JPS59195796U - Electronics - Google Patents
ElectronicsInfo
- Publication number
- JPS59195796U JPS59195796U JP9003883U JP9003883U JPS59195796U JP S59195796 U JPS59195796 U JP S59195796U JP 9003883 U JP9003883 U JP 9003883U JP 9003883 U JP9003883 U JP 9003883U JP S59195796 U JPS59195796 U JP S59195796U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- cooling
- electronic device
- peltier element
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子機器を示す図、第２図はこの考案に
よる電子機器を示す図、第３図はこの考案に使われる電
子機器に使われるモジュールを示す図であり、図中１は
モジュール、２は回路要素、３はモジュール冷却用管路
、４は分岐マニホルド、５は集合マニホルド、６はペル
チェ素子、７はペルチェ素子吸熱面、８はペルチェ素子
放熱面である。なお、図中同一あるいは相当部分には同
−符 −号を付して示しである。FIG. 1 is a diagram showing a conventional electronic device, FIG. 2 is a diagram showing an electronic device according to this invention, and FIG. 3 is a diagram showing a module used in the electronic device used in this invention. In the module, 2 is a circuit element, 3 is a module cooling pipe, 4 is a branch manifold, 5 is a collective manifold, 6 is a Peltier element, 7 is a Peltier element heat absorption surface, and 8 is a Peltier element heat radiation surface. In addition, the same or equivalent parts in the figures are indicated by the same reference numerals.
Claims (1)
けた直方体の筐体から成る複数個のモジュールと、前記
回路を冷却するための冷却管路を備えた電子機器におい
て、前記回路とモジュール内壁との間にペルチェ素子を
挾みこみペルチェ素子の冷却能力を制御することにより
上記回路の温度の変動を抑えると共に個々の回路の間の
温度のバラツキを小さく保つ様に構成した事を特徴とす
る電子機器。In an electronic device comprising a circuit that requires cooling, a plurality of modules each consisting of a rectangular parallelepiped casing in which the circuit is attached to an inner wall surface, and a cooling pipe line for cooling the circuit, the circuit and the inner wall of the module are provided. An electronic device characterized in that a Peltier element is inserted between the circuit and the cooling capacity of the Peltier element to control the temperature fluctuation of the circuit and to keep the temperature variation between individual circuits small. device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9003883U JPS59195796U (en) | 1983-06-13 | 1983-06-13 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9003883U JPS59195796U (en) | 1983-06-13 | 1983-06-13 | Electronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59195796U true JPS59195796U (en) | 1984-12-26 |
Family
ID=30219942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9003883U Pending JPS59195796U (en) | 1983-06-13 | 1983-06-13 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59195796U (en) |
-
1983
- 1983-06-13 JP JP9003883U patent/JPS59195796U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59195796U (en) | Electronics | |
| JPS60103852U (en) | Hybrid integrated circuit device | |
| JPS5994845U (en) | Thermal head heat sink | |
| JPS5898261U (en) | Window glass anti-fog device | |
| JPS587396U (en) | Circuit board for heat generating parts | |
| JPS5869999U (en) | Housing cooling system | |
| JPS60101795U (en) | thick film circuit board | |
| JPS59152793U (en) | Air cooling device for electronic equipment housing | |
| JPS58140644U (en) | Heat dissipation device for semiconductor devices | |
| JPS60141194U (en) | package cooling system | |
| JPS5864955U (en) | Yagura Kotatsu | |
| JPS5993196U (en) | Electronics | |
| JPS6066039U (en) | semiconductor cooling equipment | |
| JPS5878676U (en) | Ceramic wiring device | |
| JPS5916938U (en) | Yagura Kotatsu | |
| JPS6045986U (en) | piping equipment | |
| JPS6099595U (en) | Electronics | |
| JPS58101496U (en) | thermal starter | |
| JPS5895644U (en) | radiator | |
| JPS5832694U (en) | Electronic circuit temperature control device | |
| JPS58196853U (en) | Thermal conduction cooling chip module | |
| JPS59192838U (en) | semiconductor equipment | |
| JPS5974741U (en) | Cooling structure for semiconductor devices | |
| JPS60122947U (en) | Temperature warning display device used in image output device | |
| JPS6022843U (en) | semiconductor equipment |