JPS5939993U - Heat dissipation structure of printed circuit board - Google Patents
Heat dissipation structure of printed circuit boardInfo
- Publication number
- JPS5939993U JPS5939993U JP13632882U JP13632882U JPS5939993U JP S5939993 U JPS5939993 U JP S5939993U JP 13632882 U JP13632882 U JP 13632882U JP 13632882 U JP13632882 U JP 13632882U JP S5939993 U JPS5939993 U JP S5939993U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat dissipation
- dissipation structure
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板回路の放熱装置を示す平面
図、第２図は第１図のＡ−Ａ断面図、第３図は本考案の
プリント基板回路の放熱装置を示す平面図、第４図は第
３図のＢ−Ｂ断面図、第５図は従来の装置と本案の装置
との熱抵抗の比較を示すグラフである。
１・・・・・・プリント基板、２−１． ２−２・・・
・・・ＩＣ等の部品、３・・・・・・放熱器、３ａ〜３
ｆ・・・・・・リード線用穴、３ｐ〜３Ｓ・・・・・・
放熱部、４・・・・・・支柱、５・・・・・・ねじ、６
・・・・・・リード線の突出部。FIG. 1 is a plan view showing a conventional heat dissipation device for a printed circuit board circuit, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 4 is a sectional view taken along line BB in FIG. 3, and FIG. 5 is a graph showing a comparison of thermal resistance between the conventional device and the device of the present invention. 1... Printed circuit board, 2-1. 2-2...
...Parts such as IC, 3... Heat sink, 3a-3
f...Hole for lead wire, 3P~3S...
Heat dissipation part, 4... Support, 5... Screw, 6
...Protruding part of the lead wire.
Claims (1)
リント回路基板上に取付けられた取付高の略等しい複数
の発熱電気部品と、これら複数の電気部品の各々の上面
と接触して、これを一体に覆う良熱伝導性の部材とを備
えたプリント回路基板の放熱構造。A printed circuit board on which an electric circuit is formed, a plurality of heat-generating electrical components mounted on the printed circuit board with approximately equal mounting heights, and a plurality of heat-generating electrical components mounted on the printed circuit board, and the upper surface of each of the plurality of electrical components is contacted to unite them. A heat dissipation structure for a printed circuit board that includes a material with good thermal conductivity and a covering material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13632882U JPS5939993U (en) | 1982-09-06 | 1982-09-06 | Heat dissipation structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13632882U JPS5939993U (en) | 1982-09-06 | 1982-09-06 | Heat dissipation structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5939993U true JPS5939993U (en) | 1984-03-14 |
Family
ID=30306572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13632882U Pending JPS5939993U (en) | 1982-09-06 | 1982-09-06 | Heat dissipation structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5939993U (en) |
-
1982
- 1982-09-06 JP JP13632882U patent/JPS5939993U/en active Pending
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