suitable for them. It is good to make a change kit so that you can exchange it for something.

The related operation of the horizontal articulated robot 90 having the above-described structure, the insertion / extraction head 70, the image processing camera 80, and the socket opening / closing device 200 will be described later in detail.

Next, the empty tray transfer 100 and the empty tray elevator 1 provided in front of the board transfer unit 60 and the horizontal articulated robot 90 as described above.
10, right and left transfer transfers 120 and 1
30, right and left supply and storage tray elevators 140 and 150, right single storage tray 141-
145, left single storage trays 151 to 155, right and left alignment stages 160 and 170,
And right and left side DC testers 180 and 190
The detailed structure and related operation of the device will be described.

FIG. 2 is a front view of the burn-in board loader / unloader shown in FIG. 1. As is well shown in FIG. 2, a command for setting control of the operation of the present apparatus is given to the center on the front side of the apparatus. The touch panel 210 and the operation switch 220 used for this are provided. In the insertion mode as described later, the left and right supply and storage elevators 140 and 150 store trays on which a plurality of semiconductor devices to be tested are placed side by side, and store the stacked trays on top of each other. To supply semiconductor devices one after another. That is, when the uppermost tray becomes empty, the tray is moved to the empty tray elevator 110 by the operation of the empty tray transfer 100, and the tray immediately below is raised to the uppermost portion, so that the supply of semiconductor devices is performed therefrom. Be able to continue.

On the other hand, the left and right supply and storage elevators 1
The semiconductor devices 40 and 150 store the semiconductor devices that have passed (not NG) based on the test results in the uppermost trays 140A and 150A in the removal mode as described later, and the semiconductor devices that the uppermost tray has passed. When the device is full, empty tray transfer 1
00 empty tray from empty tray elevator 110,
The stacked semiconductor devices are stacked on a tray filled with the passed semiconductor devices, so that the semiconductor devices that have passed further can be stored therein.

As shown in FIG. 2, the single storage trays 141 to 145 and 151 to 155 have heights substantially equal to the height levels of the upper trays 140 A and 150 A of the left and right supply and storage tray elevators 140 and 150. It is placed on a shelf at the same height level,
As will be described later, the semiconductor devices removed in the removal mode can be received in a state classified according to the degree of NG based on the test result. When it is full, the operator or worker carries it to a predetermined place, and instead places an empty tray at the same position.

FIG. 9 is a plan view of the right transfer transfer 120, and FIG. 10 is a front view of the right transfer transfer 120. The left transfer 130 has the same structure and performs the same operation as the right transfer 120, and a detailed description thereof will be omitted.

In particular, referring to FIGS. 9 and 10, the detailed structure and operation of the right transfer transfer 120 will be described. As shown in FIG. Storage tray elevator 140 and right-side single storage tray 141
So that it can move along the cam follower rail 121 extended along the upper side on both sides of 〜145, that is,
X-axis arm 12 arranged to be movable in the Y-axis direction
2 is provided. The transfer transfer 120 further includes a fixed Y-axis arm 123 disposed between the cam follower rails 121 on both sides and guiding the movement in the Y-axis direction while supporting an intermediate portion of the X-axis arm 122. Furthermore, a two-channel transfer suction head 124 is suspended from the X-axis arm 122 so as to be movable in the X-axis direction. Such a cam follower rail 121
The arrangement relationship between the X-axis arm 122 and the Y-axis arm 123 is well shown in the plan view of FIG.

As best shown in the front view of FIG. 10, the cam followers 122 respectively engaged with the corresponding cam follower rails 121 are provided at both ends of the X-axis arm 122.
A is attached. 10, the two-channel transfer suction head 124 includes two suction pads 124A, two air cylinders 124B,
Z-axis pulse motor 124C and Y-axis pulse motor 124
D. And two suction pads 124A
The pitch can be changed in the X-axis direction along the linear way 124E by the operation of the air cylinder 124B. The two suction pads 124A are moved in the Z-axis direction by the operation of the Z-axis pulse motor 124C, that is,
It is movable up and down. The two suction pads 124A are movable in the Y-axis direction by the operation of the Y-axis pulse motor 124D.

FIG. 11 is a view showing transfer transfers 120 and 130 and alignment stages 160 and 170.
FIG. 7 is a schematic diagram for explaining the operation of the DC test stages 180 and 190 and the insertion / extraction head 70,
In this figure, it is shown in relation to the transfer transfer 130 on the left side. The operation related to the transfer transfer 120 on the right side is substantially the same operation except that it is symmetrical with respect to the left and right, so the description is omitted. The related operation will be described with reference to FIG. 11. First, in the case of the insertion mode, the transfer transfer suction head 134 transfers the semiconductor device to the alignment stage 170 as described above. The alignment stage 170 and the DC test stage 171 are linked and slide in the (+) direction. Accordingly, the alignment stage on which the semiconductor device is mounted comes to a position below the DC work holder 172. Then, the DC work retainer 172 moves down, sucks the semiconductor device on the alignment stage 170, and moves up after sucking. Next, the alignment stage 170 and the DC test stage 171 slide in the (-) direction. The DC work holder 172 is lowered, and the DC test is performed by the DC tester head 190. After the DC test is completed, the device is released from the suction, and the device is transferred to the DC test stage 171. The alignment stage 170 and the DC test stage slide in the (+) direction. At this time, before the slide, the alignment stage 170
The transfer transfer suction head 134 transfers the next semiconductor device. The DC test stage 171 on which the semiconductor device subjected to the DC test is mounted is mounted on the insertion / removal suction head 7 controlled by the horizontal articulated robot 70.
0, the insertion / removal suction head 70
Sucks the semiconductor device on the DC test stage 171 and inserts it into the corresponding socket of the burn-in board 10 fixed to the board transfer unit 60. Thereafter, by repeating such operations, the semiconductor devices are successively DC-connected.
It can be tested and inserted into the burn-in board socket. In the case of the removal mode, the semiconductor devices removed from the burn-in board by the operation opposite to the above-described operation are sorted and stored in the trays 140 to 145 and 150 to 155 according to the test results by the transfer transfer. Can be. However, in the removal mode, D
No C test is performed.

Next, as an example of the overall operation of the burn-in board loader / unloader of the present invention having the above-described structure and operating, a case where semiconductor devices are classified into six in the removal mode will be described together.
This apparatus is a network in which a profit (test burn-in apparatus) by the present applicant or the like is networked, semiconductor devices are extracted, and classified into six classes according to the grades based on the test results and stored in a storage tray. As illustrated in FIG. 1, the storage trays include left and right supply and storage tray elevators 140 and 150 (only used as storage trays in the removal mode) for storing semiconductor devices as non-defective products (passes), and NG of test results. Left and right storage trays 141 and 151 for storing level 1 semiconductor devices, left and right storage trays 142 and 152 for storing test result NG level 2 semiconductor devices, and right and left storage trays for storing NG level 3 semiconductor devices as test results. Storage tray 143
And 153, left and right storage trays 144 and 154 for storing test result NG level 4 semiconductor devices, and left and right storage trays 145 and 155 for storing test result NG level 5 semiconductor devices.

After the burn-in board 10 has been tested by the test burn-in apparatus, the burn-in board 10 operates as shown in FIG.
As shown in FIG. 7, it is assumed that the board transfer unit 60 is fixedly disposed at the removal position. At this time, the entire socket of the burn-in board is opened by the operation of the socket opening / closing device 200. Such a socket opening and closing device 200
Is particularly high in the following cases.

That is, a BGA is included in a semiconductor device.
(Ball Grid Array) There is a device,
This device has a solder ball (φ0.3-0.
5) is mounted, and there is a possibility that the solder ball may fall during insertion and removal. In order to recognize such a solder ball, the inside of the socket must be confirmed by image processing. When the socket is closed, the dropped solder ball cannot be confirmed. Therefore, a device for opening the socket is required. In the case of the insertion mode to be described later, since there is no device in the socket, the solder ball in the socket is detected by the image processing camera 80 before a virgin device (untested product) is inserted. If a solder ball is detected, that socket can be skipped and inserted into the next socket. In the case of the removal mode described below, after removing the device in the socket, the image processing camera 80 checks whether the solder ball of the device has fallen. If it has fallen, a command is issued to store the device in the NG tray.

The horizontal articulated robot 9 according to a control command input by a touch panel or an operation switch
0 controls the insertion / extraction head 70 to control the board transfer unit 6
Burn-in board 10 fixed in place by 0
The semiconductor devices that have been tested are sequentially extracted from the open sockets, and the extracted semiconductor devices are placed on a DC test stage 161 linked with the right alignment stage 160 and a DC test stage 171 linked with the left alignment stage 170. Transfers alternately.

At the same time, the right transfer transfer 12
0 and the left-side transfer 130 are used to transfer the semiconductor devices transferred onto the corresponding DC test stages 161 and 171, respectively, using two 2-channel transfer transfer suction heads 124 and 134.
Each storage tray 14 according to the test result of each semiconductor device
Carry from 0 to 145 and 150 to 155 and classify them into 6 categories. Such an operation is repeated until all the semiconductor devices are removed from the socket on the burn-in board 10.

At this time, if the image processing camera 80 detects that a solder ball or the like has fallen into the socket from which the semiconductor device has been removed, the test result indicates that the semiconductor device is a pass (good product). , The semiconductor device is classified and stored as NG (defective product).

In this embodiment, the insertion / extraction head 7
0 is one channel, and the transfer transfer suction head is provided with two channels on the left and right. Generally, the moving operation speed of the insertion / extraction head 70 by the horizontal articulated robot 90 can be extremely high. On the other hand, the moving operation speed of the suction heads 124 and 134 by the transfer transfer cannot be so high. However, the present invention is not limited to this, and the insertion / extraction head can have multiple channels. In addition, if the speed may be low, an orthogonal robot can be used instead of the horizontal articulated robot.

Next, the insertion mode will be described. In the case of the insertion mode, the left and right supply and storage tray elevators 140 and 150 are used only as supply trays. As the storage tray, only the left and right one-sided storage trays 145 and 155 are DC tested NG.
Used as a device storage tray. At the start of the insertion mode, the empty (no semiconductor device is inserted into the socket) burn-in board 10 is fixed at a predetermined position by the board transfer unit 60, and the burn-in board 10 is operated by the operation of the socket opening / closing device 200.
Sockets are completely open.

Before inserting an untested semiconductor device into the socket of the burn-in board 10 for testing in a test burn-in apparatus, a preliminary check is performed on the O / S (open-short) of the semiconductor device.
A DC test including a test is performed to remove a defective (NG) device. The suction heads 124 and 13 of the left and right transfer transfers 120 and 130, two each of the top tray devices of the supply and storage tray elevators 140 and 150 used as the supply tray elevator.
4. Left and right alignment stages 160 and 170
Are transferred to above by the operation described above. The devices transferred to the respective alignment stages are subjected to DC tests one after another by the left and right DC tester heads 180 and 190 by the above-described operation. Thus D
The semiconductor device subjected to the C test is placed on the DC test stages 1561 and 171 slid inward by the operation described above, and is sucked by the insertion / extraction head 70 under the control of the horizontal articulated robot 90. It is in the position to be.

In the DC test including the O / S by the DC tester, only failing devices are mounted in the sockets 12 of the burn-in board 10 so that a row failure (during each row of the Y row of the board socket) occurs during the burn-in. The purpose is to reduce block failures (determined that both the X and Y rows are defective) and block failures. Of course, the primary purpose is to remove NG (defective) devices before burn-in.

After the DC test, the NG devices are connected to the suction heads 124 and 13 of the corresponding right and left transfer transfers.
4, each corresponding alternate tray 145 and 15
5 is stored.

The horizontal articulated robot 90 picks up the semiconductor device, which is placed on the DC test stages 161 and 171, as a result of the DC test as a non-defective product alternately left and right to the corresponding socket of the burn-in board 10. The operation of the insertion / extraction head 70 is controlled so that the insertion is performed one after another.

In this case, the horizontal articulated robot 9
0 controls the movement of the insertion / extraction head 70 so that the suction pad 73 of the insertion / extraction head 70 can adsorb the center of the semiconductor device by viewing the center of the semiconductor device on the DC test stage with the image processing camera 80. I do. At this time, the image processing camera 80 sends an image such that the suction positional relationship between the suction pad 73 and the semiconductor device can be obtained by image processing to an appropriate image processing system. The image processing system detects a shift between the suction center of the suction pad and the center of the semiconductor device, and a tilt θ of the semiconductor device with respect to the suction center of the suction pad (an angle shift of the semiconductor device from a reference angle position in a horizontal plane). I do. In order to enable this, the positional relationship between the image processing camera and the insertion / extraction head is corrected in advance.

Then, the horizontal articulated robot 90 performs control such that the insertion / extraction head 70 is moved onto the burn-in board 10 while the semiconductor device is being sucked.
Then, the semiconductor device is inserted into the corresponding socket of the burn-in board 10 by the insertion / removal head 70. At this time, the corresponding socket is viewed by the image processing camera 80, and the image processing system uses the corresponding socket. The center and the inclination θ (angle deviation of the socket from the reference angle position in the horizontal plane) are detected. The horizontal articulated robot 90 determines whether the semiconductor device is in accordance with the detection information of the center shift and the inclination θ of the semiconductor device adsorbed to the insertion / extraction head 70 from the image processing system as described above and the detection information of the center and the inclination θ of the socket. The insertion / extraction head 70 is controlled so as to be successfully inserted into the socket. That is, by moving the insertion / extraction head to a position where the center of the semiconductor device matches the center of the socket and rotating the Z axis 94, the inclination θ of the semiconductor device and the inclination θ of the socket are corrected. Such turning control of the Z axis 94 is performed by a servomotor or the like built in the robot 90. In the case where the insertion / extraction head 70 has a plurality of channels, the same θ correction can be performed by providing each suction head with a function like a pistol revolver.

Further, from this state, the insertion / extraction head 7 is actually
Before inserting the semiconductor device into the socket at 0, as described above, the presence or absence of a solder ball or the like in the socket is detected by looking inside the open socket of the image processing camera 80. If a solder ball is detected, control is performed to skip that socket and insert it into the next socket.

Since one image processing camera 80 is used and the center of the semiconductor device to be attracted and the inclination θ are individually measured, the calibration is performed by one image processing camera, and the inclination of the device unit related to the present apparatus is measured. It is necessary to detect θ and teach each necessary position. The measurement by the image processing camera may be a method of measuring all sockets of the entire board at once when the burn-in board is replaced.

After the semiconductor device is inserted into all of the good sockets of the burn-in board 10 fixed to the board transfer unit 60 by repeating such an operation, the burn-in board 10 is operated in the reverse of the above-described manner.
Is transferred to a carrier rack in a carrier rack elevator 50 and is tested by a test burn-in device.

The description has been given of the case where only the removal classification and storage work of the semiconductor device is performed in the removal mode, and the case where only the semiconductor device insertion work is performed by using the same loader / unloader device in the insertion mode. However, using the same loader / unloader device in the insertion / extraction mode, removing and classifying the tested semiconductor device from the burn-in board and storing it, and inserting the untested semiconductor device into the socket after the removal. Can also be performed in parallel. In such an insertion / extraction mode, the storage-side alignment stage first automatically teaches. Each time the test socket is inserted, the test socket looks at the center of the semiconductor device and sucks. Since the alignment stage and the semiconductor device have play (gap) of the positioning gap and the semiconductor device is moving,
The center of the socket is measured at the time of removal. Part 1
Insert with data before tact.

[0064]

According to the present invention, the structure of the apparatus is simple, and it can be inexpensive.

The same apparatus can be used in the removal mode, the insertion mode, and the insertion / extraction mode, and has flexibility.

Since it is not necessary to provide a large number of image processing cameras, the image processing system can be simplified and the price can be reduced in that respect.

The use of the horizontal articulated robot makes it easy to detect the center and inclination θ of the semiconductor device and the center and inclination θ of the burn-in board socket, thereby facilitating accurate control of the insertion / extraction head and preventing failure during insertion. can do.

When the transfer is of a double-sided support type, the position of the suction head can be controlled more accurately.

By using the socket opening / closing device, the inside of the socket of the burn-in board can be detected, and the defect of the socket and the defect of the removed semiconductor device can be known.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a burn-in board loader / unloader device as one embodiment of the present invention.

FIG. 2 is a schematic front view of the burn-in board loader / unloader device of FIG. 1;

FIG. 3 is a schematic rear view of the burn-in board loader / unloader device of FIG. 1;

FIG. 4 is a partial view for explaining the relationship between the horizontal articulated robot of the apparatus of FIG. 1, the insertion / extraction head, and the image processing camera.

FIG. 5 is a plan view of the camera mounting bracket shown in FIG. 4;

FIG. 6 is a diagram showing a detailed structure of an insertion / extraction head mounting bracket and an insertion / extraction head shown in FIG. 4;

FIG. 7 is a plan view showing details of a socket opening / closing device in the device of FIG. 1;

8 is a partial cross-sectional view for explaining the structure and operation of the socket opening / closing device shown in FIG.

FIG. 9 is a plan view showing a transfer transfer in the apparatus of FIG. 1;

FIG. 10 is a front view of the transfer transfer of FIG. 9;

FIG. 11 is a schematic diagram for explaining related operations of a transfer transfer suction head, an alignment stage, and an insertion / removal suction head in the apparatus of FIG. 1;

[Explanation of symbols]

 Reference Signs List 10 Burn-in board 12 Socket 60 Board transfer unit 70 Insertion / extraction head 80 Image processing camera 90 Horizontal articulated robot 100 Empty tray transfer 110 Empty tray elevator 120 Right transfer transfer 124 Suction head 130 Left transfer transfer 134 Suction head 140 Right supply and storage Tray elevators 141-145 Single storage tray 150 Left supply and storage tray elevator 151-155 Single storage tray 160 Right alignment stage 170 Left alignment stage 180 Right DC tester 190 Left DC tester 200 Socket opening and closing device

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroyuki Kaneko 2-9-2 Ikuta, Tama-ku, Kawasaki City, Kanagawa Prefecture Within Nihon Engineering Co., Ltd. (72) Inventor Hiroharu Narusawa 47-1 Atobe, Saku City, Nagano Prefecture Kusugaru Building 1F Japan Engineering Co., Ltd. Asama Research Center F-term (reference) 2G003 AC01 AD02 AG01 AG08 AG11 AG14 AH01 AH04 AH06 4M106 AA04 CA56 CA60 DH02

Claims (9)

[Claims] 1. A loader-unloader for inserting and removing a semiconductor device from a socket of a burn-in board, a board transfer unit for transferring the burn-in board to a predetermined position, and the predetermined position by the board transfer unit. Inserting / extracting means for inserting / extracting a semiconductor device from / to the burn-in board provided to the semiconductor device, mounting means for mounting the removed semiconductor device or the semiconductor device to be inserted, and the removed semiconductor device Or tray means for storing a semiconductor device to be inserted, and transfer transfer means for transferring the semiconductor device between the placing means and the tray means, and in the removal mode, the insertion / extraction means Performs only the withdrawal function, and the tray means includes a sorting storage tray. The loading / unloading device for a burn-in board is characterized in that, in the insertion mode, the insertion / extraction means performs only an insertion function, and the tray means is used as a supply tray. 2. The apparatus according to claim 1, wherein the placing means, the transfer transfer means and the tray means are provided as a pair of left and right,
2. The insertion / extraction unit according to claim 1, further comprising an insertion / extraction head controlled by a horizontal articulated robot, wherein the insertion / extraction head is controlled to be moved alternately with respect to the left and right mounting units. Loader / unloader for burn-in board. 3. An operation in an insertion / extraction mode by using one of the left and right mounting means, the left and right transfer transfer means and the left and right tray means for removal / sorting storage and the other for supply. 3. The loader / unloader device for a burn-in board according to claim 2, wherein the loader / unloader device is configured to perform the operation. 4. The loader / unloader for a burn-in board according to claim 1, wherein said transfer transfer means comprises a moving arm supported at both ends, and a suction head movably hung on said moving arm. apparatus. 5. A loader / unloader for inserting and removing a semiconductor device from a socket of a burn-in board, a board transfer unit for transferring the burn-in board to a predetermined position, and the predetermined position by the board transfer unit. And an image processing system for detecting the position of the socket of the burn-in board and the position of the semiconductor device inserted and removed by the insertion and removal means. A loader / unloader device for a burn-in board, wherein the image processing system includes an image processing camera which is moved in association with the insertion / extraction means. 6. The insertion / extraction unit includes an insertion / extraction head controlled by a horizontal articulated robot, and the image processing camera is arranged near the insertion / extraction head so as to be controlled by the horizontal articulated robot. A loader / unloader device for a burn-in board according to claim 5. 7. The insertion / extraction head is mounted on an axis of the horizontal articulated robot that is controlled to rotate, and the image processing camera is controlled to move together with the insertion / extraction head by the horizontal articulated robot. 7. The burn-in board loader / unloader according to claim 6, wherein the loader / unloader is disposed at a fixed position with respect to the insertion / extraction head. 8. A board opening / closing device is arranged in association with the board transport unit. When the socket of the burn-in board is opened by the socket opening / closing device, the image processing camera is in a state in the socket. 8. The loader / unloader device for a burn-in board according to claim 5, which is capable of detecting an error. 9. The image processing camera can detect the center and the inclination θ of the semiconductor device and the center and the inclination θ of the corresponding socket of the burn-in board, and the insertion / extraction head can detect the center and the inclination θ based on the detection information of the center and the inclination θ. 9. The loader / unloader device for a burn-in board according to claim 7, wherein movement and turning control are performed.