JPS6130252U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6130252U
JPS6130252U JP1984113184U JP11318484U JPS6130252U JP S6130252 U JPS6130252 U JP S6130252U JP 1984113184 U JP1984113184 U JP 1984113184U JP 11318484 U JP11318484 U JP 11318484U JP S6130252 U JPS6130252 U JP S6130252U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
heat sink
solder
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984113184U
Other languages
Japanese (ja)
Inventor
和典 高島
貴久雄 磯山
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984113184U priority Critical patent/JPS6130252U/en
Publication of JPS6130252U publication Critical patent/JPS6130252U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第１図Ａイ，口は本考案の半導体装置の一実施例を説明
する断面図および上面図、第１図Ｂは本考案の他の実施
例を説明する上面図、第２図および第３図は従来の半導
体装置を説明する断面図である。 １１は固着基板、１２はヒートシンク、１３はパワー半
導体素子、１４は半田層、１５は凹部である。[BRIEF DESCRIPTION OF THE DRAWINGS] Figure 1A is a cross-sectional view and top view illustrating one embodiment of the semiconductor device of the present invention, and Figure 1B is a top view illustrating another embodiment of the present invention. , FIG. 2, and FIG. 3 are cross-sectional views illustrating a conventional semiconductor device. 11 is a fixed substrate, 12 is a heat sink, 13 is a power semiconductor element, 14 is a solder layer, and 15 is a recessed portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固着基板上に熱伝導性良好なヒートシンクを介して共ワ
ー半導体素子を半田で固着する半導体装置に於いて、前
記ヒートシンクのパワー半導体素子の四角に対応する部
分に対角線上に延在された細長い凹部を設け半田の厚み
を他より厚く形成することを特徴とする半導体装置。In a semiconductor device in which a power semiconductor element is fixed by solder to a fixed substrate via a heat sink having good thermal conductivity, an elongated recess extending diagonally in a portion of the heat sink corresponding to a square of the power semiconductor element. What is claimed is: 1. A semiconductor device characterized in that the thickness of the solder is formed thicker than that of other solders.
JP1984113184U 1984-07-25 1984-07-25 semiconductor equipment Pending JPS6130252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984113184U JPS6130252U (en) 1984-07-25 1984-07-25 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984113184U JPS6130252U (en) 1984-07-25 1984-07-25 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6130252U true JPS6130252U (en) 1986-02-24

Family

ID=30672218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984113184U Pending JPS6130252U (en) 1984-07-25 1984-07-25 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6130252U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150040A (en) * 2005-11-29 2007-06-14 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150040A (en) * 2005-11-29 2007-06-14 Mitsubishi Electric Corp Semiconductor device

Similar Documents

Publication Publication Date Title
JPS6130252U (en) semiconductor equipment
JPS60163738U (en) semiconductor equipment
JPS60163740U (en) semiconductor equipment
JPS60174244U (en) hybrid integrated circuit
JPS60163739U (en) semiconductor equipment
JPS61134039U (en)
JPS6037248U (en) hybrid integrated circuit
JPS5889946U (en) semiconductor equipment
JPS61207038U (en)
JPS59101391U (en) panel heater
JPS5929048U (en) Heatsink mounting structure for semiconductor components
JPS5944052U (en) semiconductor equipment
JPS6022843U (en) semiconductor equipment
JPS60127933U (en) thermal head
JPH01146548U (en)
JPS61102039U (en)
JPS587337U (en) Hybrid integrated circuit device
JPS5857030U (en) Heat conductive insulation sheet
JPS5937742U (en) Heat dissipation structure
JPS59192850U (en) semiconductor equipment
JPS58158446U (en) heat dissipation device
JPS58195435U (en) semiconductor equipment
JPS6018549U (en) IC pellet
JPS60103860U (en) semiconductor laser equipment
JPS59146960U (en) hybrid integrated circuit