JPS6037248U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS6037248U
JPS6037248U JP12808783U JP12808783U JPS6037248U JP S6037248 U JPS6037248 U JP S6037248U JP 12808783 U JP12808783 U JP 12808783U JP 12808783 U JP12808783 U JP 12808783U JP S6037248 U JPS6037248 U JP S6037248U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
thermally conductive
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12808783U
Other languages
Japanese (ja)
Inventor
塚越　敏夫
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP12808783U priority Critical patent/JPS6037248U/en
Publication of JPS6037248U publication Critical patent/JPS6037248U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の断面図、第２図はその斜視
図、第３図は別の実施例の斜視図、第４図はさらに別の
実施例の斜視図でａは蓋部、ｂは本体部である。 １・・・電力用半導体素子、２・・・セラミック基板、
３・・・熱伝導性グリース層、４・・・放熱板、５，９
・・・押さえ条、６・・・押さえ板。Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a perspective view thereof, Fig. 3 is a perspective view of another embodiment, and Fig. 4 is a perspective view of yet another embodiment. Part b is the main body part. 1... Power semiconductor element, 2... Ceramic substrate,
3... Thermal conductive grease layer, 4... Heat sink, 5, 9
... Pressing strip, 6... Pressing plate.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）表面上に電力用半導体素子を搭載したセラミック
基板の裏面と放熱体の表面との間に熱伝導性グリース層
が介在し、前記基板の表面には弾性を有する押圧体が接
触することを特徴とする混成集積回路。(1) A thermally conductive grease layer is interposed between the back surface of the ceramic substrate on which a power semiconductor element is mounted and the surface of the heat sink, and an elastic pressing body is in contact with the surface of the substrate. A hybrid integrated circuit featuring: （２）実用新案登録請求の範囲第１項記載の回路におい
て、熱伝導性グリースが熱伝導性の大きな金属酸化物を
含んだグリース状シリコーンコンパウンドであることを
特徴とする混成集積回路。(2) Utility Model Registration The hybrid integrated circuit according to claim 1, wherein the thermally conductive grease is a grease-like silicone compound containing a highly thermally conductive metal oxide.
JP12808783U 1983-08-19 1983-08-19 hybrid integrated circuit Pending JPS6037248U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12808783U JPS6037248U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12808783U JPS6037248U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS6037248U true JPS6037248U (en) 1985-03-14

Family

ID=30290688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12808783U Pending JPS6037248U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS6037248U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115255U (en) * 1988-01-27 1989-08-03
JPH06174349A (en) * 1992-12-04 1994-06-24 Sumitomo Electric Ind Ltd Super conductive magnet device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115255U (en) * 1988-01-27 1989-08-03
JPH06174349A (en) * 1992-12-04 1994-06-24 Sumitomo Electric Ind Ltd Super conductive magnet device

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